AN 886: Intel® Agilex™ Device Design Guidelines

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ID 683634
Date 8/26/2022
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Document Table of Contents
Document Table of Contents x
1. Introduction to the Intel® Agilex™ Device Design Guidelines 2. System Specification 3. Device Selection 4. Security Considerations 5. Design Entry 6. Board and Software Considerations 7. Design Implementation, Analysis, Optimization, and Verification 8. Debugging 9. Embedded Software Design Guidelines for Intel® Agilex™ SoC FPGAs
1. Introduction to the Intel® Agilex™ Device Design Guidelines x
1.1. Design Flow 1.2. Introduction to the Intel® Agilex™ Device Design Guidelines Revision History
2. System Specification x
2.1. Design Specifications 2.2. Install Intel® Quartus® Prime Software 2.3. IP Selection 2.4. Simulation 2.5. Preparing for Design Entry 2.6. I/O Summary 2.7. Using Intel® Agilex™ HPS in your Device 2.8. System Specification Revision History
2.3. IP Selection x
2.3.1. Evaluate Available HPS IP 2.3.2. Select Soft IP and I/O Interfaces
2.3.2. Select Soft IP and I/O Interfaces x
2.3.2.1. IP Cores
2.5. Preparing for Design Entry x
2.5.1. Coding Styles and Design Recommendations 2.5.2. Platform Designer
3. Device Selection x
3.1. Device Variant 3.2. PLLs and Clock Routing 3.3. Logic, Memory, and Multiplier Density 3.4. I/O Pin Count, LVDS SERDES Channels, and Package Offering 3.5. Speed Grade 3.6. Vertical Device Migration 3.7. Device Selection Revision History
4. Security Considerations x
4.1. Security Considerations Revision History
5. Design Entry x
5.1. Design Entry for SoC Devices 5.2. Design Entry for FPGA-only Devices 5.3. EMIF Considerations 5.4. Nios® II 5.5. Transceiver Planning 5.6. Reconfiguration 5.7. Design Entry Revision History
5.1. Design Entry for SoC Devices x
5.1.1. Firewall Planning 5.1.2. Boot And Configuration Considerations 5.1.3. HPS Clocking and Reset Design Considerations 5.1.4. Reset Configuration 5.1.5. HPS Pin Multiplexing Design Considerations 5.1.6. HPS I/O Settings: Constraints and Drive Strengths 5.1.7. Design Guidelines for HPS Interfaces 5.1.8. Interfacing between the FPGA and HPS 5.1.9. Implementing the Intel® Agilex™ HPS Component
5.1.2. Boot And Configuration Considerations x
5.1.2.1. Selecting HPS Boot Options 5.1.2.2. Configuration Sources 5.1.2.3. Remote System Update (RSU)
5.1.3. HPS Clocking and Reset Design Considerations x
5.1.3.1. HPS Clock Planning 5.1.3.2. Early Pin Planning and I/O Assignment Analysis 5.1.3.3. Pin Features and Connections for HPS Clocks, Reset and PoR 5.1.3.4. Direct to Factory Pin Support for Remote System Update (RSU) Feature 5.1.3.5. Internal Clocks 5.1.3.6. HPS Peripheral Reset Management
5.1.4. Reset Configuration x
5.1.4.1. HPS Peripheral Reset Management 5.1.4.2. System Reset Considerations
5.1.7. Design Guidelines for HPS Interfaces x
5.1.7.1. Design Considerations for Selecting PHY Interfaces 5.1.7.2. USB Interface Design Guidelines 5.1.7.3. SD/MMC and eMMC Card Interface Design Guidelines 5.1.7.4. Design Guidelines for Flash Interfaces 5.1.7.5. UART Interface Design Guidelines 5.1.7.6. I2C Interface Design Guidelines
5.1.7.1. Design Considerations for Selecting PHY Interfaces x
5.1.7.1.1. HPS EMAC PHY Interfaces 5.1.7.1.2. RMII and RGMII PHY Interfaces 5.1.7.1.3. PHY Interfaces Connected Through FPGA I/O 5.1.7.1.4. Consider Device Driver Availability 5.1.7.1.5. MDIO 5.1.7.1.6. Signal Integrity GUIDELINE: Make use of the SoC device’s On-Chip Termination (OCT). GUIDELINE: Use appropriate board-level termination on PHY outputs. GUIDELINE: Ensure reflections at PHY TX_CLK and EMAC RX_CLK inputs are minimized to prevent double-clocking. GUIDELINE: Use a Signal Integrity (SI) simulation tool.
5.1.7.4. Design Guidelines for Flash Interfaces x
5.1.7.4.1. NAND Flash Interface Design Guidelines
5.1.8. Interfacing between the FPGA and HPS x
5.1.8.1. Overview of HPS Memory-Mapped Interfaces 5.1.8.2. Recommended System Topologies 5.1.8.3. Recommended Starting Point for HPS-to-FPGA Interface Designs 5.1.8.4. Information on How to Configure and Use the Bridges
5.1.8.1. Overview of HPS Memory-Mapped Interfaces x
5.1.8.1.1. HPS-to-FPGA Bridge 5.1.8.1.2. Lightweight HPS-to-FPGA Bridge 5.1.8.1.3. FPGA-to-HPS Bridge 5.1.8.1.4. Interface Bandwidths
5.1.8.2. Recommended System Topologies x
5.1.8.2.1. System Level Cache Coherency 5.1.8.2.2. HPS Accesses to FPGA Fabric 5.1.8.2.3. MPU Sharing Data with FPGA 5.1.8.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
5.2. Design Entry for FPGA-only Devices x
5.2.1. Clocking and Reset Design Considerations 5.2.2. I/O and Clock Planning
5.2.2. I/O and Clock Planning x
5.2.2.1. Making FPGA Pin Assignments 5.2.2.2. Early Pin Planning and I/O Assignment Analysis for the FPGA Device 5.2.2.3. I/O Features and Pin Connections 5.2.2.4. Clock and PLL Selection 5.2.2.5. PLL Feature Guidelines 5.2.2.6. Clock Control Features 5.2.2.7. I/O Simultaneous Switching Noise
5.2.2.3. I/O Features and Pin Connections x
5.2.2.3.1. I/O Signaling Type 5.2.2.3.2. Selectable Standards and Flexible I/O Banks 5.2.2.3.3. Dual-Purpose and Special Pin Connections 5.2.2.3.4. Intel® Agilex™ I/O Features
5.2.2.5. PLL Feature Guidelines x
5.2.2.5.1. Clock Feedback Mode 5.2.2.5.2. Clock Outputs
5.3. EMIF Considerations x
