Intel® Cyclone® 10 GX Core Fabric and General Purpose I/Os Handbook

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ID 683775
Date 10/25/2023
Public
Document Table of Contents
Document Table of Contents x
1. Logic Array Blocks and Adaptive Logic Modules in Intel® Cyclone® 10 GX Devices 2. Embedded Memory Blocks in Intel® Cyclone® 10 GX Devices 3. Variable Precision DSP Blocks in Intel® Cyclone® 10 GX Devices 4. Clock Networks and PLLs in Intel® Cyclone® 10 GX Devices 5. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices 6. External Memory Interfaces in Intel® Cyclone® 10 GX Devices 7. Configuration, Design Security, and Remote System Upgrades in Intel® Cyclone® 10 GX Devices 8. SEU Mitigation for Intel® Cyclone® 10 GX Devices 9. JTAG Boundary-Scan Testing in Intel® Cyclone® 10 GX Devices 10. Power Management in Intel® Cyclone® 10 GX Devices
1. Logic Array Blocks and Adaptive Logic Modules in Intel® Cyclone® 10 GX Devices x
1.1. LAB 1.2. ALM Operating Modes 1.3. LAB Power Management Techniques 1.4. Logic Array Blocks and Adaptive Logic Modules in Intel® Cyclone® 10 GX Devices Revision History
1.1. LAB x
1.1.1. MLAB 1.1.2. Local and Direct Link Interconnects 1.1.3. Shared Arithmetic Chain and Carry Chain Interconnects 1.1.4. LAB Control Signals 1.1.5. ALM Resources 1.1.6. ALM Output
1.2. ALM Operating Modes x
1.2.1. Normal Mode 1.2.2. Extended LUT Mode 1.2.3. Arithmetic Mode 1.2.4. Shared Arithmetic Mode
2. Embedded Memory Blocks in Intel® Cyclone® 10 GX Devices x
2.1. Types of Embedded Memory 2.2. Embedded Memory Design Guidelines for Intel® Cyclone® 10 GX Devices 2.3. Embedded Memory Features 2.4. Embedded Memory Modes 2.5. Embedded Memory Clocking Modes 2.6. Parity Bit in Embedded Memory Blocks 2.7. Byte Enable in Embedded Memory Blocks 2.8. Memory Blocks Packed Mode Support 2.9. Memory Blocks Address Clock Enable Support 2.10. Memory Blocks Asynchronous Clear 2.11. Memory Blocks Error Correction Code Support 2.12. Embedded Memory Blocks in Intel® Cyclone® 10 GX Devices Revision History
2.1. Types of Embedded Memory x
2.1.1. Embedded Memory Capacity in Intel® Cyclone® 10 GX Devices
2.2. Embedded Memory Design Guidelines for Intel® Cyclone® 10 GX Devices x
2.2.1. Consider the Memory Block Selection 2.2.2. Guideline: Implement External Conflict Resolution 2.2.3. Guideline: Customize Read-During-Write Behavior 2.2.4. Guideline: Consider Power-Up State and Memory Initialization 2.2.5. Guideline: Control Clocking to Reduce Power Consumption
2.2.3. Guideline: Customize Read-During-Write Behavior x
2.2.3.1. Same-Port Read-During-Write Mode 2.2.3.2. Mixed-Port Read-During-Write Mode
2.4. Embedded Memory Modes x
2.4.1. Embedded Memory Configurations for Single-port Mode 2.4.2. Embedded Memory Configurations for Dual-port Modes
2.5. Embedded Memory Clocking Modes x
2.5.1. Clocking Modes for Each Memory Mode 2.5.2. Asynchronous Clears in Clocking Modes 2.5.3. Output Read Data in Simultaneous Read/Write 2.5.4. Independent Clock Enables in Clocking Modes
2.5.1. Clocking Modes for Each Memory Mode x
2.5.1.1. Single Clock Mode 2.5.1.2. Read/Write Clock Mode 2.5.1.3. Input/Output Clock Mode 2.5.1.4. Independent Clock Mode
2.7. Byte Enable in Embedded Memory Blocks x
2.7.1. Byte Enable Controls in Memory Blocks 2.7.2. Data Byte Output 2.7.3. RAM Blocks Operations
2.11. Memory Blocks Error Correction Code Support x
2.11.1. Error Correction Code Truth Table
3. Variable Precision DSP Blocks in Intel® Cyclone® 10 GX Devices x
3.1. Supported Operational Modes in Intel® Cyclone® 10 GX Devices 3.2. Resources 3.3. Design Considerations 3.4. Block Architecture 3.5. Operational Mode Descriptions 3.6. Variable Precision DSP Blocks in Intel® Cyclone® 10 GX Devices Revision History
3.1. Supported Operational Modes in Intel® Cyclone® 10 GX Devices x
3.1.1. Features
3.3. Design Considerations x
