External Memory Interface Handbook Volume 2: Design Guidelines: For UniPHY-based Device Families
ID
683385
Date
3/06/2023
Public
1. Planning Pin and FPGA Resources
2. DDR2 and DDR3 SDRAM Board Design Guidelines
3. Dual-DIMM DDR2 and DDR3 SDRAM Board Design Guidelines
4. LPDDR2 SDRAM Board Design Guidelines
5. RLDRAM II and RLDRAM 3 Board Design Guidelines
6. QDR II/II+ SRAM Board Design Guidelines
7. Implementing and Parameterizing Memory IP
8. Simulating Memory IP
9. Analyzing Timing of Memory IP
10. Debugging Memory IP
11. Optimizing the Controller
12. PHY Considerations
13. Power Estimation Methods for External Memory Interfaces
1.1.1. Estimating Pin Requirements
1.1.2. DDR, DDR2, and DDR3 SDRAM Clock Signals
1.1.3. DDR, DDR2, and DDR3 SDRAM Command and Address Signals
1.1.4. DDR, DDR2, and DDR3 SDRAM Data, Data Strobes, DM/DBI, and Optional ECC Signals
1.1.5. DDR, DDR2, and DDR3 SDRAM DIMM Options
1.1.6. QDR II and QDR II+ SRAM Clock Signals
1.1.7. QDR II and QDR II+ SRAM Command Signals
1.1.8. QDR II and QDR II+ SRAM Address Signals
1.1.9. QDR II and QDR II+ SRAM Data, BWS, and QVLD Signals
1.1.10. RLDRAM II and RLDRAM 3 Clock Signals
1.1.11. RLDRAM II and RLDRAM 3 Commands and Addresses
1.1.12. RLDRAM II and RLDRAM 3 Data, DM and QVLD Signals
1.1.13. LPDDR2 Clock Signal
1.1.14. LPDDR2 Command and Address Signal
1.1.15. LPDDR2 Data, Data Strobe, and DM Signals
1.1.16. Maximum Number of Interfaces
1.1.17. OCT Support
1.1.16.1. Maximum Number of DDR SDRAM Interfaces Supported per FPGA
1.1.16.2. Maximum Number of DDR2 SDRAM Interfaces Supported per FPGA
1.1.16.3. Maximum Number of DDR3 SDRAM Interfaces Supported per FPGA
1.1.16.4. Maximum Number of QDR II and QDR II+ SRAM Interfaces Supported per FPGA
1.1.16.5. Maximum Number of RLDRAM II Interfaces Supported per FPGA
1.1.16.6. Maximum Number of LPDDR2 SDRAM Interfaces Supported per FPGA
1.2.1. General Pin-out Guidelines for UniPHY-based External Memory Interface IP
1.2.2. Pin-out Rule Exceptions for ×36 Emulated QDR II and QDR II+ SRAM Interfaces in Arria II, Stratix III and Stratix IV Devices
1.2.3. Pin-out Rule Exceptions for RLDRAM II and RLDRAM 3 Interfaces
1.2.4. Pin-out Rule Exceptions for QDR II and QDR II+ SRAM Burst-length-of-two Interfaces
1.2.5. Pin Connection Guidelines Tables
1.2.6. PLLs and Clock Networks
1.2.5.1. DDR3 SDRAM With Leveling Interface Pin Utilization Applicable for Arria V GZ, Stratix III, Stratix IV, and Stratix V Devices
1.2.5.2. QDR II and QDR II+ SRAM Pin Utilization for Arria II, Arria V, Stratix III, Stratix IV, and Stratix V Devices
1.2.5.3. RLDRAM II CIO Pin Utilization for Arria II GZ, Arria V, Stratix III, Stratix IV, and Stratix V Devices
1.2.5.4. LPDDR2 Pin Utilization for Arria V, Cyclone V, and MAX 10 FPGA Devices
1.2.5.5. Additional Guidelines for Arria V GZ and Stratix V Devices
1.2.5.6. Additional Guidelines for Arria V ( Except Arria V GZ) Devices
1.2.5.7. Additional Guidelines for MAX 10 Devices
1.2.5.8. Additional Guidelines for Cyclone V Devices
1.2.6.1. Number of PLLs Available in Intel® Device Families
1.2.6.2. Number of Enhanced PLL Clock Outputs and Dedicated Clock Outputs Available in Intel® Device Families
1.2.6.3. Number of Clock Networks Available in Intel® Device Families
1.2.6.4. Clock Network Usage in UniPHY-based Memory Interfaces—DDR2 and DDR3 SDRAM (1) (2)
1.2.6.5. Clock Network Usage in UniPHY-based Memory Interfaces—RLDRAM II, and QDR II and QDR II+ SRAM
1.2.6.6. PLL Usage for DDR, DDR2, and DDR3 SDRAM Without Leveling Interfaces
1.2.6.7. PLL Usage for DDR3 SDRAM With Leveling Interfaces
2.1. Leveling and Dynamic Termination
2.2. DDR2 Terminations and Guidelines
2.3. DDR3 Terminations in Arria V, Cyclone V, Stratix III, Stratix IV, and Stratix V
