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1. Logic Elements and Logic Array Blocks in Intel® Cyclone® 10 LP Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices
3. Embedded Multipliers in Intel® Cyclone® 10 LP Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 LP Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices
6. Configuration and Remote System Upgrades
7. SEU Mitigation in Intel® Cyclone® 10 LP Devices
8. JTAG Boundary-Scan Testing for Intel® Cyclone® 10 LP Devices
9. Power Management in Intel® Cyclone® 10 LP Devices
2.1. Embedded Memory Capacity
2.2. Intel® Cyclone® 10 LP Embedded Memory General Features
2.3. Intel® Cyclone® 10 LP Embedded Memory Operation Modes
2.4. Intel® Cyclone® 10 LP Embedded Memory Clock Modes
2.5. Intel® Cyclone® 10 LP Embedded Memory Configurations
2.6. Intel® Cyclone® 10 LP Embedded Memory Design Consideration
2.7. Embedded Memory Blocks in Intel® Cyclone® 10 LP Devices Revision History
4.2.1. PLL Features
4.2.2. PLL Architecture
4.2.3. External Clock Outputs
4.2.4. Clock Feedback Modes
4.2.5. Clock Multiplication and Division
4.2.6. Post-Scale Counter Cascading
4.2.7. Programmable Duty Cycle
4.2.8. PLL Control Signals
4.2.9. Clock Switchover
4.2.10. Programmable Bandwidth
4.2.11. Programmable Phase Shift
4.2.12. PLL Cascading
4.2.13. PLL Reconfiguration
4.2.14. Spread-Spectrum Clocking
5.1. Intel® Cyclone® 10 LP I/O Standards Support
5.2. I/O Resources in Intel® Cyclone® 10 LP Devices
5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 LP Devices
5.4. Intel® Cyclone® 10 LP I/O Elements
5.5. Intel® Cyclone® 10 LP Clock Pins Input Support
5.6. Programmable IOE Features in Intel® Cyclone® 10 LP Devices
5.7. I/O Standards Termination
5.8. Intel® Cyclone® 10 LP High-Speed Differential I/Os and SERDES
5.9. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 LP Devices
5.10. I/O and High Speed I/O in Intel® Cyclone® 10 LP Devices Revision History
5.8.2.1. LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.2. Bus LVDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.3. RSDS, Mini-LVDS, and PPDS I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.4. LVPECL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.5. Differential SSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.8.2.6. Differential HSTL I/O Standard in Intel® Cyclone® 10 LP Devices
5.9.1. Guideline: Validate Your Pin Placement
5.9.2. Guideline: Check for Illegal Pad Placements
5.9.3. Guideline: Voltage-Referenced I/O Standards Restriction
5.9.4. Guideline: Simultaneous Usage of Multiple I/O Standards
5.9.5. Guideline: LVTTL or LVCMOS Inputs in Intel® Cyclone® 10 LP Devices
5.9.6. Guideline: Differential Pad Placement
5.9.7. Guideline: Board Design for Signal Quality
6.1.4.1. Configuring Intel® Cyclone® 10 LP Devices with the JRunner Software Driver
6.1.4.2. Configuring Intel® Cyclone® 10 LP Devices with Jam STAPL
6.1.4.3. JTAG Single-Device Configuration
6.1.4.4. JTAG Multi-Device Configuration
6.1.4.5. Combining JTAG and AS Configuration Schemes
6.1.4.6. Programming Serial Configuration Devices In-System with the JTAG Interface
6.1.4.7. JTAG Instructions
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7.3.1.2. CHANGE_EDREG JTAG Instruction
JTAG Instruction | Instruction Code | Description |
---|---|---|
CHANGE_EDREG | 00 0001 0101 | This instruction connects the 32-bit CRC storage register between TDI and TDO. Any precomputed CRC is loaded into the CRC storage register to test the operation of the error detection CRC circuitry at the CRC_ERROR pin. |