6.1.3. Thermal Management and Design
|1||Obtain thermal design power and thermal parameters from the Intel® FPGA Power and Thermal Calculator.|
|2||Perform thermal simulation to determine a proper cooling solution.|
The Intel® Agilex™ device is a multi-chip module, depending on package configuration and design information, power distribution on all dies can be quite different. This feature makes the Intel® Agilex™ device thermal characteristics design dependent. The Intel® FPGA Power and Thermal Calculator takes into consideration of your design input, and generates unique thermal parameters for your design in the Thermal Page. You can get power consumption for each die, thermal resistance for all dies (ψJC), cooling solution requirement (ψCA), and maximum allowed package case temperature (Tcase).
The thermal analysis of the Intel® Agilex™ device requires you use a Compact Thermal Model (contact your local Intel® representatives to obtain the model) and perform simulation in a Computational Fluid Dynamics (CFD) tool. The result of the CFD analysis gives the Tcase which should be lower than the required value in the Intel® FPGA Power and Thermal Calculator Thermal Page. With the simulated Tcase, ψJC, and total package power, you can obtain the actual junction temperature Tj, which needs to stay below your requirement, for example, 95˚C. You can adjust your cooling solution (heat sink design, airflow, and so on) to optimize your thermal design.
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