Intel® Cyclone® 10 GX Core Fabric and General Purpose I/Os Handbook

ID 683775
Date 10/31/2022
Document Table of Contents

10.5. Temperature Sensing Diode

The Intel® Cyclone® 10 GX temperature sensing diode (TSD) uses the characteristics of a PN junction diode to determine die temperature. Knowing the junction temperature is crucial for thermal management. You can calculate junction temperature using ambient or case temperature, junction-to-ambient (ja) or junction-to-case (jc) thermal resistance, and device power consumption.

An Intel® Cyclone® 10 GX device monitors its die temperature with the internal TSD with built-in ADC circuitry or the external TSD with an external temperature sensor. This allows you to control the air flow to the device.

Table 97.  Overview of the Internal and External Temperature Sensors
Feature Internal Sensor External TSD
Temperature sensing Uses the built-in ADC to sample the on-chip temperature Interfaces the TSD with an external temperature sensing chip
Readout access Through the Temperature Sensor Intel® FPGA IP From the external temperature sensing chip
Operation availability When the device is in user mode When the device is in user mode or off

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