AN 886: Intel® Agilex™ Device Design Guidelines

ID 683634
Date 8/26/2022
Document Table of Contents

6.1.4. Temperature Sensing for Thermal Management

Table 52.  Temperature Sensing Checklist
Number Done? Checklist Item
1   Set up the temperature sensing diode (TSD) in your design to measure the device junction temperature for thermal management.
2   Include offset values form Intel® FPGA Power and Thermal Calculator calculation to TSD reading.

Intel® Agilex™ devices offers local and remote temperature sensing capabilities.

You can measure the junction temperature, TJ, with the following methods:

  • Using local Temperature Sensor by instantiating the Temperature Sensor core.
  • Using external thermal diode designed to interface with third-party sensor chip. Ensure the third-party sensor chip matches the external TSD specifications as documented in the Intel® Agilex™ Device Data Sheet.

Monitoring the actual junction temperature is crucial for thermal management. Intel® Agilex™ devices include TSD on each die with embedded analog-to-digital converter (ADC) circuitry. You can access the digital temperature readout through the Temperature Sensor IP core.

The Intel® Agilex™ TSD can self-monitor the device junction temperature and can be used with external circuitry for activities such as controlling air flow to the FPGA. This requires including the TSD circuitry by instantiating a Temperature Sensor IP core.

The flexibility in Intel® Agilex™ design can lead to non-uniform power distribution on transceiver dies. Therefore, the hotspot on the transceiver dies may not necessarily be at the TSD location. This results in a temperature difference between TSD readout and real junction temperature. Intel® FPGA Power and Thermal Calculator calculates this difference and reports an offset value for each TSD. You need to add the offset values to your TSD reading to get the actual junction temperature.

For more information about temperature sensor details, refer to Intel® Agilex™ Device Data Sheet.

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