5.3.1. Memory Interfaces 5.3.2. HPS EMIF Design Considerations 5.3.3. FPGA EMIF Design Considerations
5.3.2. HPS EMIF Design Considerations x
5.3.2.1. Considerations for Connecting HPS to SDRAM 5.3.2.2. HPS EMIF I/O Locations 5.3.2.3. HPS Memory Debug
6. Board and Software Considerations x
6.1. Early System and Board Planning 6.2. Board Design Guidelines for Intel® Agilex™ SoC FPGAs 6.3. Pin Connection Considerations for Board Design 6.4. Board Considerations Revision History
6.1. Early System and Board Planning x
6.1.1. SmartVID 6.1.2. Intel® FPGA Power and Thermal Calculator 6.1.3. Thermal Management and Design 6.1.4. Temperature Sensing for Thermal Management 6.1.5. Voltage Sensor 6.1.6. Device Power-Up 6.1.7. Power Pin Connections and Power Supplies 6.1.8. Planning for Device Configuration
6.1.7. Power Pin Connections and Power Supplies x
6.1.7.1. Decoupling Capacitors 6.1.7.2. PLL Board Design Guidelines 6.1.7.3. Transceiver Board Design Guidelines
6.1.8. Planning for Device Configuration x
6.1.8.1. Device Power Cycling and Reconfiguration 6.1.8.2. Configuration Scheme Selection 6.1.8.3. Configuration Features 6.1.8.4. Intel® Quartus® Prime Configuration Settings 6.1.8.5. Configuration Pin Connections
6.1.8.2. Configuration Scheme Selection x
6.1.8.2.1. Serial Configuration Devices 6.1.8.2.2. Download Cables
6.1.8.4. Intel® Quartus® Prime Configuration Settings x
6.1.8.4.1. Optional Configuration Pins 6.1.8.4.2. Dual Purpose Configuration Pins
6.1.8.5. Configuration Pin Connections x
6.1.8.5.1. Configuration Pin Voltage Level 6.1.8.5.2. Clock Trace Signal Integrity 6.1.8.5.3. JTAG Pins 6.1.8.5.4. MSEL Configuration Mode Pins 6.1.8.5.5. Other Configuration Pins
6.2. Board Design Guidelines for Intel® Agilex™ SoC FPGAs x
6.2.1. Boundary Scan for HPS 6.2.2. Embedded Software Debugging and Trace
6.3. Pin Connection Considerations for Board Design x
6.3.1. Board-Related Intel® Quartus® Prime Settings 6.3.2. Signal Integrity Considerations 6.3.3. Board-Level Simulation and Advanced I/O Timing Analysis
6.3.1. Board-Related Intel® Quartus® Prime Settings x
6.3.1.1. Unused Pins
6.3.2. Signal Integrity Considerations x
6.3.2.1. High-Speed Board Design 6.3.2.2. Voltage Reference Pins 6.3.2.3. Simultaneous Switching Noise 6.3.2.4. I/O Termination
7. Design Implementation, Analysis, Optimization, and Verification x
7.1. Selecting a Synthesis Tool 7.2. Device Resource Utilization Reports 7.3. Intel® Quartus® Prime Messages 7.4. Timing Constraints and Analysis 7.5. Area and Timing Optimization 7.6. Preserving Performance and Reducing Compilation Time 7.7. Designing with Intel® Hyperflex™ 7.8. Simulation 7.9. Power Analysis 7.10. Power Optimization 7.11. Design Implementation, Analysis, Optimization, and Verification Revision History
7.4. Timing Constraints and Analysis x
7.4.1. Recommended Timing Optimization and Analysis Assignments
7.10. Power Optimization x
7.10.1. Device and Design Power Optimization Techniques 7.10.2. Intel® Quartus® Prime Power Optimization Techniques
7.10.1. Device and Design Power Optimization Techniques x
7.10.1.1. Device Speed Grade 7.10.1.2. Clock Power Management 7.10.1.3. Memory Power Reduction 7.10.1.4. I/O Power Guidelines
7.10.2. Intel® Quartus® Prime Power Optimization Techniques x
7.10.2.1. Power Optimization Advisor
8. Debugging x
8.1. On-Chip Debug Overview 8.2. On-Chip Debugging Tools 8.3. Debugging Revision History
8.1. On-Chip Debug Overview x
8.1.1. Planning Guidelines for Debugging Tools
9. Embedded Software Design Guidelines for Intel® Agilex™ SoC FPGAs x
9.1. Overview 9.2. Golden Hardware Reference Design (GHRD) 9.3. Define Software Requirements 9.4. Define Software Architecture 9.5. Selecting Software Tools 9.6. Choosing the Bootloader Software 9.7. Selecting an Operating System for Your Application 9.8. Assembling Your Software Development Platform for Linux* 9.9. Assembling your Software Development Platform for Partner OS or RTOS 9.10. Driver Considerations 9.11. Boot And Configuration Considerations 9.12. System Reset Considerations 9.13. Flash Considerations 9.14. Develop Application 9.15. Test and Validate 9.16. Embedded Software Design Guidelines Revision History
9.5. Selecting Software Tools x
9.5.1. Selecting Software Build Tools 9.5.2. Selecting Software Debug Tools 9.5.3. Selecting Software Trace Tools
9.7. Selecting an Operating System for Your Application x
9.7.1. Using Linux* or RTOS 9.7.2. Using the Bootloader as a Bare-Metal Framework 9.7.3. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
9.8. Assembling Your Software Development Platform for Linux* x
9.8.1. Golden System Reference Design (GSRD) for Linux* 9.8.2. Source Code Management Considerations
9.11. Boot And Configuration Considerations x
9.11.1. Configuration Sources 9.11.2. Configuration Flash 9.11.3. Configuration Clock 9.11.4. Selecting HPS Boot Options 9.11.5. HPS Boot Sources 9.11.6. Remote System Update (RSU)
9.13. Flash Considerations x
9.13.1. Flash Programming Method 9.13.2. Using a Single flash for Both FPGA Configuration and HPS Mass Storage
1. Introduction to the Intel® Agilex™ Device Design Guidelines
2. System Specification
3. Device Selection
4. Security Considerations
5. Design Entry
6. Board and Software Considerations
7. Design Implementation, Analysis, Optimization, and Verification
8. Debugging
9. Embedded Software Design Guidelines for Intel® Agilex™ SoC FPGAs

