External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide

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ID 683741
Date 3/11/2022
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Document Table of Contents
Document Table of Contents x
1. Release Information 2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction 3. Intel® Stratix® 10 EMIF IP Product Architecture 4. Intel® Stratix® 10 EMIF IP End-User Signals 5. Intel® Stratix® 10 EMIF – Simulating Memory IP 6. Intel® Stratix® 10 EMIF IP for DDR3 7. Intel® Stratix® 10 EMIF IP for DDR4 8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme 9. Intel® Stratix® 10 EMIF IP for QDR-IV 10. Intel® Stratix® 10 EMIF IP for RLDRAM 3 11. Intel® Stratix® 10 EMIF IP Timing Closure 12. Optimizing Controller Performance 13. Intel® Stratix® 10 EMIF IP Debugging 14. External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide Archives 15. Document Revision History for External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide
2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction x
2.1. Intel® Stratix® 10 EMIF IP Design Flow 2.2. Intel® Stratix® 10 EMIF IP Design Checklist
3. Intel® Stratix® 10 EMIF IP Product Architecture x
3.1. Intel® Stratix® 10 EMIF Architecture: Introduction 3.2. Intel® Stratix® 10 EMIF Sequencer 3.3. Intel® Stratix® 10 EMIF Calibration 3.4. Intel Stratix 10 EMIF IP Controller 3.5. Hardware Resource Sharing Among Multiple Intel® Stratix® 10 EMIFs 3.6. User-requested Reset in Intel® Stratix® 10 EMIF IP 3.7. Intel® Stratix® 10 EMIF for Hard Processor Subsystem 3.8. Intel® Stratix® 10 EMIF Ping Pong PHY
3.1. Intel® Stratix® 10 EMIF Architecture: Introduction x
3.1.1. Intel® Stratix® 10 EMIF Architecture: I/O Subsystem 3.1.2. Intel® Stratix® 10 EMIF Architecture: I/O Column 3.1.3. Intel® Stratix® 10 EMIF Architecture: I/O SSM 3.1.4. Intel® Stratix® 10 EMIF Architecture: I/O Bank 3.1.5. Intel® Stratix® 10 EMIF Architecture: I/O Lane 3.1.6. Intel® Stratix® 10 EMIF Architecture: Input DQS Clock Tree 3.1.7. Intel® Stratix® 10 EMIF Architecture: PHY Clock Tree 3.1.8. Intel® Stratix® 10 EMIF Architecture: PLL Reference Clock Networks 3.1.9. Intel® Stratix® 10 EMIF Architecture: Clock Phase Alignment
3.2. Intel® Stratix® 10 EMIF Sequencer x
3.2.1. Intel® Stratix® 10 EMIF DQS Tracking
3.3. Intel® Stratix® 10 EMIF Calibration x
3.3.1. Intel® Stratix® 10 Calibration Stages 3.3.2. Intel® Stratix® 10 Calibration Stages Descriptions 3.3.3. Intel® Stratix® 10 Calibration Flowchart 3.3.4. Intel® Stratix® 10 Calibration Algorithms
3.4. Intel Stratix 10 EMIF IP Controller x
3.4.1. Hard Memory Controller 3.4.2. Intel® Stratix® 10 Hard Memory Controller Rate Conversion Feature
3.4.1. Hard Memory Controller x
3.4.1.1. Hard Memory Controller Features 3.4.1.2. Hard Memory Controller Main Control Path 3.4.1.3. Data Buffer Controller
3.5. Hardware Resource Sharing Among Multiple Intel® Stratix® 10 EMIFs x
3.5.1. I/O SSM Sharing 3.5.2. I/O Bank Sharing 3.5.3. PLL Reference Clock Sharing 3.5.4. Core Clock Network Sharing
3.7. Intel® Stratix® 10 EMIF for Hard Processor Subsystem x
3.7.1. Restrictions on I/O Bank Usage for Intel® Stratix® 10 EMIF IP with HPS 3.7.2. Using the Legacy EMIF Debug Toolkit with Intel® Stratix® 10 HPS Interfaces 3.7.3. HPS EMIF Simulation
3.8. Intel® Stratix® 10 EMIF Ping Pong PHY x
3.8.1. Intel® Stratix® 10 Ping Pong PHY Feature Description 3.8.2. Intel® Stratix® 10 Ping Pong PHY Architecture 3.8.3. Intel® Stratix® 10 Ping Pong PHY Limitations 3.8.4. Intel® Stratix® 10 Ping Pong PHY Calibration 3.8.5. Using the Ping Pong PHY 3.8.6. Ping Pong PHY Simulation Example Design
4. Intel® Stratix® 10 EMIF IP End-User Signals x
4.1. Interface and Signal Descriptions 4.2. AFI Signals 4.3. AFI 4.0 Timing Diagrams 4.4. Intel® Stratix® 10 Memory Mapped Register (MMR) Tables
4.1. Interface and Signal Descriptions x
4.1.1. Intel Stratix 10 EMIF IP Interfaces for DDR3 4.1.2. Intel Stratix 10 EMIF IP Interfaces for DDR4 4.1.3. Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme 4.1.4. Intel Stratix 10 EMIF IP Interfaces for QDR-IV 4.1.5. Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3
4.1.1. Intel Stratix 10 EMIF IP Interfaces for DDR3 x