2.4. Layout Approach
2.5. Channel Signal Integrity Measurement
2.6. Design Layout Guidelines
2.7. Package Deskew
2.8. Document Revision History
3.2.1. Overview of ODT Control
3.2.2. DIMM Configuration
3.2.3. Dual-DIMM Memory Interface with Slot 1 Populated
3.2.4. Dual-DIMM with Slot 2 Populated
3.2.5. Dual-DIMM Memory Interface with Both Slot 1 and Slot 2 Populated
3.2.6. Dual-DIMM DDR2 Clock, Address, and Command Termination and Topology
3.2.7. Control Group Signals
3.2.8. Clock Group Signals
7.2.1.1. DDR2 SDRAM Controller with UniPHY Intel FPGA IP Interfaces
7.2.1.2. DDR3 SDRAM Controller with UniPHY Intel FPGA IP Interfaces
7.2.1.3. LPDDR2 SDRAM Controller with UniPHY Intel FPGA IP Interfaces
7.2.1.4. QDR II and QDR II+ SRAM Controller with UniPHY Intel FPGA IP Interfaces
7.2.1.5. RLDRAM II Controller with UniPHY Intel FPGA IP Interfaces
7.2.1.6. RLDRAM 3 UniPHY Intel FPGA IP Interface
7.2.3.1. PHY Settings for UniPHY IP
7.2.3.2. Memory Parameters for LPDDR2, DDR2 and DDR3 SDRAM Controller with UniPHY Intel FPGA IP
7.2.3.3. Memory Parameters for QDR II and QDR II+ SRAM Controller with UniPHY Intel FPGA IP
7.2.3.4. Memory Parameters for RLDRAM II Controller with UniPHY Intel FPGA IP
7.2.3.5. Memory Timing Parameters for DDR2, DDR3, and LPDDR2 SDRAM Controller with UniPHY Intel FPGA IP
7.2.3.6. Memory Timing Parameters for QDR II and QDR II+ SRAM Controller with UniPHY Intel FPGA IP
7.2.3.7. Memory Timing Parameters for RLDRAM II Controller with UniPHY Intel FPGA IP
7.2.3.8. Memory Parameters for RLDRAM 3 UniPHY Intel FPGA IP
8.2.1. Simulation Scripts
8.2.2. Preparing the Vendor Memory Model
8.2.3. Functional Simulation with Verilog HDL
8.2.4. Functional Simulation with VHDL
8.2.5. Simulating the Example Design
8.2.6. UniPHY Abstract PHY Simulation
8.2.7. PHY-Only Simulation
8.2.8. Post-fit Functional Simulation
8.2.9. Simulation Issues
9.1. Memory Interface Timing Components
9.2. FPGA Timing Paths
9.3. Timing Constraint and Report Files for UniPHY IP
9.4. Timing Analysis Description
9.5. Timing Report DDR
9.6. Report SDC
9.7. Calibration Effect in Timing Analysis
9.8. Timing Model Assumptions and Design Rules
9.9. Common Timing Closure Issues
9.10. Optimizing Timing
9.11. Timing Deration Methodology for Multiple Chip Select DDR2 and DDR3 SDRAM Designs
9.12. Performing I/O Timing Analysis
9.13. Document Revision History
9.4.1.1. Address and Command
9.4.1.2. PHY or Core
9.4.1.3. PHY or Core Reset
9.4.1.4. Read Capture and Write
9.4.1.5. Read Resynchronization
9.4.1.6. DQS versus CK—Arria II GX and Cyclone IV Devices
9.4.1.7. Write Leveling tDQSS
9.4.1.8. Write Leveling tDSH/tDSS
9.4.1.9. DK versus CK (RLDRAM II with UniPHY)
9.4.1.10. Bus Turnaround Time
9.9.1. Missing Timing Margin Report
9.9.2. Incomplete Timing Margin Report
9.9.3. Read Capture Timing
9.9.4. Write Timing
9.9.5. Address and Command Timing
9.9.6. PHY Reset Recovery and Removal
9.9.7. Clock-to-Strobe (for DDR and DDR2 SDRAM Only)
9.9.8. Read Resynchronization and Write Leveling Timing (for SDRAM Only)
10.1. Resource and Planning Issues
10.2. Interface Configuration Performance Issues
10.3. Functional Issue Evaluation
10.4. Timing Issue Characteristics
10.5. Verifying Memory IP Using the Signal Tap II Logic Analyzer
10.6. Hardware Debugging Guidelines
10.7. Categorizing Hardware Issues
10.8. EMIF Debug Toolkit Overview
10.9. Document Revision History
10.3.1. Correct Combination of the Quartus Prime Software and ModelSim* - Intel® FPGA Edition Device Models
10.3.2. Intel® IP Memory Model
10.3.3. Vendor Memory Model
10.3.4. Insufficient Memory in Your PC
10.3.5. Transcript Window Messages
10.3.6. Passing Simulation
