Intel® Cyclone® 10 GX Core Fabric and General Purpose I/Os Handbook

ID 683775
Date 10/25/2023
Public
Document Table of Contents

5.4.3. I/O Banks Groups in Intel® Cyclone® 10 GX Devices

The I/O pins in Intel® Cyclone® 10 GX devices are arranged in groups called modular I/O banks:

  • Modular I/O banks have independent supplies that allow each bank to support different I/O standards.
  • Each modular I/O bank can support multiple I/O standards that use the same voltage.

The following tables list the I/O banks available, the total number of I/O pins in each bank, and the total number of I/O pins for each Intel® Cyclone® 10 GX product line and device package.

Table 36.  Modular I/O Banks for 10CX085 and 10CX105 Devices
Product Line 10CX085 10CX105
Package U484 F672 U484 F672 F780
3 V I/O Bank 2L 48 48 48 48 48
LVDS I/O Bank 2K 48 48 48 48 48
2J 48 48 48 48 48
2A 44 48 44 48 48
3B 48
3A 24 44 44
Total 188 216 188 236 284
Table 37.  Modular I/O Banks for 10CX150 and 10CX220 Devices
Product Line 10CX150 10CX220
Package U484 F672 F780 U484 F672 F780
3 V I/O Bank 2L 48 48 48 48 48 48
LVDS I/O Bank 2K 48 48 48 48 48 48
2J 48 48 48 48 48 48
2A 44 48 48 44 48 48
3B 48 48
3A 44 44 44 44
Total 188 236 284 188 236 284