4.1.1.1. local_reset_req for DDR3 4.1.1.2. local_reset_status for DDR3 4.1.1.3. pll_ref_clk for DDR3 4.1.1.4. pll_locked for DDR3 4.1.1.5. pll_extra_clk_0 for DDR3 4.1.1.6. pll_extra_clk_1 for DDR3 4.1.1.7. pll_extra_clk_2 for DDR3 4.1.1.8. pll_extra_clk_3 for DDR3 4.1.1.9. oct for DDR3 4.1.1.10. mem for DDR3 4.1.1.11. status for DDR3 4.1.1.12. afi_reset_n for DDR3 4.1.1.13. afi_clk for DDR3 4.1.1.14. afi_half_clk for DDR3 4.1.1.15. afi for DDR3 4.1.1.16. emif_usr_reset_n for DDR3 4.1.1.17. emif_usr_clk for DDR3 4.1.1.18. emif_usr_reset_n_sec for DDR3 4.1.1.19. emif_usr_clk_sec for DDR3 4.1.1.20. cal_debug_reset_n for DDR3 4.1.1.21. cal_debug_clk for DDR3 4.1.1.22. cal_debug_out_reset_n for DDR3 4.1.1.23. cal_debug_out_clk for DDR3 4.1.1.24. clks_sharing_master_out for DDR3 4.1.1.25. clks_sharing_slave_in for DDR3 4.1.1.26. clks_sharing_slave_out for DDR3 4.1.1.27. ctrl_amm for DDR3 4.1.1.28. ctrl_auto_precharge for DDR3 4.1.1.29. ctrl_user_priority for DDR3 4.1.1.30. ctrl_ecc_user_interrupt for DDR3 4.1.1.31. ctrl_ecc_readdataerror for DDR3 4.1.1.32. ctrl_ecc_status for DDR3 4.1.1.33. ctrl_mmr_slave for DDR3 4.1.1.34. hps_emif for DDR3 4.1.1.35. cal_debug for DDR3 4.1.1.36. cal_debug_out for DDR3
4.1.2. Intel Stratix 10 EMIF IP Interfaces for DDR4 x
4.1.2.1. local_reset_req for DDR4 4.1.2.2. local_reset_status for DDR4 4.1.2.3. pll_ref_clk for DDR4 4.1.2.4. pll_locked for DDR4 4.1.2.5. pll_extra_clk_0 for DDR4 4.1.2.6. pll_extra_clk_1 for DDR4 4.1.2.7. pll_extra_clk_2 for DDR4 4.1.2.8. pll_extra_clk_3 for DDR4 4.1.2.9. ac_parity_err for DDR4 4.1.2.10. oct for DDR4 4.1.2.11. mem for DDR4 4.1.2.12. status for DDR4 4.1.2.13. afi_reset_n for DDR4 4.1.2.14. afi_clk for DDR4 4.1.2.15. afi_half_clk for DDR4 4.1.2.16. afi for DDR4 4.1.2.17. emif_usr_reset_n for DDR4 4.1.2.18. emif_usr_clk for DDR4 4.1.2.19. emif_usr_reset_n_sec for DDR4 4.1.2.20. emif_usr_clk_sec for DDR4 4.1.2.21. cal_debug_reset_n for DDR4 4.1.2.22. cal_debug_clk for DDR4 4.1.2.23. cal_debug_out_reset_n for DDR4 4.1.2.24. cal_debug_out_clk for DDR4 4.1.2.25. clks_sharing_master_out for DDR4 4.1.2.26. clks_sharing_slave_in for DDR4 4.1.2.27. clks_sharing_slave_out for DDR4 4.1.2.28. ctrl_amm for DDR4 4.1.2.29. ctrl_auto_precharge for DDR4 4.1.2.30. ctrl_user_priority for DDR4 4.1.2.31. ctrl_ecc_user_interrupt for DDR4 4.1.2.32. ctrl_ecc_readdataerror for DDR4 4.1.2.33. ctrl_ecc_status for DDR4 4.1.2.34. ctrl_mmr_slave for DDR4 4.1.2.35. hps_emif for DDR4 4.1.2.36. cal_debug for DDR4 4.1.2.37. cal_debug_out for DDR4
4.1.3. Intel Stratix 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme x
4.1.3.1. local_reset_req for QDR II/II+/II+ Xtreme 4.1.3.2. local_reset_status for QDR II/II+/II+ Xtreme 4.1.3.3. pll_ref_clk for QDR II/II+/II+ Xtreme 4.1.3.4. pll_locked for QDR II/II+/II+ Xtreme 4.1.3.5. pll_extra_clk_0 for QDR II/II+/II+ Xtreme 4.1.3.6. pll_extra_clk_1 for QDR II/II+/II+ Xtreme 4.1.3.7. pll_extra_clk_2 for QDR II/II+/II+ Xtreme 4.1.3.8. pll_extra_clk_3 for QDR II/II+/II+ Xtreme 4.1.3.9. oct for QDR II/II+/II+ Xtreme 4.1.3.10. mem for QDR II/II+/II+ Xtreme 4.1.3.11. status for QDR II/II+/II+ Xtreme 4.1.3.12. emif_usr_reset_n for QDR II/II+/II+ Xtreme 4.1.3.13. emif_usr_clk for QDR II/II+/II+ Xtreme 4.1.3.14. cal_debug_reset_n for QDR II/II+/II+ Xtreme 4.1.3.15. cal_debug_clk for QDR II/II+/II+ Xtreme 4.1.3.16. cal_debug_out_reset_n for QDR II/II+/II+ Xtreme 4.1.3.17. cal_debug_out_clk for QDR II/II+/II+ Xtreme 4.1.3.18. clks_sharing_master_out for QDR II/II+/II+ Xtreme 4.1.3.19. clks_sharing_slave_in for QDR II/II+/II+ Xtreme 4.1.3.20. clks_sharing_slave_out for QDR II/II+/II+ Xtreme 4.1.3.21. ctrl_amm for QDR II/II+/II+ Xtreme 4.1.3.22. cal_debug for QDR II/II+/II+ Xtreme 4.1.3.23. cal_debug_out for QDR II/II+/II+ Xtreme
4.1.4. Intel Stratix 10 EMIF IP Interfaces for QDR-IV x
4.1.4.1. local_reset_req for QDR-IV 4.1.4.2. local_reset_status for QDR-IV 4.1.4.3. pll_ref_clk for QDR-IV 4.1.4.4. pll_locked for QDR-IV 4.1.4.5. pll_extra_clk_0 for QDR-IV 4.1.4.6. pll_extra_clk_1 for QDR-IV 4.1.4.7. pll_extra_clk_2 for QDR-IV 4.1.4.8. pll_extra_clk_3 for QDR-IV 4.1.4.9. oct for QDR-IV 4.1.4.10. mem for QDR-IV 4.1.4.11. status for QDR-IV 4.1.4.12. afi_reset_n for QDR-IV 4.1.4.13. afi_clk for QDR-IV 4.1.4.14. afi_half_clk for QDR-IV 4.1.4.15. afi for QDR-IV 4.1.4.16. emif_usr_reset_n for QDR-IV 4.1.4.17. emif_usr_clk for QDR-IV 4.1.4.18. cal_debug_reset_n for QDR-IV 4.1.4.19. cal_debug_clk for QDR-IV 4.1.4.20. cal_debug_out_reset_n for QDR-IV 4.1.4.21. cal_debug_out_clk for QDR-IV 4.1.4.22. clks_sharing_master_out for QDR-IV 4.1.4.23. clks_sharing_slave_in for QDR-IV 4.1.4.24. clks_sharing_slave_out for QDR-IV 4.1.4.25. ctrl_amm for QDR-IV 4.1.4.26. cal_debug for QDR-IV 4.1.4.27. cal_debug_out for QDR-IV