10.3.7. Modifying the Example Driver to Replicate the Failure
10.6.1. Create a Simplified Design that Demonstrates the Same Issue
10.6.2. Measure Power Distribution Network
10.6.3. Measure Signal Integrity and Setup and Hold Margin
10.6.4. Vary Voltage
10.6.5. Use Freezer Spray and Heat Gun
10.6.6. Operate at a Lower Speed
10.6.7. Determine Whether the Issue Exists in Previous Versions of Software
10.6.8. Determine Whether the Issue Exists in the Current Version of Software
10.6.9. Try A Different PCB
10.6.10. Try Other Configurations
10.6.11. Debugging Checklist
11.2.1. DDR2 SDRAM Controller
11.2.2. Auto-Precharge Commands
11.2.3. Additive Latency
11.2.4. Bank Interleaving
11.2.5. Command Queue Look-Ahead Depth
11.2.6. Additive Latency and Bank Interleaving
11.2.7. User-Controlled Refresh
11.2.8. Frequency of Operation
11.2.9. Burst Length
11.2.10. Series of Reads or Writes
11.2.11. Data Reordering
11.2.12. Starvation Control
11.2.13. Command Reordering
11.2.14. Bandwidth
11.2.15. Efficiency Monitor
10.7.1.2.7. OCT and ODT Usage
Modern external memory interface designs typically use OCT for the FPGA end of the line, and ODT for the memory component end of the line. If either the OCT or ODT are incorrectly configured or enabled, signal integrity problems occur.
If the design uses OCT, RUP or RDN pins must be placed correctly for the OCT to work. If you do not place these pins, the Intel® Quartus® Prime software allocates them automatically with the following warning:
Warning: No exact pin location assignment(s) for 2 pins of 110 total pins Info: Pin termination_blk0~_rup_pad not assigned to an exact location on the device Info: Pin termination_blk0~_rdn_pad not assigned to an exact location on the device
If you see these warnings, the RUP and RDN pins may have been allocated to a pin that does not have the required external resistor present on the board. This allocation renders the OCT circuit faulty, resulting in unreliable calibration and or interface behavior. The pins with the required external resistor must be specified in the Intel® Quartus® Prime software.
For the FPGA, ensure that you perform the following:
- Specify the RUP and RDN pins in either the projects HDL port list, or in the assignment editor (termination_blk0~_rup_pad/ termination_blk0~_rdn_pad).
- Connect the RUP and RDN pins to the correct resistors and pull-up and pull-down voltage in the schematic or PCB.
- Contain the RUP and RDN pins within a bank of the device that is operating at the same VCCIO voltage as the interface that is terminated.
- Check that only the expected number of RUP and RDN pins exists in the project pin-out file. Look for Info: Created on-chip termination messages at the fitter stage for any calibration blocks not expected in your design.
- Review the Fitter Pin-Out file for RUP and RDN pins to ensure that they are on the correct pins, and that only the correct number of calibration blocks exists in your design.
- Check in the fitter report that the input, output, and bidirectional signals with calibrated OCT all have the termination control block applicable to the associated RUP and RDN pins.
For the memory components, ensure that you perform the following:
- Connect the required resistor to the correct pin on each and every component, and ensure that it is pulled to the correct voltage.
- Place the required resistor close to the memory component.
- Correctly configure the IP to enable the desired termination at initialization time.
- Check that the speed grade of memory component supports the selected ODT setting.
- Check that the second source part that may have been fitted to the PCB, supports the same ODT settings as the original