Cyclone® V Device Handbook: Volume 1: Device Interfaces and Integration

ID 683375
Date 10/18/2023
Document Table of Contents

5.2. I/O Vertical Migration for Cyclone® V Devices

Figure 72. Vertical Migration Capability Across Cyclone® V Device Packages and DensitiesThe arrows indicate the vertical migration paths. The devices included in each vertical migration path are shaded. You can also migrate your design across device densities in the same package option if the devices have the same dedicated pins, configuration pins, and power pins.

You can achieve the vertical migration shaded in red if you use only up to 175 GPIOs for the M383 package, and 138 GPIOs for the U672 package. These migration paths are not shown in the Intel® Quartus® Prime software Pin Migration View.

Note: To verify the pin migration compatibility, use the Pin Migration View window in the Intel® Quartus® Prime software Pin Planner.