Intel® Stratix® 10 High-Speed LVDS I/O User Guide

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ID 683792
Date 11/30/2022
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Document Table of Contents
Document Table of Contents x
1. Intel® Stratix® 10 High-Speed LVDS I/O Overview 2. Intel® Stratix® 10 High-Speed LVDS I/O Architecture and Features 3. Stratix 10 High-Speed LVDS I/O Design Considerations 4. Intel® Stratix® 10 High-Speed LVDS I/O Implementation Guides 5. LVDS SERDES Intel® FPGA IP References 6. Intel® Stratix® 10 High-Speed LVDS I/O User Guide Archives 7. Document Revision History for the Intel® Stratix® 10 High-Speed LVDS I/O User Guide
1. Intel® Stratix® 10 High-Speed LVDS I/O Overview x
1.1. Intel® Stratix® 10 LVDS SERDES Usage Modes 1.2. Intel® Stratix® 10 LVDS Channels Support 1.3. Intel® Stratix® 10 GPIO Banks, SERDES, and DPA Locations
2. Intel® Stratix® 10 High-Speed LVDS I/O Architecture and Features x
2.1. Intel® Stratix® 10 LVDS SERDES I/O Standards Support 2.2. LVDS Transmitter Programmable I/O Features 2.3. SERDES Circuitry 2.4. Differential Transmitter in Intel® Stratix® 10 Devices 2.5. Differential Receiver in Intel® Stratix® 10 Devices
2.2. LVDS Transmitter Programmable I/O Features x
2.2.1. Programmable Pre-Emphasis 2.2.2. Programmable Differential Output Voltage
2.4. Differential Transmitter in Intel® Stratix® 10 Devices x
2.4.1. Transmitter Blocks in Intel® Stratix® 10 Devices 2.4.2. Serializer Bypass for DDR and SDR Operations
2.5. Differential Receiver in Intel® Stratix® 10 Devices x
2.5.1. Receiver Blocks in Intel® Stratix® 10 Devices 2.5.2. Receiver Modes in Intel® Stratix® 10 Devices
2.5.1. Receiver Blocks in Intel® Stratix® 10 Devices x
2.5.1.1. DPA Block 2.5.1.2. Synchronizer 2.5.1.3. Data Realignment Block (Bit Slip) 2.5.1.4. Deserializer
2.5.2. Receiver Modes in Intel® Stratix® 10 Devices x
2.5.2.1. Non-DPA Mode 2.5.2.2. DPA Mode 2.5.2.3. Soft-CDR Mode
3. Stratix 10 High-Speed LVDS I/O Design Considerations x
3.1. PLLs and Clocking for Intel® Stratix® 10 Devices 3.2. Source-Synchronous Timing Budget 3.3. Guideline: LVDS SERDES IP Core Instantiation 3.4. Guideline: LVDS SERDES Pin Pairs for Soft-CDR Mode 3.5. Guideline: LVDS Transmitters and Receivers in the Same I/O Bank 3.6. Guideline: LVDS SERDES Limitation for Intel® Stratix® 10 GX 400, SX 400, and TX 400
3.1. PLLs and Clocking for Intel® Stratix® 10 Devices x
3.1.1. Clocking Differential Transmitters 3.1.2. Clocking Differential Receivers 3.1.3. Guideline: LVDS Reference Clock Source 3.1.4. Guideline: Use PLLs in Integer PLL Mode for LVDS 3.1.5. Guideline: Use High-Speed Clock from PLL to Clock LVDS SERDES Only 3.1.6. Guideline: Pin Placement for Differential Channels 3.1.7. LVDS Interface with External PLL Mode
3.1.6. Guideline: Pin Placement for Differential Channels x
3.1.6.1. PLLs Driving Differential Transmitter Channels 3.1.6.2. PLLs Driving DPA-Enabled Differential Receiver Channels 3.1.6.3. PLLs Driving DPA-Enabled Differential Receiver and Transmitter Channels in LVDS Interface Spanning Multiple I/O Banks
3.1.7. LVDS Interface with External PLL Mode x
3.1.7.1. IOPLL IP Signal Interface with LVDS SERDES IP 3.1.7.2. IOPLL Parameter Values for External PLL Mode 3.1.7.3. Connection between IOPLL IP and LVDS SERDES IP in External PLL Mode
3.2. Source-Synchronous Timing Budget x
3.2.1. Differential Data Orientation 3.2.2. Differential I/O Bit Position 3.2.3. Transmitter Channel-to-Channel Skew 3.2.4. Receiver Skew Margin for Non-DPA Mode
3.2.2. Differential I/O Bit Position x
3.2.2.1. Differential Bit Naming Conventions
3.2.4. Receiver Skew Margin for Non-DPA Mode x
3.2.4.1. RSKM Equation 3.2.4.2. Example: RSKM Calculation
3.5. Guideline: LVDS Transmitters and Receivers in the Same I/O Bank x
3.5.1. Using the Duplex Feature 3.5.2. Using an External PLL
4. Intel® Stratix® 10 High-Speed LVDS I/O Implementation Guides x
4.1. LVDS SERDES Intel® FPGA IP 4.2. LVDS SERDES IP Initialization and Reset 4.3. LVDS SERDES Intel® FPGA IP Timing 4.4. LVDS SERDES Intel® FPGA IP Design Examples 4.5. IP Migration Flow for Arria® V, Cyclone® V, and Stratix® V Devices
4.1. LVDS SERDES Intel® FPGA IP x
4.1.1. Release Information 4.1.2. LVDS SERDES Intel® FPGA IP Features 4.1.3. LVDS SERDES IP Core Functional Modes 4.1.4. LVDS SERDES IP Core Functional Description
4.1.4. LVDS SERDES IP Core Functional Description x
4.1.4.1. Serializer 4.1.4.2. DPA FIFO 4.1.4.3. Bitslip 4.1.4.4. Deserializer 4.1.4.5. Clock Phase Alignment
4.2. LVDS SERDES IP Initialization and Reset x
4.2.1. Initializing the LVDS SERDES IP in Non-DPA Mode 4.2.2. Initializing the LVDS SERDES IP in DPA Mode 4.2.3. Resetting the DPA 4.2.4. Word Boundaries Alignment
4.2.4. Word Boundaries Alignment x
4.2.4.1. Aligning Word Boundaries
4.3. LVDS SERDES Intel® FPGA IP Timing x
4.3.1. I/O Timing Analysis 4.3.2. FPGA Timing Analysis 4.3.3. Timing Analysis for the External PLL Mode 4.3.4. Timing Closure Guidelines for Internal FPGA Paths 4.3.5. Guideline: Use Clock Phase Alignment Block to Improve Timing Closure
4.3.1. I/O Timing Analysis x
4.3.1.1. Obtaining RSKM Report 4.3.1.2. Obtaining TCCS Report
4.4. LVDS SERDES Intel® FPGA IP Design Examples x
4.4.1. LVDS SERDES IP Synthesizable Intel® Quartus® Prime Design Examples 4.4.2. LVDS SERDES IP Simulation Design Example 4.4.3. Combined LVDS SERDES IP Transmitter and Receiver Design Example 4.4.4. LVDS SERDES IP Dynamic Phase Shift Design Example
4.5. IP Migration Flow for Arria® V, Cyclone® V, and Stratix® V Devices x
4.5.1. Migrating Your ALTLVDS_TX and ALTLVDS_RX IP Cores
5. LVDS SERDES Intel® FPGA IP References x
5.1. LVDS SERDES Intel® FPGA IP Parameter Settings 5.2. LVDS SERDES Intel® FPGA IP Signals 5.3. Comparison of LVDS SERDES Intel® FPGA IP with Stratix® V SERDES
5.1. LVDS SERDES Intel® FPGA IP Parameter Settings x
5.1.1. LVDS SERDES Intel® FPGA IP General Settings 5.1.2. LVDS SERDES Intel® FPGA IP PLL Settings 5.1.3. LVDS SERDES Intel® FPGA IP Receiver Settings 5.1.4. LVDS SERDES Intel® FPGA IP Transmitter Settings 5.1.5. LVDS SERDES IP Core Clock Resource Summary
5.1.3. LVDS SERDES Intel® FPGA IP Receiver Settings x
5.1.3.1. Receiver Input Clock Parameters Setup
5.1.4. LVDS SERDES Intel® FPGA IP Transmitter Settings x
5.1.4.1. Setting the Transmitter Output Clock Parameters
1. Intel® Stratix® 10 High-Speed LVDS I/O Overview
2. Intel® Stratix® 10 High-Speed LVDS I/O Architecture and Features
3. Stratix 10 High-Speed LVDS I/O Design Considerations
4. Intel® Stratix® 10 High-Speed LVDS I/O Implementation Guides
5. LVDS SERDES Intel® FPGA IP References
6. Intel® Stratix® 10 High-Speed LVDS I/O User Guide Archives
7. Document Revision History for the Intel® Stratix® 10 High-Speed LVDS I/O User Guide