3.3.1. Operational Modes 3.3.2. Internal Coefficient and Pre-Adder for Fixed-Point Arithmetic 3.3.3. Accumulator for Fixed-Point Arithmetic 3.3.4. Chainout Adder 3.3.5. DSP Block Cascade Limit in Intel Agilex® 7 Devices
3.3.4. Chainout Adder x
3.3.4.1. Resources
3.4. Block Architecture x
3.4.1. Input Register Bank 3.4.2. Pipeline Register 3.4.3. Pre-Adder for Fixed-Point Arithmetic 3.4.4. Internal Coefficient for Fixed-Point Arithmetic 3.4.5. Multipliers 3.4.6. Adder 3.4.7. Accumulator and Chainout Adder for Fixed-Point Arithmetic 3.4.8. Systolic Registers for Fixed-Point Arithmetic 3.4.9. Double Accumulation Register for Fixed-Point Arithmetic 3.4.10. Output Register Bank
3.4.1. Input Register Bank x
3.4.1.1. Two Sets of Delay Registers for Fixed-Point Arithmetic
3.5. Operational Mode Descriptions x
3.5.1. Operational Modes for Fixed-Point Arithmetic 3.5.2. Operational Modes for Floating-Point Arithmetic
3.5.1. Operational Modes for Fixed-Point Arithmetic x
3.5.1.1. Independent Multiplier Mode 3.5.1.2. Independent Complex Multiplier 3.5.1.3. Multiplier Adder Sum Mode 3.5.1.4. 18 x 19 Multiplication Summed with 36-Bit Input Mode 3.5.1.5. Systolic FIR Mode
3.5.1.1. Independent Multiplier Mode x
3.5.1.1.1. 18 x 18 or 18 x 19 Independent Multiplier 3.5.1.1.2. 27 x 27 Independent Multiplier
3.5.1.2. Independent Complex Multiplier x
3.5.1.2.1. 18 x 19 Complex Multiplier
3.5.1.5. Systolic FIR Mode x
3.5.1.5.1. Mapping Systolic Mode User View to Variable Precision Block Architecture View 3.5.1.5.2. 18-Bit Systolic FIR Mode 3.5.1.5.3. 27-Bit Systolic FIR Mode
3.5.2. Operational Modes for Floating-Point Arithmetic x
3.5.2.1. Single Floating-Point Arithmetic Functions 3.5.2.2. Multiple Floating-Point Arithmetic Functions
3.5.2.1. Single Floating-Point Arithmetic Functions x
3.5.2.1.1. Multiplication Mode 3.5.2.1.2. Adder or Subtract Mode 3.5.2.1.3. Multiply Accumulate Mode
3.5.2.2. Multiple Floating-Point Arithmetic Functions x
3.5.2.2.1. Multiply-Add or Multiply-Subtract Mode 3.5.2.2.2. Vector One Mode 3.5.2.2.3. Vector Two Mode 3.5.2.2.4. Direct Vector Dot Product 3.5.2.2.5. Complex Multiplication
4. Clock Networks and PLLs in Intel® Cyclone® 10 GX Devices x
4.1. Clock Networks 4.2. Intel® Cyclone® 10 GX PLLs 4.3. Clock Networks and PLLs in Intel® Cyclone® 10 GX Devices Revision History
4.1. Clock Networks x
4.1.1. Clock Resources in Intel® Cyclone® 10 GX Devices 4.1.2. Hierarchical Clock Networks 4.1.3. Types of Clock Networks 4.1.4. Clock Network Sources 4.1.5. Clock Control Block 4.1.6. Clock Power Down 4.1.7. Clock Enable Signals
4.1.3. Types of Clock Networks x
4.1.3.1. Global Clock Networks 4.1.3.2. Regional Clock Networks 4.1.3.3. Periphery Clock Networks
4.1.4. Clock Network Sources x
4.1.4.1. Dedicated Clock Input Pins 4.1.4.2. Internal Logic 4.1.4.3. DPA Outputs 4.1.4.4. HSSI Clock Outputs 4.1.4.5. PLL Clock Outputs
4.1.5. Clock Control Block x
4.1.5.1. Pin Mapping in Intel® Cyclone® 10 GX Devices 4.1.5.2. GCLK Control Block 4.1.5.3. RCLK Control Block 4.1.5.4. PCLK Control Block
4.2. Intel® Cyclone® 10 GX PLLs x
4.2.1. PLL Usage 4.2.2. PLL Architecture 4.2.3. PLL Control Signals 4.2.4. Clock Feedback Modes 4.2.5. Clock Multiplication and Division 4.2.6. Programmable Phase Shift 4.2.7. Programmable Duty Cycle 4.2.8. PLL Cascading 4.2.9. Reference Clock Sources 4.2.10. Clock Switchover 4.2.11. PLL Reconfiguration and Dynamic Phase Shift
4.2.3. PLL Control Signals x
4.2.3.1. Reset 4.2.3.2. Locked
4.2.10. Clock Switchover x
4.2.10.1. Automatic Switchover 4.2.10.2. Automatic Switchover with Manual Override 4.2.10.3. Manual Clock Switchover 4.2.10.4. Guidelines
5. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices x
