External Memory Interface Handbook Volume 3: Reference Material

ID 683841
Date 7/24/2019
Public
Document Table of Contents

2.2. Stratix® 10 EMIF IP Support for 3DS/TSV DDR4 Devices

The Stratix® 10 EMIF IP supports high-density DDR4 memory devices with three-dimensional stacked-die (3DS) memory technology in RDIMM format. Both 2H and 4H 3DS devices are supported.

To configure a DDR4 RDIMM memory interface to use 3DS devices, do one of the following:

  • Select one of the 3DS-enabled IP presets available in the parameter editor.
    1. Specify a non-zero value for the Chip ID Width parameter on the Memory tab in the parameter editor.
    2. Enter the 3DS-specific specific timing parameters (tRDD_dir, tFAW_dir, tRFC_dir) from the memory vendor's data sheet appropriately.

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