4.1.5. Intel Stratix 10 EMIF IP Interfaces for RLDRAM 3 x
4.1.5.1. local_reset_req for RLDRAM 3 4.1.5.2. local_reset_status for RLDRAM 3 4.1.5.3. pll_ref_clk for RLDRAM 3 4.1.5.4. pll_locked for RLDRAM 3 4.1.5.5. pll_extra_clk_0 for RLDRAM 3 4.1.5.6. pll_extra_clk_1 for RLDRAM 3 4.1.5.7. pll_extra_clk_2 for RLDRAM 3 4.1.5.8. pll_extra_clk_3 for RLDRAM 3 4.1.5.9. oct for RLDRAM 3 4.1.5.10. mem for RLDRAM 3 4.1.5.11. status for RLDRAM 3 4.1.5.12. afi_reset_n for RLDRAM 3 4.1.5.13. afi_clk for RLDRAM 3 4.1.5.14. afi_half_clk for RLDRAM 3 4.1.5.15. afi for RLDRAM 3 4.1.5.16. cal_debug_reset_n for RLDRAM 3 4.1.5.17. cal_debug_clk for RLDRAM 3 4.1.5.18. cal_debug_out_reset_n for RLDRAM 3 4.1.5.19. cal_debug_out_clk for RLDRAM 3 4.1.5.20. clks_sharing_master_out for RLDRAM 3 4.1.5.21. clks_sharing_slave_in for RLDRAM 3 4.1.5.22. clks_sharing_slave_out for RLDRAM 3 4.1.5.23. cal_debug for RLDRAM 3 4.1.5.24. cal_debug_out for RLDRAM 3
4.2. AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Shadow Register Management Signals
4.3. AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Intel® Stratix® 10 Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. caltiming0 4.4.5. caltiming1 4.4.6. caltiming2 4.4.7. caltiming3 4.4.8. caltiming4 4.4.9. caltiming9 4.4.10. dramaddrw 4.4.11. sideband0 4.4.12. sideband1 4.4.13. sideband4 4.4.14. sideband6 4.4.15. sideband7 4.4.16. sideband9 4.4.17. sideband11 4.4.18. sideband12 4.4.19. sideband13 4.4.20. sideband14 4.4.21. dramsts 4.4.22. niosreserve0 4.4.23. niosreserve1 4.4.24. sideband16 4.4.25. ecc3: ECC Error and Interrupt Configuration 4.4.26. ecc4: Status and Error Information 4.4.27. ecc5: Address of Most Recent SBE/DBE 4.4.28. ecc6: Address of Most Recent Correction Command Dropped 4.4.29. ecc7: Extension for Address of Most Recent SBE/DBE 4.4.30. ecc8: Extension for Address of Most Recent Correction Command Dropped
5. Intel® Stratix® 10 EMIF – Simulating Memory IP x
5.1. Simulation Options 5.2. HPS EMIF Simulation 5.3. Simulation Walkthrough
5.3. Simulation Walkthrough x
5.3.1. Calibration Modes 5.3.2. Abstract PHY Simulation 5.3.3. Simulation Scripts 5.3.4. Functional Simulation with Verilog HDL 5.3.5. Functional Simulation with VHDL 5.3.6. Simulating the Design Example
5.3.6. Simulating the Design Example x
5.3.6.1. User-requested Reset in Intel® Stratix® 10 EMIF IP
6. Intel® Stratix® 10 EMIF IP for DDR3 x
6.1. Parameter Descriptions 6.2. Register Map IP-XACT Support for Intel® Stratix® 10 EMIF DDR3 IP 6.3. Board Skew Equations 6.4. Pin and Resource Planning 6.5. DDR3 Board Design Guidelines
6.1. Parameter Descriptions x
6.1.1. Intel Stratix 10 EMIF IP DDR3 Parameters: General 6.1.2. Intel Stratix 10 EMIF IP DDR3 Parameters: FPGA I/O 6.1.3. Intel Stratix 10 EMIF IP DDR3 Parameters: Memory 6.1.4. Intel Stratix 10 EMIF IP DDR3 Parameters: Mem I/O 6.1.5. Intel Stratix 10 EMIF IP DDR3 Parameters: Mem Timing 6.1.6. Intel Stratix 10 EMIF IP DDR3 Parameters: Board 6.1.7. Intel Stratix 10 EMIF IP DDR3 Parameters: Controller 6.1.8. Intel Stratix 10 EMIF IP DDR3 Parameters: Diagnostics 6.1.9. Intel Stratix 10 EMIF IP DDR3 Parameters: Example Designs
6.3. Board Skew Equations x
6.3.1. Equations for DDR3 Board Skew Parameters
6.4. Pin and Resource Planning x
6.4.1. Interface Pins 6.4.2. FPGA Resources 6.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP
6.4.1. Interface Pins x
6.4.1.1. Estimating Pin Requirements 6.4.1.2. DIMM Options 6.4.1.3. Maximum Number of Interfaces
6.4.2. FPGA Resources x
6.4.2.1. OCT 6.4.2.2. PLL
6.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
6.4.3.1. General Guidelines 6.4.3.2. x4 DIMM Implementation 6.4.3.3. Command and Address Signals 6.4.3.4. Clock Signals 6.4.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 6.4.3.6. Resource Sharing Guidelines (Multiple Interfaces) 6.4.3.7. Ping-Pong PHY Implementation
6.5. DDR3 Board Design Guidelines x
6.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices 6.5.2. Channel Signal Integrity Measurement 6.5.3. Layout Approach 6.5.4. Design Layout Guidelines 6.5.5. Package Deskew
6.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices x
6.5.1.1. Dynamic On-Chip Termination (OCT) in Intel® Stratix® 10 Devices 6.5.1.2. Choosing Terminations on Intel® Stratix® 10 Devices 6.5.1.3. On-Chip Termination Recommendations for Intel® Stratix® 10 Devices 6.5.1.4. Slew Rates