5.1. I/O and Differential I/O Buffers in Intel® Cyclone® 10 GX Devices 5.2. I/O Standards and Voltage Levels in Intel® Cyclone® 10 GX Devices 5.3. Intel FPGA I/O IP Cores for Intel® Cyclone® 10 GX Devices 5.4. I/O Resources in Intel® Cyclone® 10 GX Devices 5.5. Architecture and General Features of I/Os in Intel® Cyclone® 10 GX Devices 5.6. High Speed Source-Synchronous SERDES and DPA in Intel® Cyclone® 10 GX Devices 5.7. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 GX Devices 5.8. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices Revision History
5.2. I/O Standards and Voltage Levels in Intel® Cyclone® 10 GX Devices x
5.2.1. I/O Standards Support in Intel® Cyclone® 10 GX Devices 5.2.2. I/O Standards Voltage Levels in Intel® Cyclone® 10 GX Devices
5.4. I/O Resources in Intel® Cyclone® 10 GX Devices x
5.4.1. GPIO Banks, SERDES, and DPA Locations in Intel® Cyclone® 10 GX Devices 5.4.2. FPGA I/O Resources in Intel® Cyclone® 10 GX Packages 5.4.3. I/O Banks Groups in Intel® Cyclone® 10 GX Devices 5.4.4. I/O Vertical Migration for Intel® Cyclone® 10 GX Devices
5.4.4. I/O Vertical Migration for Intel® Cyclone® 10 GX Devices x
5.4.4.1. Verifying Pin Migration Compatibility
5.5. Architecture and General Features of I/Os in Intel® Cyclone® 10 GX Devices x
5.5.1. I/O Element Structure in Intel® Cyclone® 10 GX Devices 5.5.2. Features of I/O Pins in Intel® Cyclone® 10 GX Devices 5.5.3. Programmable IOE Features in Intel® Cyclone® 10 GX Devices 5.5.4. On-Chip I/O Termination in Intel® Cyclone® 10 GX Devices 5.5.5. External I/O Termination for Intel® Cyclone® 10 GX Devices
5.5.1. I/O Element Structure in Intel® Cyclone® 10 GX Devices x
5.5.1.1. I/O Bank Architecture in Intel® Cyclone® 10 GX Devices 5.5.1.2. I/O Buffer and Registers in Intel® Cyclone® 10 GX Devices
5.5.2. Features of I/O Pins in Intel® Cyclone® 10 GX Devices x
5.5.2.1. Open-Drain Output 5.5.2.2. Bus-Hold Circuitry 5.5.2.3. Weak Pull-up Resistor
5.5.3. Programmable IOE Features in Intel® Cyclone® 10 GX Devices x
5.5.3.1. Programmable Current Strength 5.5.3.2. Programmable Output Slew Rate Control 5.5.3.3. Programmable IOE Delay 5.5.3.4. Programmable Open-Drain Output 5.5.3.5. Programmable Pre-Emphasis 5.5.3.6. Programmable Differential Output Voltage
5.5.4. On-Chip I/O Termination in Intel® Cyclone® 10 GX Devices x
5.5.4.1. RS OCT without Calibration in Intel® Cyclone® 10 GX Devices 5.5.4.2. RS OCT with Calibration in Intel® Cyclone® 10 GX Devices 5.5.4.3. RT OCT with Calibration in Intel® Cyclone® 10 GX Devices 5.5.4.4. Dynamic OCT 5.5.4.5. Differential Input RD OCT 5.5.4.6. OCT Calibration Block in Intel® Cyclone® 10 GX Devices
5.5.5. External I/O Termination for Intel® Cyclone® 10 GX Devices x
5.5.5.1. Single-Ended I/O Termination 5.5.5.2. Differential I/O Termination for Intel® Cyclone® 10 GX Devices
5.5.5.2. Differential I/O Termination for Intel® Cyclone® 10 GX Devices x
5.5.5.2.1. Differential HSTL, SSTL, HSUL, and POD Termination 5.5.5.2.2. LVDS, RSDS, and Mini-LVDS Termination 5.5.5.2.3. LVPECL Termination
5.6. High Speed Source-Synchronous SERDES and DPA in Intel® Cyclone® 10 GX Devices x
5.6.1. Intel® Cyclone® 10 GX LVDS SERDES Usage Modes 5.6.2. SERDES Circuitry 5.6.3. SERDES I/O Standards Support in Intel® Cyclone® 10 GX Devices 5.6.4. Differential Transmitter in Intel® Cyclone® 10 GX Devices 5.6.5. Differential Receiver in Intel® Cyclone® 10 GX Devices 5.6.6. PLLs and Clocking for Intel® Cyclone® 10 GX Devices 5.6.7. Timing and Optimization for Intel® Cyclone® 10 GX Devices
5.6.4. Differential Transmitter in Intel® Cyclone® 10 GX Devices x
5.6.4.1. Transmitter Blocks in Intel® Cyclone® 10 GX Devices 5.6.4.2. Serializer Bypass for DDR and SDR Operations
5.6.5. Differential Receiver in Intel® Cyclone® 10 GX Devices x
5.6.5.1. Receiver Blocks in Intel® Cyclone® 10 GX Devices 5.6.5.2. Receiver Modes in Intel® Cyclone® 10 GX Devices
5.6.5.1. Receiver Blocks in Intel® Cyclone® 10 GX Devices x