3.1.2. Clocking Differential Receivers

The I/O PLL receives the external clock input and generates different phases of the same clock. The DPA block automatically chooses one of the clocks from the I/O PLL and aligns the incoming data on each channel.

The synchronizer circuit is a 1-bit wide by 6-bit deep FIFO buffer that compensates for any phase difference between the DPA clock and the data realignment block. If necessary, the user-controlled data realignment circuitry inserts a single bit of latency in the serial bit stream to align to the word boundary. The deserializer includes shift registers and parallel load registers, and sends a maximum of 10 bits to the internal logic.

The physical medium connecting the transmitter and receiver LVDS channels may introduce skew between the serial data and the source-synchronous clock. The instantaneous skew between each LVDS channel and the clock also varies with the jitter on the data and clock signals as seen by the receiver. The three different modes—non-DPA, DPA, and soft-CDR—provide different options to overcome skew between the source synchronous clock (non-DPA, DPA) /reference clock (soft-CDR) and the serial data.

Non-DPA mode allows you to statically select the optimal phase between the source synchronous clock and the received serial data to compensate skew. In DPA mode, the DPA circuitry automatically chooses the best phase to compensate for the skew between the source synchronous clock and the received serial data. Soft-CDR mode provides opportunities for synchronous and asynchronous applications for chip-to-chip and short reach board-to-board applications for SGMII protocols.

Note: Only the non-DPA mode requires manual skew adjustment.
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