10.5. Temperature Sensing Diode
The Intel® Cyclone® 10 GX temperature sensing diode (TSD) uses the characteristics of a PN junction diode to determine die temperature. Knowing the junction temperature is crucial for thermal management. You can calculate junction temperature using ambient or case temperature, junction-to-ambient (ja) or junction-to-case (jc) thermal resistance, and device power consumption.
An Intel® Cyclone® 10 GX device monitors its die temperature with the internal TSD with built-in ADC circuitry or the external TSD with an external temperature sensor. This allows you to control the air flow to the device.
|Feature||Internal Sensor||External TSD|
|Temperature sensing||Uses the built-in ADC to sample the on-chip temperature||Interfaces the TSD with an external temperature sensing chip|
|Readout access||Through the Temperature Sensor Intel® FPGA IP||From the external temperature sensing chip|
|Operation availability||When the device is in user mode||When the device is in user mode or off|
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