5.6.5.1.1. DPA Block 5.6.5.1.2. Synchronizer 5.6.5.1.3. Data Realignment Block (Bit Slip) 5.6.5.1.4. Deserializer
5.6.5.2. Receiver Modes in Intel® Cyclone® 10 GX Devices x
5.6.5.2.1. Non-DPA Mode 5.6.5.2.2. DPA Mode 5.6.5.2.3. Soft-CDR Mode
5.6.6. PLLs and Clocking for Intel® Cyclone® 10 GX Devices x
5.6.6.1. Clocking Differential Transmitters 5.6.6.2. Clocking Differential Receivers 5.6.6.3. Guideline: LVDS Reference Clock Source 5.6.6.4. Guideline: Use PLLs in Integer PLL Mode for LVDS 5.6.6.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only 5.6.6.6. Guideline: Pin Placement for Differential Channels 5.6.6.7. LVDS Interface with External PLL Mode
5.6.6.2. Clocking Differential Receivers x
5.6.6.2.1. Guideline: Clocking DPA Interfaces Spanning Multiple I/O Banks 5.6.6.2.2. Guideline: I/O PLL Reference Clock Source for DPA or Non-DPA Receiver
5.6.6.7. LVDS Interface with External PLL Mode x
5.6.6.7.1. IOPLL IP Signal Interface with LVDS SERDES IP 5.6.6.7.2. IOPLL Parameter Values for External PLL Mode 5.6.6.7.3. Connection between IOPLL and LVDS SERDES in External PLL Mode
5.6.7. Timing and Optimization for Intel® Cyclone® 10 GX Devices x
5.6.7.1. Source-Synchronous Timing Budget
5.6.7.1. Source-Synchronous Timing Budget x
5.6.7.1.1. Differential Data Orientation 5.6.7.1.2. Differential I/O Bit Position 5.6.7.1.3. Transmitter Channel-to-Channel Skew 5.6.7.1.4. Receiver Skew Margin for Non-DPA Mode
5.7. Using the I/Os and High Speed I/Os in Intel® Cyclone® 10 GX Devices x
5.7.1. I/O and High-Speed I/O General Guidelines for Intel® Cyclone® 10 GX Devices 5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards 5.7.3. Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing 5.7.4. Guideline: Maximum DC Current Restrictions 5.7.5. Guideline: LVDS SERDES IP Core Instantiation 5.7.6. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode 5.7.7. Guideline: Minimizing High Jitter Impact on Intel® Cyclone® 10 GX GPIO Performance 5.7.8. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
5.7.1. I/O and High-Speed I/O General Guidelines for Intel® Cyclone® 10 GX Devices x
5.7.1.1. Guideline: VREF Sources and VREF Pins 5.7.1.2. Guideline: Observe Device Absolute Maximum Rating for 3.0 V Interfacing 5.7.1.3. Guideline: I/O Standards Supported for I/O PLL Reference Clock Input Pin
5.7.2. Mixing Voltage-Referenced and Non-Voltage-Referenced I/O Standards x
5.7.2.1. Non-Voltage-Referenced I/O Standards 5.7.2.2. Voltage-Referenced I/O Standards 5.7.2.3. Mixing Voltage-Referenced and Non-Voltage Referenced I/O Standards
6. External Memory Interfaces in Intel® Cyclone® 10 GX Devices x
6.1. Key Features of the Intel® Cyclone® 10 GX External Memory Interface Solution 6.2. Memory Standards Supported by Intel® Cyclone® 10 GX Devices 6.3. External Memory Interface Widths in Intel® Cyclone® 10 GX Devices 6.4. External Memory Interface I/O Pins in Intel® Cyclone® 10 GX Devices 6.5. Memory Interfaces Support in Intel® Cyclone® 10 GX Device Packages 6.6. External Memory Interface IP Support in Intel® Cyclone® 10 GX Devices 6.7. External Memory Interface Architecture of Intel® Cyclone® 10 GX Devices 6.8. External Memory Interfaces in Intel® Cyclone® 10 GX Devices Revision History
6.4. External Memory Interface I/O Pins in Intel® Cyclone® 10 GX Devices x
6.4.1. Guideline: Usage of I/O Bank 2A for External Memory Interfaces
6.5. Memory Interfaces Support in Intel® Cyclone® 10 GX Device Packages x
6.5.1. Intel® Cyclone® 10 GX Package Support for DDR3/DDR3L x40 with ECC or LPDDR3 x32 without ECC 6.5.2. Intel® Cyclone® 10 GX Package Support for DDR3/DDR3L ×72 with ECC Single and Dual-Rank
6.6. External Memory Interface IP Support in Intel® Cyclone® 10 GX Devices x
6.6.1. Ping Pong PHY IP
6.7. External Memory Interface Architecture of Intel® Cyclone® 10 GX Devices x
6.7.1. I/O Bank 6.7.2. I/O AUX
6.7.1. I/O Bank x