5.1.7.1.6. Signal Integrity

GUIDELINE: Make use of the SoC device’s On-Chip Termination (OCT).

Intel® Agilex™ devices can tune their outputs to many settings, with 50 ohm output impedance often being the best value. Intel® Quartus® Prime automatically uses series OCT without calibration on RGMII outputs. Check the Intel® Quartus® Prime fitter report to verify the OCT settings on the interface’s outputs.

GUIDELINE: Use appropriate board-level termination on PHY outputs.

Only a few PHYs offer I/O tuning for their outputs, so Intel® recommends that you verify the signal path to the Intel® Agilex™ device with a simulator. Place a series resistor on each signal near the PHY output pins to reduce the reflections if necessary.

GUIDELINE: Ensure reflections at PHY TX_CLK and EMAC RX_CLK inputs are minimized to prevent double-clocking.

Be cognizant if the connection is routed as a “T” as signal integrity must be maintained such that no double-edges are seen at REF_CLK loads. Ensure reflections at REF_CLK loads are minimized to prevent double-clocking.

GUIDELINE: Use a Signal Integrity (SI) simulation tool.

It is simple to run SI simulations on these unidirectional signals. These signals are almost always point-to-point, so simply determining an appropriate series resistor to place on each signal is usually sufficient. Many times, this resistor is not necessary, but the device drive strength and trace lengths as well as topology should be studied when making this determination.

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