6.5.2. Channel Signal Integrity Measurement x
6.5.2.1. Importance of Accurate Channel Signal Integrity Information 6.5.2.2. Understanding Channel Signal Integrity Measurement 6.5.2.3. How to Enter Calculated Channel Signal Integrity Values 6.5.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
6.5.4. Design Layout Guidelines x
6.5.4.1. General Layout Guidelines 6.5.4.2. Layout Guidelines 6.5.4.3. Length Matching Rules 6.5.4.4. Spacing Guidelines 6.5.4.5. Fly-By Network Design for Clock, Command, and Address Signals
6.5.5. Package Deskew x
6.5.5.1. DQ/DQS/DM Deskew 6.5.5.2. Address and Command Deskew 6.5.5.3. Package Deskew Recommendations for Intel® Stratix® 10 Devices 6.5.5.4. Deskew Example 6.5.5.5. Package Migration
7. Intel® Stratix® 10 EMIF IP for DDR4 x
7.1. Parameter Descriptions 7.2. Register Map IP-XACT Support for Intel® Stratix® 10 EMIF DDR4 IP 7.3. Board Skew Equations 7.4. Pin and Resource Planning 7.5. DDR4 Board Design Guidelines
7.1. Parameter Descriptions x
7.1.1. Intel Stratix 10 EMIF IP DDR4 Parameters: General 7.1.2. Intel Stratix 10 EMIF IP DDR4 Parameters: FPGA I/O 7.1.3. Intel Stratix 10 EMIF IP DDR4 Parameters: Memory 7.1.4. Intel Stratix 10 EMIF IP DDR4 Parameters: Mem I/O 7.1.5. Intel Stratix 10 EMIF IP DDR4 Parameters: Mem Timing 7.1.6. Intel Stratix 10 EMIF IP DDR4 Parameters: Board 7.1.7. Intel Stratix 10 EMIF IP DDR4 Parameters: Controller 7.1.8. Intel Stratix 10 EMIF IP DDR4 Parameters: Diagnostics 7.1.9. Intel Stratix 10 EMIF IP DDR4 Parameters: Example Designs
7.3. Board Skew Equations x
7.3.1. Equations for DDR4 Board Skew Parameters
7.4. Pin and Resource Planning x
7.4.1. Interface Pins 7.4.2. FPGA Resources 7.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP 7.4.4. Resource Sharing Guidelines (Multiple Interfaces)
7.4.1. Interface Pins x
7.4.1.1. Estimating Pin Requirements 7.4.1.2. DIMM Options 7.4.1.3. Maximum Number of Interfaces
7.4.2. FPGA Resources x
7.4.2.1. OCT 7.4.2.2. PLL
7.4.3. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
7.4.3.1. General Guidelines 7.4.3.2. x4 DIMM Implementation 7.4.3.3. Command and Address Signals 7.4.3.4. Clock Signals 7.4.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 7.4.3.6. alert_n Pin Termination Recommendation
7.5. DDR4 Board Design Guidelines x
7.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices 7.5.2. Channel Signal Integrity Measurement 7.5.3. Layout Approach 7.5.4. Design Layout Guidelines 7.5.5. Package Deskew
7.5.1. Terminations and Slew Rates with Intel® Stratix® 10 Devices x
7.5.1.1. Dynamic On-Chip Termination (OCT) in Intel® Stratix® 10 Devices 7.5.1.2. Dynamic On-Die Termination (ODT) in DDR4 7.5.1.3. Choosing Terminations on Intel® Stratix® 10 Devices 7.5.1.4. On-Chip Termination Recommendations for Intel® Stratix® 10 Devices 7.5.1.5. Slew Rates
7.5.2. Channel Signal Integrity Measurement x
7.5.2.1. Importance of Accurate Channel Signal Integrity Information 7.5.2.2. Understanding Channel Signal Integrity Measurement 7.5.2.3. How to Enter Calculated Channel Signal Integrity Values 7.5.2.4. Guidelines for Calculating DDR4 Channel Signal Integrity
7.5.4. Design Layout Guidelines x
7.5.4.1. General Layout Guidelines 7.5.4.2. Layout Guidelines 7.5.4.3. Length Matching Rules 7.5.4.4. Spacing Guidelines 7.5.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 7.5.4.6. Fly-By Network Design for Clock, Command, and Address Signals 7.5.4.7. Clamshell Topology 7.5.4.8. Additional Layout Guidelines for DDR4 Twin-die Devices
7.5.5. Package Deskew x
7.5.5.1. DQ/DQS/DM Deskew 7.5.5.2. Address and Command Deskew 7.5.5.3. Package Deskew Recommendations for Intel® Stratix® 10 Devices 7.5.5.4. Deskew Example 7.5.5.5. Package Migration
8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme x
8.1. Parameter Descriptions 8.2. Board Skew Equations 8.3. Pin and Resource Planning 8.4. QDR II/II+/II+ Xtreme Board Design Guidelines
8.1. Parameter Descriptions x
8.1.1. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: General 8.1.2. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: FPGA I/O 8.1.3. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Memory 8.1.4. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Mem Timing 8.1.5. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Board 8.1.6. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Controller 8.1.7. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Diagnostics 8.1.8. Intel Stratix 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Example Designs