6.7.1.1. Hard Memory Controller 6.7.1.2. Delay-Locked Loop 6.7.1.3. Sequencer 6.7.1.4. Clock Tree 6.7.1.5. I/O Lane
6.7.1.1. Hard Memory Controller x
6.7.1.1.1. Hard Memory Controller Features 6.7.1.1.2. Main Control Path 6.7.1.1.3. Data Buffer Controller
6.7.1.5. I/O Lane x
6.7.1.5.1. DQS Logic Block
7. Configuration, Design Security, and Remote System Upgrades in Intel® Cyclone® 10 GX Devices x
7.1. Enhanced Configuration and Configuration via Protocol 7.2. Configuration Schemes 7.3. Configuration Details 7.4. Remote System Upgrades Using Active Serial Scheme 7.5. Design Security 7.6. Configuration, Design Security, and Remote System Upgrades in Intel® Cyclone® 10 GX Devices Revision History
7.2. Configuration Schemes x
7.2.1. Active Serial Configuration 7.2.2. Passive Serial Configuration 7.2.3. Fast Passive Parallel Configuration 7.2.4. JTAG Configuration
7.2.1. Active Serial Configuration x
7.2.1.1. DATA Clock (DCLK) 7.2.1.2. Active Serial Single-Device Configuration 7.2.1.3. Active Serial Multi-Device Configuration 7.2.1.4. Active Serial Configuration with Multiple EPCQ-L Devices 7.2.1.5. Using EPCQ-L Devices
7.2.1.3. Active Serial Multi-Device Configuration x
7.2.1.3.1. Pin Connections and Guidelines 7.2.1.3.2. Using Multiple Configuration Data
7.2.1.5. Using EPCQ-L Devices x
7.2.1.5.1. Controlling EPCQ-L Devices 7.2.1.5.2. Trace Length Guideline 7.2.1.5.3. Programming EPCQ-L Devices
7.2.2. Passive Serial Configuration x
7.2.2.1. Passive Serial Single-Device Configuration Using an External Host 7.2.2.2. Passive Serial Single-Device Configuration Using an Intel FPGA Download Cable 7.2.2.3. Passive Serial Multi-Device Configuration
7.2.2.3. Passive Serial Multi-Device Configuration x
7.2.2.3.1. Pin Connections and Guidelines 7.2.2.3.2. Using Multiple Configuration Data 7.2.2.3.3. Using One Configuration Data 7.2.2.3.4. Using PC Host and Download Cable
7.2.3. Fast Passive Parallel Configuration x
7.2.3.1. Fast Passive Parallel Single-Device Configuration 7.2.3.2. Fast Passive Parallel Multi-Device Configuration
7.2.3.2. Fast Passive Parallel Multi-Device Configuration x
7.2.3.2.1. Pin Connections and Guidelines 7.2.3.2.2. Using Multiple Configuration Data 7.2.3.2.3. Using One Configuration Data
7.2.4. JTAG Configuration x
7.2.4.1. JTAG Single-Device Configuration 7.2.4.2. JTAG Multi-Device Configuration
7.2.4.2. JTAG Multi-Device Configuration x
7.2.4.2.1. Pin Connections and Guidelines 7.2.4.2.2. Using a Download Cable
7.3. Configuration Details x
7.3.1. MSEL Pin Settings 7.3.2. CLKUSR 7.3.3. Configuration Sequence 7.3.4. Configuration Timing Waveforms 7.3.5. Estimating Configuration Time 7.3.6. Device Configuration Pins 7.3.7. Configuration Data Compression
7.3.3. Configuration Sequence x
7.3.3.1. Power Up 7.3.3.2. Reset 7.3.3.3. Configuration 7.3.3.4. Configuration Error Handling 7.3.3.5. Initialization 7.3.3.6. User Mode
7.3.3.3. Configuration x
7.3.3.3.1. Configuration Error Detection
7.3.4. Configuration Timing Waveforms x
7.3.4.1. FPP Configuration Timing 7.3.4.2. AS Configuration Timing 7.3.4.3. PS Configuration Timing
7.3.6. Device Configuration Pins x
7.3.6.1. I/O Standards and Drive Strength for Configuration Pins 7.3.6.2. Configuration Pin Options in the Quartus® Prime Pro Edition Software
7.3.7. Configuration Data Compression x
7.3.7.1. Enabling Compression Before Design Compilation 7.3.7.2. Enabling Compression After Design Compilation 7.3.7.3. Using Compression in Multi-Device Configuration
7.4. Remote System Upgrades Using Active Serial Scheme x
7.4.1. Configuration Images 7.4.2. Configuration Sequence in the Remote Update Mode 7.4.3. Remote System Upgrade Circuitry 7.4.4. Enabling Remote System Upgrade Circuitry 7.4.5. Remote System Upgrade Registers 7.4.6. Remote System Upgrade State Machine 7.4.7. User Watchdog Timer
7.4.5. Remote System Upgrade Registers x
