External Memory Interface Handbook Volume 2: Design Guidelines

Download
ID 683385
Date 5/08/2017
Public
Document Table of Contents

4.2.3.5. Package Migration

Package delays can be different for the same pin in different packages. If you want to use multiple migratable packages in your system, you should compensate for package skew as described in this topic. The information in this topic applies to Arria 10, Stratix V, and Stratix 10 devices.

Assume two migratable packages, device A and device B, and that you want to compensate for the board trace lengths for device A. Follow these steps:

  1. Compile your design for device A, with the Package Skew option enabled.
  2. Note the skews in the <core_name>.pin file for device A. Deskew these package skews with board trace lengths as described in the preceding examples.
  3. Recompile your design for device A.
  4. For Device B open the parameter editor and deselect Package Deskew option.
  5. Calculate board skew parameters only taking into account the board traces for Device B and enter that value into the parameter editor for Device B.

  6. Regenerate the IP and recompile the design for Device B.
  7. Verify that timing requirements are met for both device A and device B.

Did you find the information on this page useful?

Characters remaining:

Feedback Message