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1. Logic Elements and Logic Array Blocks in Intel® Cyclone® 10 LP Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices
3. Embedded Multipliers in Intel® Cyclone® 10 LP Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 LP Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices
6. Configuration and Remote System Upgrades
7. SEU Mitigation in Intel® Cyclone® 10 LP Devices
8. JTAG Boundary-Scan Testing for Intel® Cyclone® 10 LP Devices
9. Power Management in Intel® Cyclone® 10 LP Devices
2.1. Embedded Memory Capacity
2.2. Intel® Cyclone® 10 LP Embedded Memory General Features
2.3. Intel® Cyclone® 10 LP Embedded Memory Operation Modes
2.4. Intel® Cyclone® 10 LP Embedded Memory Clock Modes
2.5. Intel® Cyclone® 10 LP Embedded Memory Configurations
2.6. Intel® Cyclone® 10 LP Embedded Memory Design Consideration
2.7. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices Revision History
4.2.1. PLL Features
4.2.2. PLL Architecture
4.2.3. External Clock Outputs
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Post-Scale Counter Cascading
4.2.7. Programmable Duty Cycle
4.2.8. PLL Control Signals
4.2.9. Clock Switchover
4.2.10. Programmable Bandwidth
4.2.11. Programmable Phase Shift
4.2.12. PLL Cascading
4.2.13. PLL Reconfiguration
4.2.14. Spread-Spectrum Clocking
5.1. Intel® Cyclone® 10 LP I/O Standards Support
5.2. I/O Resources in Intel® Cyclone® 10 LP Devices
5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 LP Devices
5.4. Intel® Cyclone® 10 LP I/O Elements
5.5. Intel® Cyclone® 10 LP Clock Pins Input Support
5.6. Programmable IOE Features in Intel® Cyclone® 10 LP Devices
5.7. I/O Standards Termination
5.8. Intel® Cyclone® 10 LP High-Speed Differential I/Os and SERDES
5.9. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 LP Devices
5.10. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices Revision History
5.8.2.1. LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.2. Bus LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.3. RSDS, Mini-LVDS, and PPDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.4. LVPECL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.5. Differential SSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.6. Differential HSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.9.1. Guideline: Validate Your Pin Placement
5.9.2. Guideline: Check for Illegal Pad Placements
5.9.3. Guideline: Voltage-Referenced I/O Standards Restriction
5.9.4. Guideline: Simultaneous Usage of Multiple I/O Standards
5.9.5. Guideline: LVTTL or LVCMOS Inputs in Intel® Cyclone® 10 LP Devices
5.9.6. Guideline: Differential Pad Placement
5.9.7. Guideline: Board Design for Signal Quality
6.1.4.1. Configuring Intel® Cyclone® 10 LP Devices with the JRunner Software Driver
6.1.4.2. Configuring Intel® Cyclone® 10 LP Devices with Jam STAPL
6.1.4.3. JTAG Single-Device Configuration
6.1.4.4. JTAG Multi-Device Configuration
6.1.4.5. Combining JTAG and AS Configuration Schemes
6.1.4.6. Programming Serial Configuration Devices In-System with the JTAG Interface
6.1.4.7. JTAG Instructions
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6.1.4.4. JTAG Multi-Device Configuration
You can configure multiple devices in a JTAG chain.
The CONF_DONE and nSTATUS signals are shared in multi-device AS, PS, and FPP configuration chains to ensure that the devices enter user mode at the same time after configuration is complete. When the CONF_DONE and nSTATUS signals are shared among all the devices, you must configure every device when JTAG configuration is performed.
- After the first device completes configuration in a multi-device configuration chain, its nCEO pin drives low to activate the nCE pin of the second device prompting it to begin configuration.
- The second device in the chain begins configuration. If both devices are also in a JTAG chain, ensure that the nCE pins are connected to GND during JTAG configuration or that the devices are JTAG-configured in the same order as the configuration chain.
- As long as the devices are JTAG configured in the same order as the multi-device configuration chain, the nCEO pin of the previous device drives the nCE pin of the next device low when it has successfully been JTAG-configured.
- Place other Intel devices that have JTAG support in the same JTAG chain for device programming and configuration.
To configure an Intel® Cyclone® 10 LP device using a download cable, connect the device as shown in the following figure.
- For device using VCCIO of 2.5, 3.0, and 3.3 V:
- All I/O inputs must maintain a maximum AC voltage of 4.1 V because JTAG pins do not have the internal PCI clamping diodes to prevent voltage overshoot.
- You must power up the VCC of the download cable with a 2.5-V supply from VCCA.
- For device using VCCIO of 1.2, 1.5, and 1.8 V:
- You can power up the VCC of the download cable with the supply from VCCIO.
- In the Intel FPGA download cable and Intel FPGA parallel port cable, this pin is connected to nCE when it is used for AS programming, otherwise it is not connected.
Figure 98. JTAG Configuration of Multiple Devices Using a Download Cable
Note: Connect the nCONFIG and MSEL pins to support a non-JTAG configuration scheme. If you only use a JTAG configuration, connect the nCONFIG pin to logic-high and the MSEL pins to GND. Pull DCLK and DATA[0] to either high or low, whichever is convenient on your board.