External Memory Interfaces Intel® Agilex™ FPGA IP User Guide

ID 683216
Date 3/28/2022
Public

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7.3.3.1. Intel® Agilex™ FPGA EMIF IP Banks

Before you select pins for your Intel® Agilex™ FPGA external memory interface, it is important that you understand how banks and sub-banks are grouped together to form a single interface.

The following diagram illustrates a typical Intel® Agilex™ FPGA with all banks bonded out to pins.

Figure 114. Typical Intel® Agilex™ FPGA with all Banks Bonded Out

In the above diagram, the group of 4 lanes in the top-left corner (the top sub-bank in bank 3A), denotes the IO48 block that is used for test mode and AVST configuration. If all I/O lanes in this sub-bank are used for configuration, then this bank cannot be used for the external memory interface. Similarly, the bottom sub-bank in bank 3A could not be used for the external memory interface either, because all the I/O sub-banks in a given interface must be contiguous.

The red line in the above diagram denotes the chaining order of the sub-banks to form an external memory interface. The chaining order flips when crossing the zipper.

For additional details, refer to the Intel® Agilex™ FPGA EMIF IP Product Architecture chapter.

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