8.2. Board Skew Equations x
8.2.1. Equations for QDRII, QDRII+, and QDRII+ Xtreme Board Skew Parameters
8.3. Pin and Resource Planning x
8.3.1. Interface Pins
8.3.1. Interface Pins x
8.3.1.1. Estimating Pin Requirements 8.3.1.2. Maximum Number of Interfaces 8.3.1.3. FPGA Resources 8.3.1.4. OCT 8.3.1.5. PLL 8.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP
8.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
8.3.1.6.1. General Guidelines 8.3.1.6.2. QDR II, QDR II+ and QDR II+ Xtreme SRAM Command Signals 8.3.1.6.3. QDR II, QDR II+ and QDR II+ Xtreme SRAM Address Signals 8.3.1.6.4. QDR II, QDR II+, and QDR II+ Xtreme SRAM Clock Signals 8.3.1.6.5. QDR II, QDR II+ and QDR II+ Xtreme SRAM Data, BWS, and QVLD Signals 8.3.1.6.6. Resource Sharing Guidelines (Multiple Interfaces)
8.4. QDR II/II+/II+ Xtreme Board Design Guidelines x
8.4.1. QDR II SRAM Configurations 8.4.2. General Layout Guidelines 8.4.3. QDR II Layout Guidelines 8.4.4. QDR II SRAM Layout Approach 8.4.5. Package Deskew 8.4.6. Package Migration 8.4.7. Slew Rates
9. Intel® Stratix® 10 EMIF IP for QDR-IV x
9.1. Parameter Descriptions 9.2. Board Skew Equations 9.3. Pin and Resource Planning 9.4. QDR-IV Board Design Guidelines
9.1. Parameter Descriptions x
9.1.1. Intel Stratix 10 EMIF IP QDR-IV Parameters: General 9.1.2. Intel Stratix 10 EMIF IP QDR-IV Parameters: FPGA I/O 9.1.3. Intel Stratix 10 EMIF IP QDR-IV Parameters: Memory 9.1.4. Intel Stratix 10 EMIF IP QDR-IV Parameters: Mem Timing 9.1.5. Intel Stratix 10 EMIF IP QDR-IV Parameters: Board 9.1.6. Intel Stratix 10 EMIF IP QDR-IV Parameters: Controller 9.1.7. Intel Stratix 10 EMIF IP QDR-IV Parameters: Diagnostics 9.1.8. Intel Stratix 10 EMIF IP QDR-IV Parameters: Example Designs
9.2. Board Skew Equations x
9.2.1. Equations for QDR-IV Board Skew Parameters
9.3. Pin and Resource Planning x
9.3.1. Interface Pins
9.3.1. Interface Pins x
9.3.1.1. Estimating Pin Requirements 9.3.1.2. Maximum Number of Interfaces 9.3.1.3. FPGA Resources 9.3.1.4. OCT 9.3.1.5. PLL 9.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP 9.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
9.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
9.3.1.6.1. General Guidelines 9.3.1.6.2. QDR IV SRAM Commands and Addresses, AP, and AINV Signals 9.3.1.6.3. QDR IV SRAM Clock Signals 9.3.1.6.4. QDR IV SRAM Data, DINV, and QVLD Signals
9.4. QDR-IV Board Design Guidelines x
9.4.1. QDR-IV Layout Approach 9.4.2. General Layout Guidelines 9.4.3. QDR-IV Layout Guidelines 9.4.4. Package Deskew 9.4.5. Package Migration 9.4.6. Slew Rates
10. Intel® Stratix® 10 EMIF IP for RLDRAM 3 x
10.1. Parameter Descriptions 10.2. Board Skew Equations 10.3. Pin and Resource Planning 10.4. RLDRAM 3 Board Design Guidelines
10.1. Parameter Descriptions x
10.1.1. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: General 10.1.2. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: FPGA I/O 10.1.3. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Memory 10.1.4. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Mem Timing 10.1.5. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Board 10.1.6. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Diagnostics 10.1.7. Intel Stratix 10 EMIF IP RLDRAM 3 Parameters: Example Designs
10.2. Board Skew Equations x
10.2.1. Equations for RLDRAM 3 Board Skew Parameters
10.3. Pin and Resource Planning x
10.3.1. Interface Pins
10.3.1. Interface Pins x
10.3.1.1. Estimating Pin Requirements 10.3.1.2. Maximum Number of Interfaces 10.3.1.3. FPGA Resources 10.3.1.4. OCT 10.3.1.5. PLL 10.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP 10.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
10.3.1.6. Pin Guidelines for Intel® Stratix® 10 EMIF IP x
10.3.1.6.1. General Guidelines 10.3.1.6.2. RLDRAM 3 Commands and Addresses 10.3.1.6.3. RLDRAM 3 Clock Signals 10.3.1.6.4. RLDRAM 3 Data, DM and QVLD Signals
10.4. RLDRAM 3 Board Design Guidelines x
10.4.1. RLDRAM 3 Configurations 10.4.2. General Layout Guidelines 10.4.3. RLDRAM 3 Layout Guidelines 10.4.4. Layout Approach 10.4.5. Package Deskew 10.4.6. Package Migration 10.4.7. Slew Rates
11. Intel® Stratix® 10 EMIF IP Timing Closure x
11.1. Timing Closure 11.2. Timing Report DDR 11.3. Optimizing Timing 11.4. Early I/O Timing Estimation
11.1. Timing Closure x
11.1.1. Timing Analysis
11.1.1. Timing Analysis x
11.1.1.1. PHY or Core 11.1.1.2. I/O Timing
