3.6. Vertical Device Migration
|1||Consider vertical device migration availability and requirements.|
|2||Refer to Intel® Agilex™ FPGA External Memory Interface Overview and the External Memory Interfaces IP - Support Center web page for information about the external memory interface (EMIF) pin pairing.|
Intel® Agilex™ devices support vertical migration within the same package, which enables you to migrate to different density devices whose dedicated input pins, configuration pins, and power pins are the same for a given package. This feature allows future upgrades or changes to your design without any changes to the board layout, because you can replace the FPGA on the board with a different density Intel® Agilex™ device.
Determine whether you want the option of migrating your design to another device density. Choose your device density and package to accommodate any possible future device migration to allow flexibility when the design nears completion. You should specify any potential migration options in the Intel® Quartus® Prime software at the beginning of your design cycle or as soon as the device migration selection is possible in the Intel® Quartus® Prime software. Selecting a migration device can impact the design’s pin placement, because the Fitter ensures your design is compatible with the selected devices. It is possible to add migration devices later in the design cycle, but it requires extra effort to check pin assignments, and can require design or board layout changes to fit into the new target device. It is easier to consider these issues early in the design cycle than at the end, when the design is near completion and ready for migration.
The Intel® Quartus® Prime Pin Planner highlights pins that change function in the migration device when compared to the currently selected device.