7.4.5.1. Control Register 7.4.5.2. Status Register
7.5. Design Security x
7.5.1. Security Key Types 7.5.2. Security Modes 7.5.3. Intel® Cyclone® 10 GX Qcrypt Security Tool 7.5.4. Design Security Implementation Steps
7.5.2. Security Modes x
7.5.2.1. JTAG Secure Mode
8. SEU Mitigation for Intel® Cyclone® 10 GX Devices x
8.1. Mitigating Single Event Upset 8.2. Intel® Cyclone® 10 GX SEU Mitigation Techniques 8.3. CRAM Error Detection Settings Reference 8.4. Specifications 8.5. SEU Mitigation for Intel® Cyclone® 10 GX Devices Revision History
8.1. Mitigating Single Event Upset x
8.1.1. Configuration RAM 8.1.2. Embedded Memory 8.1.3. Failure Rates
8.2. Intel® Cyclone® 10 GX SEU Mitigation Techniques x
8.2.1. Mitigating SEU Effects in Configuration RAM 8.2.2. Mitigating SEU Effects in Embedded User RAM 8.2.3. Triple-Module Redundancy 8.2.4. Quartus® Prime Pro Edition Software SEU FIT Reports
8.2.1. Mitigating SEU Effects in Configuration RAM x
8.2.1.1. Error Detection Cyclic Redundancy Check 8.2.1.2. SEU Sensitivity Processing 8.2.1.3. Hierarchy Tagging 8.2.1.4. Evaluating Your System’s Response to Functional Upsets 8.2.1.5. Recovering from CRC Errors
8.2.1.1. Error Detection Cyclic Redundancy Check x
8.2.1.1.1. Column-Based and Frame-Based Check-Bits 8.2.1.1.2. Error Message Register 8.2.1.1.3. CRC_ERROR Pin Behavior
8.2.1.5. Recovering from CRC Errors x
8.2.1.5.1. Enabling Error Correction (Internal Scrubbing)
8.2.2. Mitigating SEU Effects in Embedded User RAM x
8.2.2.1. Configuring RAM to Enable ECC
8.2.4. Quartus® Prime Pro Edition Software SEU FIT Reports x
8.2.4.1. SEU FIT Parameters Report 8.2.4.2. Projected SEU FIT by Component Usage Report 8.2.4.3. Enabling the Projected SEU FIT by Component Usage Report
8.2.4.2. Projected SEU FIT by Component Usage Report x
8.2.4.2.1. Component FIT Rates 8.2.4.2.2. Raw FIT 8.2.4.2.3. Utilized FIT 8.2.4.2.4. Mitigated FIT 8.2.4.2.5. Architectural Vulnerability Factor
8.4. Specifications x
8.4.1. Error Detection Frequency 8.4.2. Error Detection Time 8.4.3. EMR Update Interval 8.4.4. Error Correction Time
9. JTAG Boundary-Scan Testing in Intel® Cyclone® 10 GX Devices x
9.1. BST Operation Control 9.2. I/O Voltage for JTAG Operation 9.3. Performing BST 9.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry 9.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing 9.6. IEEE Std. 1149.1 Boundary-Scan Register 9.7. IEEE Std. 1149.6 Boundary-Scan Register 9.8. JTAG Boundary-Scan Testing in Intel® Cyclone® 10 GX Devices Revision History
9.1. BST Operation Control x
9.1.1. IDCODE 9.1.2. Supported JTAG Instruction 9.1.3. JTAG Secure Mode 9.1.4. JTAG Private Instruction
9.6. IEEE Std. 1149.1 Boundary-Scan Register x
9.6.1. Boundary-Scan Cells of an Intel® Cyclone® 10 GX Device I/O Pin
10. Power Management in Intel® Cyclone® 10 GX Devices x
10.1. Power Consumption 10.2. Programmable Power Technology 10.3. Power Sense Line 10.4. Voltage Sensor 10.5. Temperature Sensing Diode 10.6. Power-On Reset Circuitry 10.7. Power Sequencing Considerations for Intel® Cyclone® 10 GX Devices 10.8. Power Supply Design 10.9. Power Management in Intel® Cyclone® 10 GX Devices Revision History
10.1. Power Consumption x
10.1.1. Dynamic Power Equation
10.4. Voltage Sensor x
10.4.1. Input Signal Range for External Analog Signal 10.4.2. Using Voltage Sensor in Intel® Cyclone® 10 GX Devices
10.4.1. Input Signal Range for External Analog Signal x
10.4.1.1. Unipolar Input Mode
10.4.2. Using Voltage Sensor in Intel® Cyclone® 10 GX Devices x
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access 10.4.2.2. Voltage Sensor Transfer Function
10.4.2.1. Accessing the Voltage Sensor Using FPGA Core Access x
10.4.2.1.1. Configuration Registers for the Core Access Mode 10.4.2.1.2. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is not Equal to 2'b11 10.4.2.1.3. Accessing the Voltage Sensor in the Core Access Mode when MD[1:0] is Equal to 2'b11