11.1.1.2. I/O Timing x
11.1.1.2.1. Read Capture 11.1.1.2.2. Write 11.1.1.2.3. Address and Command 11.1.1.2.4. DQS Gating / Postamble 11.1.1.2.5. Write Leveling
11.4. Early I/O Timing Estimation x
11.4.1. Performing Early I/O Timing Analysis
12. Optimizing Controller Performance x
12.1. Interface Standard 12.2. Bank Management Efficiency 12.3. Data Transfer 12.4. Improving Controller Efficiency
12.4. Improving Controller Efficiency x
12.4.1. Auto-Precharge Commands 12.4.2. Latency 12.4.3. Calibration 12.4.4. Bank Interleaving 12.4.5. Additive Latency and Bank Interleaving 12.4.6. User-Controlled Refresh 12.4.7. Frequency of Operation 12.4.8. Series of Reads or Writes 12.4.9. Data Reordering 12.4.10. Starvation Control 12.4.11. Command Reordering 12.4.12. Bandwidth 12.4.13. Enable Command Priority Control
12.4.2. Latency x
12.4.2.1. Additive Latency
12.4.6. User-Controlled Refresh x
12.4.6.1. Back-to-Back User-Controlled Refresh Usage
13. Intel® Stratix® 10 EMIF IP Debugging x
13.1. Interface Configuration Performance Issues 13.2. Functional Issue Evaluation 13.3. Timing Issue Characteristics 13.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer 13.5. Hardware Debugging Guidelines 13.6. Categorizing Hardware Issues 13.7. Debugging Intel® Stratix® 10 EMIF IP 13.8. Using the Default Traffic Generator 13.9. Using the Configurable Traffic Generator (TG2)
13.1. Interface Configuration Performance Issues x
13.1.1. Interface Configuration Bottleneck and Efficiency Issues
13.2. Functional Issue Evaluation x
13.2.1. Intel® IP Memory Model 13.2.2. Vendor Memory Model 13.2.3. Transcript Window Messages 13.2.4. Modifying the Example Driver to Replicate the Failure
13.3. Timing Issue Characteristics x
13.3.1. Evaluating FPGA Timing Issues 13.3.2. Evaluating External Memory Interface Timing Issues
13.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer x
13.4.1. Signals to Monitor with the Signal Tap II Logic Analyzer
13.5. Hardware Debugging Guidelines x
13.5.1. Create a Simplified Design that Demonstrates the Same Issue 13.5.2. Measure Power Distribution Network 13.5.3. Measure Signal Integrity and Setup and Hold Margin 13.5.4. Vary Voltage 13.5.5. Operate at a Lower Speed 13.5.6. Determine Whether the Issue Exists in Previous Versions of Software 13.5.7. Determine Whether the Issue Exists in the Current Version of Software 13.5.8. Try A Different PCB 13.5.9. Try Other Configurations 13.5.10. Debugging Checklist
13.6. Categorizing Hardware Issues x
13.6.1. Signal Integrity Issues 13.6.2. Hardware and Calibration Issues
13.6.1. Signal Integrity Issues x
13.6.1.1. Characteristics of Signal Integrity Issues 13.6.1.2. Evaluating SignaI Integrity Issues
13.6.1.2. Evaluating SignaI Integrity Issues x
13.6.1.2.1. Skew 13.6.1.2.2. Crosstalk 13.6.1.2.3. Power System 13.6.1.2.4. Clock Signals 13.6.1.2.5. Read Data Valid Window and Eye Diagram 13.6.1.2.6. Write Data Valid Window and Eye Diagram 13.6.1.2.7. OCT and ODT Usage
13.6.2. Hardware and Calibration Issues x
13.6.2.1. Postamble Timing Issues and Margin 13.6.2.2. Intermittent Issue Evaluation
13.7. Debugging Intel® Stratix® 10 EMIF IP x
13.7.1. Debugging With the Legacy External Memory Interface Debug Toolkit 13.7.2. Debugging with the External Memory Interface Unified Calibration Debug Toolkit 13.7.3. On-Chip Debug Port for Intel® Stratix® 10 EMIF IP 13.7.4. Legacy Efficiency Monitor and Protocol Checker 13.7.5. New Efficiency Monitor
13.7.1. Debugging With the Legacy External Memory Interface Debug Toolkit x
13.7.1.1. User Interface 13.7.1.2. Communication 13.7.1.3. Setup and Use 13.7.1.4. Configuring Your EMIF IP for Use with the Legacy Debug Toolkit 13.7.1.5. Reports 13.7.1.6. On-Die Termination Calibration 13.7.1.7. Eye Diagram 13.7.1.8. Driver Margining for Intel® Stratix® 10 EMIF IP 13.7.1.9. Example Tcl Script for Running the Legacy EMIF Debug Toolkit 13.7.1.10. Using the Legacy EMIF Debug Toolkit with Intel® Stratix® 10 HPS Interfaces
13.7.1.4. Configuring Your EMIF IP for Use with the Legacy Debug Toolkit x
13.7.1.4.1. Daisy-Chaining Additional EMIF IP Cores for Debugging 13.7.1.4.2. General Workflow 13.7.1.4.3. Linking the Project to a Device 13.7.1.4.4. Establishing Communication to Connections 13.7.1.4.5. Selecting an Active Interface
13.7.1.8. Driver Margining for Intel® Stratix® 10 EMIF IP x
13.7.1.8.1. Determining Margin
13.7.2. Debugging with the External Memory Interface Unified Calibration Debug Toolkit x
