Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide
ID
683780
Date
10/29/2021
Public
A newer version of this document is available. Customers should click here to go to the newest version.
1. Intel® Agilex™ General-Purpose I/O and LVDS SERDES Overview
2. Intel® Agilex™ I/O Features and Usage
3. Intel® Agilex™ I/O Termination
4. Intel® Agilex™ High-Speed SERDES I/O Architecture
5. I/O and LVDS SERDES Design Guidelines
6. Troubleshooting Guidelines
7. Documentation Related to the Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide
8. Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide Archives
9. Document Revision History for the Intel® Agilex™ General-Purpose I/O and LVDS SERDES User Guide
2.2.1. Programmable Output Slew Rate Control
2.2.2. Programmable IOE Delay
2.2.3. Programmable Open-Drain Output
2.2.4. Programmable Bus-Hold
2.2.5. Programmable Pull-Up Resistor
2.2.6. Programmable Pre-emphasis
2.2.7. Programmable De-emphasis
2.2.8. Programmable Differential Output Voltage
2.2.9. Schmitt Trigger Input Buffer
4.1. Intel® Agilex™ High-Speed SERDES I/O Overview
4.2. Using LVDS SERDES Intel FPGA IP for High-Speed LVDS I/O Implementation
4.3. Intel® Agilex™ LVDS SERDES Transmitter
4.4. Intel® Agilex™ LVDS SERDES Receiver
4.5. Intel® Agilex™ LVDS Interface with External PLL Mode
4.6. LVDS SERDES IP Initialization and Reset
4.7. Intel® Agilex™ LVDS SERDES Source-Synchronous Timing Budget
4.8. LVDS SERDES IP Timing
4.9. LVDS SERDES IP Design Examples
5.1.1. VREF Sources and VREF Pins
5.1.2. I/O Standards Implementation based on VCCIO_PIO Voltages
5.1.3. OCT Calibration Block Requirement
5.1.4. Placement Requirements
5.1.5. Simultaneous Switching Noise (SSN)
5.1.6. Special Pins Requirement
5.1.7. External Memory Interface Pin Placement Requirements
5.1.8. HPS Shared I/O Requirements
5.1.9. Clocking Requirements
5.1.10. SDM Shared I/O Requirements
5.1.11. Configuration Pins
5.1.12. Unused Pins
5.1.13. Voltage Setting for Unused I/O Banks
5.1.14. Guidelines for I/O Pins in GPIO, HPS, and SDM Banks During Power Sequencing
5.1.15. Drive Strength Requirement for GPIO Input Pins
5.1.16. Maximum DC Current Restrictions
5.1.17. 1.2 V I/O Interface Voltage Level Compatibility
5.1.18. GPIO Pins for Avalon-ST Configuration Scheme
5.1.19. Maximum True Differential Signaling RX Pairs Per I/O Lane
5.1.20. I/O Simulation
4.9.3. Combined LVDS SERDES IP Transmitter and Receiver Design Example
The combined transmitter and receiver design example uses your LVDS SERDES IP parameter settings and adds a complementary transmitter or receiver interface. Both interfaces are connected to the same external PLL. You can use the design example to see how to connect the transmitter and receiver interfaces.
If your LVDS SERDES IP configuration implements a transmitter, the design example adds a DPA-FIFO receiver. If your LVDS SERDES IP configuration implements any of the receiver interfaces, the design example adds a transmitter.
Figure 84. Combined LVDS SERDES Transmitter and Receiver
Generating and Using the Design Example
To generate the combined transmitter and receiver design example from the source files, run the following command in the design example directory:
quartus_sh -t make_qii_design.tcl -system ed_synth_tx_rxThe TCL script creates a qii_ed_synth_tx_rx directory that contains the ed_synth_tx_rx.qpf project file. You can open and compile this project in the Intel® Quartus® Prime software.
For more information about make_qii_design.tcl arguments, run the following command:
quartus_sh -t make_qii_design.tcl -help