10.5. Temperature Sensing Diode x
10.5.1. Internal Temperature Sensing Diode 10.5.2. External Temperature Sensing Diode
10.5.1. Internal Temperature Sensing Diode x
10.5.1.1. Transfer Function for Internal TSD
10.6. Power-On Reset Circuitry x
10.6.1. Power Supplies Monitored and Not Monitored by the POR Circuitry
10.7. Power Sequencing Considerations for Intel® Cyclone® 10 GX Devices x
10.7.1. Power-Up Sequence Requirements for Intel® Cyclone® 10 GX Devices 10.7.2. Power-Down Sequence Recommendations and Requirements for Intel® Cyclone® 10 GX Devices
1. Logic Array Blocks and Adaptive Logic Modules in Intel® Cyclone® 10 GX Devices
2. Embedded Memory Blocks in Intel® Cyclone® 10 GX Devices
3. Variable Precision DSP Blocks in Intel® Cyclone® 10 GX Devices
4. Clock Networks and PLLs in Intel® Cyclone® 10 GX Devices
5. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices
6. External Memory Interfaces in Intel® Cyclone® 10 GX Devices
7. Configuration, Design Security, and Remote System Upgrades in Intel® Cyclone® 10 GX Devices
8. SEU Mitigation for Intel® Cyclone® 10 GX Devices
9. JTAG Boundary-Scan Testing in Intel® Cyclone® 10 GX Devices
10. Power Management in Intel® Cyclone® 10 GX Devices

5.8. I/O and High Speed I/O in Intel® Cyclone® 10 GX Devices Revision History

Document Version Changes
2023.10.25
  • Clarified in the Supported I/O Standards in FPGA I/O for Intel® Cyclone® 10 GX Devices table that SSTL- 12, SSTL -12 Class I and Class II are supportable for 3V I/O buffer type.
  • Updated the Guideline: Pin Placement for Differential Channels chapter for better clarity.
  • Clarified in the OCT Schemes Supported in Intel® Cyclone® 10 GX Devices table that Dynamic Rs and Rt OCT are not supportable for 3V I/O type.
2022.10.31
  • Added LVDS, RSDS, mini-LVDS, Differential POD12, and LVPECL to the list of I/O standards that support programmable I/O delay.
2022.09.29
  • Updated the outclk2 and outclk4 phase shift values in the topic listing the IOPLL parameter values for external PLL mode.
  • Added .qsf assignment information for on-chip differential I/O termination.
2022.08.03 Replaced the Guideline: Do Not Drive I/O Pins During Power Sequencing topic with the Guideline: Maximum Current Driving I/O Pins While Turned Off and During Power Sequencing topic.
2021.08.13 Updated the table that lists the SERDES transmitter I/O standards support to remove all previously listed I/O standards except True LVDS, mini-LVDS, and RSDS.
2019.12.27
  • Updated the programmable pre-emphasis diagram to remove the word "peak-peak".
  • Updated the pin placement guidelines for differential channels to clarify that the I/O bank PLL can drive transmitter channels in an adjacent I/O bank only in a wide transmitter interface that spans multiple I/O banks.
2019.05.07 Added a topic that provides a usage modes summary of the Intel® Cyclone® 10 GX LVDS SERDES.
2019.01.07
  • Updated I/O resource count for package F672 of the 10CX085 device.
  • Removed the MultiVolt I/O Interface in Intel® Cyclone® 10 GX Devices topic.
  • Updated the I/O Standards Voltage Levels in Intel® Cyclone® 10 GX Devices topic to add information about interfacing with systems of different voltages.
  • Removed statement that says that the programmable VOD value of "0" is not available for the LVDS I/O standard.
  • Removed ext_loaden signal in figures showing the LVDS receiver in soft-CDR mode.
  • Specified that connecting the IOPLL loaden signal to the LVDS receiver ext_loaden signal is not required for LVDS receivers in soft-CDR mode.
2018.02.02
  • In the topic about programmable open-drain output, changed the statement "logic-to-pin" to "logic to the output buffer".
  • Updated the number of pins in I/O banks 2J and 3A of package F672 of the 10CX085 device.