13.7.2.1. Prerequisites for Using the EMIF Unified Calibration Debug Toolkit 13.7.2.2. Configuring a Design to use the EMIF Unified Calibration Debug Toolkit 13.7.2.3. Launching the EMIF Debug Toolkit 13.7.2.4. Using the EMIF Debug Toolkit 13.7.2.5. Exporting Tables 13.7.2.6. Viewing Diagrams in the Eye Viewer 13.7.2.7. Guidelines for Debugging Calibration Issues
13.7.2.2. Configuring a Design to use the EMIF Unified Calibration Debug Toolkit x
13.7.2.2.1. Generating a Design Example with the Debug Toolkit 13.7.2.2.2. Adding Interfaces to an Design Example 13.7.2.2.3. Enabling the EMIF Unified Calibration Debug Toolkit in an Existing Design
13.7.2.4. Using the EMIF Debug Toolkit x
13.7.2.4.1. Memory Configuration Tab 13.7.2.4.2. Calibration Tab 13.7.2.4.3. Calibration Report Tab 13.7.2.4.4. Calibrate Termination Tab 13.7.2.4.5. Vref Margining Tab 13.7.2.4.6. Driver Margining Tab 13.7.2.4.7. ISSP Tab 13.7.2.4.8. Pin Delay Settings Tab
13.7.2.7. Guidelines for Debugging Calibration Issues x
13.7.2.7.1. Debugging Calibration Failure Using Information from the Calibration report 13.7.2.7.2. Debugging Address and Command Leveling Calibration Failure 13.7.2.7.3. Debugging Address and Command Deskew Failure 13.7.2.7.4. Debugging DQS Enable Failure 13.7.2.7.5. Debugging Read Deskew Calibration Failure 13.7.2.7.6. Debugging VREFIN Calibration Failure 13.7.2.7.7. Debugging LFIFO Calibration Failure 13.7.2.7.8. Debugging Write Leveling Failure 13.7.2.7.9. Debugging Write Deskew Calibration Failure 13.7.2.7.10. Debugging VREFOUT Calibration Failure
13.7.3. On-Chip Debug Port for Intel® Stratix® 10 EMIF IP x
13.7.3.1. EMIF On-Chip Debug Port 13.7.3.2. Access Protocol
13.7.4. Legacy Efficiency Monitor and Protocol Checker x
13.7.4.1. Including the Legacy Efficiency Monitor and Protocol Checker in Your Generated IP 13.7.4.2. Running the Legacy Efficiency Monitor with the External Memory Debug Toolkit 13.7.4.3. Communicating Directly to the Legacy Efficiency Monitor and Protocol Checker
13.7.5. New Efficiency Monitor x
13.7.5.1. Enabling the Efficiency Monitor in a Design Example 13.7.5.2. Efficiency Monitor Block Descriptions 13.7.5.3. Control and Status Registers 13.7.5.4. Opening the Efficiency Monitor
13.8. Using the Default Traffic Generator x
13.8.1. Reading the Default Traffic Generator Status 13.8.2. Running Infinite Traffic using the Default Traffic Generator 13.8.3. Changing the Reset Trigger of the Default Traffic Generator 13.8.4. Observing Generated Traffic with Signal Tap
13.9. Using the Configurable Traffic Generator (TG2) x
13.9.1. Enabling the Traffic Generator in a Design Example 13.9.2. Traffic Generator Block Description 13.9.3. Default Traffic Pattern 13.9.4. Configuration and Status Registers 13.9.5. User Pattern 13.9.6. Traffic Generator Status 13.9.7. Starting Traffic with the Traffic Generator 13.9.8. Traffic Generator Configuration User Interface 13.9.9. Examples of Configuring the TG2 Traffic Generator
13.9.5. User Pattern x
13.9.5.1. Test Duration / Instruction pattern 13.9.5.2. Address Pattern 13.9.5.3. Data Pattern and Byte Enable
13.9.5.2. Address Pattern x
13.9.5.2.1. Address Generator Modes 13.9.5.2.2. Address Generator MSB Indices 13.9.5.2.3. Address Generator Effective Width 13.9.5.2.4. Address Generator Relative Frequencies 13.9.5.2.5. Address Pattern Examples - Basic Mode 13.9.5.2.6. Address Pattern Examples - Advanced Mode
13.9.8. Traffic Generator Configuration User Interface x
13.9.8.1. Connecting the Traffic Generator 13.9.8.2. Configuring the Traffic Generator 13.9.8.3. Traffic Generator Preset Selection 13.9.8.4. Traffic Generator Status Report
1. Release Information
2. External Memory Interfaces Intel® Stratix® 10 FPGA IP Introduction
3. Intel® Stratix® 10 EMIF IP Product Architecture
4. Intel® Stratix® 10 EMIF IP End-User Signals
5. Intel® Stratix® 10 EMIF – Simulating Memory IP
6. Intel® Stratix® 10 EMIF IP for DDR3
7. Intel® Stratix® 10 EMIF IP for DDR4
8. Intel® Stratix® 10 EMIF IP for QDR II/II+/II+ Xtreme
9. Intel® Stratix® 10 EMIF IP for QDR-IV
10. Intel® Stratix® 10 EMIF IP for RLDRAM 3
11. Intel® Stratix® 10 EMIF IP Timing Closure
12. Optimizing Controller Performance
13. Intel® Stratix® 10 EMIF IP Debugging
14. External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide Archives
15. Document Revision History for External Memory Interfaces Intel® Stratix® 10 FPGA IP User Guide

10.4.3. RLDRAM 3 Layout Guidelines

The following table lists the RLDRAM 3 general routing layout guidelines. These guidelines apply to Intel® Stratix® 10 devices.
Table 346.  RLDRAM 3 Layout Guidelines

Parameter

Guidelines

General Routing

  • If you must route signals of the same net group on different layers with the same impedance characteristic, simulate your worst case PCB trace tolerances to ascertain actual propagation delay differences. Typical layer to layer trace delay variations are of 15 ps/inch order.
  • Avoid T-junctions greater than 150 ps.
  • Match all signals within a given DQ group with a maximum skew of ±10 ps and route on the same layer.

Clock Routing

  • Route clocks on inner layers with outer-layer run lengths held to under 150 ps.
  • These signals should maintain a 10-mil (0.254 mm) spacing from other nets.
  • Clocks should maintain a length-matching between clock pairs of ±5 ps.
  • Differential clocks should maintain a length-matching between P and N signals of ±2 ps.
  • Space between different clock pairs should be at least three times the space between the traces of a differential pair.

Address and Command Routing

  • To minimize crosstalk, route address, bank address, and command signals on a different layer than the data and data mask signals.
  • Do not route the differential clock signals close to the address signals.
  • Keep the distance from the pin on the RLDRAM 3 component to the stub termination resistor (VTT) to less than 50 ps for the address/command signal group.
  • Keep the distance from the pin on the RLDRAM 3 component to the fly-by termination resistor (VTT) to less than 100 ps for the address/command signal group.

External Memory Routing Rules

  • Apply the following parallelism rules for the RLDRAM 3 data/address/command groups:
    • 4 mils for parallel runs < 0.1 inch (approximately 1× spacing relative to plane distance).
    • 5 mils for parallel runs < 0.5 inch (approximately 1× spacing relative to plane distance).
    • 10 mils for parallel runs between 0.5 and 1.0 inches (approximately 2× spacing relative to plane distance).
    • 15 mils for parallel runs between 1.0 and 3.3 inch (approximately 3× spacing relative to plane distance).

Maximum Trace Length

  • Keep the maximum trace length of all signals from the FPGA to the RLDRAM 3 components to 600 ps.

Trace Matching Guidance

The following layout approach is recommended, based on the preceding guidelines:

  1. If the RLDRAM 3 interface has multiple DQ groups (×18 or ×36 RLDRAM 3 component or width expansion configuration), match all the DK/DK# and QK ,QK # clocks as tightly as possible to optimize the timing margins in your design.
  2. Route the DK/DK# write clock and QK/QK# read clock associated with a DQ group on the same PCB layer. Match these clock pairs to within ±5 ps.
  3. Set the DK/DK# or QK/QK# clock as the target trace propagation delay for the associated data and data mask signals.
  4. Route the data and data mask signals for the DQ group ideally on the same layer as the associated QK/QK# and DK/DK# clocks to within ±10 ps skew of the target clock.
  5. Route the CK/CK# clocks and set as the target trace propagation delays for the address/command signal group. Match the CK/CK# clock to within ±50 ps of all the DK/DK# clocks.
  6. Route the address/control signal group (address, bank address, CS, WE, and REF) ideally on the same layer as the CK/CK# clocks, to within ±20 ps skew of the CK/CK# traces.
Note: It is important to match the delays of CK vs. DK, and CK vs. Addr-Cmd as much as possible.

This layout approach provides a good starting point for a design requirement of the highest clock frequency supported for the RLDRAM 3 interface.

Level Two Title