  • Removed the RSKM calculation example.
  • Updated the figure titles in the topic about LVPECL termination to clarify that the figures refer to external termination. There is no OCT support for LVPECL I/O standard.
  • Updated the guideline topic about pin placement for differential channels to clarify the following information:
    • In I/O banks used for differential receiver, the PLL can drive only the channels within the same I/O bank.
    • Unused pins within an I/O bank with the DPA feature enabled can be assigned to single ended I/O standards.
  • Clarified in the topic about I/O buffer and register that to utilize the I/O registers when implementing DDR circuitry, use the GPIO IP core.
  • Clarified that all singled-ended I/O assigned to the 3 V I/O bank supports all programmable I/O elements except programmable pre-emphasis, RD OCT, calibrated RS and RT OCT, and internal VREF generation.
  • Clarified that the 3 V I/O bank supports single-ended and differential SSTL, HSTL, and HSUL I/O standards.
  • Updated the topic about I/O and differential I/O buffers to specify that differential reference clock is supported for the I/O PLL that drives the SERDES.
  • Updated the guideline topic about VREF sources and VREF pins to specify that the VREF pins are dedicated for voltage-referenced signal-ended I/O standards.
Date Version Changes
November 2017 2017.11.10
  • Updated the note about driving LVDS channels with the PLL in integer PLL mode to clarify that you do not need a PLL if you bypass the SERDES.
  • Updated the topic about the serializer bypass for DDR and SDR operation to add more information about clocks to the IOE.
  • Updated the topic about the deserializer to add more information about bypassing the deserializer.
  • Removed the statement about SDR and DDR data width from the figures that show the receiver datapath in non-DPA, DPA, and soft-CDR modes.
  • Corrected typographical error in the example showing the parameter values to generate output clock in external PLL mode by updating "c0" to "outclk0".
  • Removed the note about the migration paths in the I/O Vertical Migration for Intel® Cyclone® 10 GX Devices.
  • Updated Differential SSTL-18 Class I and Class II, Differential SSTL-15 Class I and Class II, Differential SSTL-12 Class I and Class II , Differential 1.8 V HSTL Class I and Class II, Differential 1.5 V HSTL Class I and Class II, and Differential 1.2 V HSTL Class I and Class II I/O standards in Programmable Current Strength Settings for Intel® Cyclone® 10 GX table.
  • Added SSTL-12, SSTL-125, SSTL135, Differential SSTL-12, Differential SSTL-125, and Differential SSTL-135 I/O standards into Supported I/O Standards in FPGA I/O for Intel® Cyclone® 10 GX Devices and Intel® Cyclone® 10 GX I/O Standards Voltage Levels tables.
  • Removed DDR3 OCT Setting from Programmable Current Strength Settings for Intel® Cyclone® 10 GX Devices table and added a note to refer to On-Chip I/O Termination in Intel® Cyclone® 10 GX Devices section for I/O standards with DDR3 OCT Setting.
  • Updated programmable current strength values for SSTL-18 Class II and SSTL-15 Class II I/O standard in Programmable Current Strength Settings for Intel® Cyclone® 10 GX table.
  • Removed the note about 0.15mm package height difference between devices in the same package type in the I/O Vertical Migration for Intel® Cyclone® 10 GX Devices.
  • Removed the note about LVDS I/O bank assignment when using external memory devices more than 450MHz frequency in the I/O Vertical Migration for Intel® Cyclone® 10 GX Devices.
  • Removed RSKM Report for LVDS Receiver and Assigning Input Delay to LVDS Receiver Using TimeQuest Timing Analyzer chapters.
  • Added Guidelines: LVDS Reference Clock Source chapter.
  • Removed the statement about selecting the rising edge option in the parameter editor for the RX Non-DPA mode.
  • Removed LVDS Interface with the IOPLL IP Core for Transmitter Channels Spanning Multiple Banks Shared with Receiver Channels (DPA) Using Shared I/O PLL and LVDS Interface with the IOPLL IP Core for Transmitter Channels Spanning Multiple Banks Shared with Receiver Channels (With Soft-CDR Mode) Using Shared I/O PLL diagrams in Connection between IOPLL and LVDS SERDES in External PLL Mode chapter.
  • Updated Non-DPA LVDS Receiver Interface with IOPLL IP Core in External PLL Mode, DPA LVDS Receiver Interface with the IOPLL IP Core in External PLL Mode, Soft-CDR LVDS Receiver Interface with the IOPLL IP Core in External PLL Mode, and LVDS Transmitter Interface with the IOPLL IP Core in External PLL Mode diagrams in Connection between IOPLL and LVDS SERDES in External PLL Mode.
  • Rewrote the PLLs Driving DPA-Enabled Differential Receiver and Transmitter Channels in LVDS Interface Spanning Multiple I/O Banks guideline topic .
May 2017 2017.05.08 Initial release.
Level Two Title