Stratix® V Device Handbook: Volume 1: Device Interfaces and Integration
ID
683665
Date
10/18/2023
Public
1. Logic Array Blocks and Adaptive Logic Modules in Stratix V Devices
2. Embedded Memory Blocks in Stratix V Devices
3. Variable Precision DSP Blocks in Stratix V Devices
4. Clock Networks and PLLs in Stratix V Devices
5. I/O Features in Stratix V Devices
6. High-Speed Differential I/O Interfaces and DPA in Stratix® V Devices
7. External Memory Interfaces in Stratix V Devices
8. Configuration, Design Security, and Remote System Upgrades in Stratix V Devices
9. SEU Mitigation for Stratix V Devices
10. JTAG Boundary-Scan Testing in Stratix V Devices
11. Power Management in Stratix V Devices
2.1. Types of Embedded Memory
2.2. Embedded Memory Design Guidelines for Stratix V Devices
2.3. Embedded Memory Features
2.4. Embedded Memory Modes
2.5. Embedded Memory Clocking Modes
2.6. Parity Bit in Memory Blocks
2.7. Byte Enable in Embedded Memory Blocks
2.8. Memory Blocks Packed Mode Support
2.9. Memory Blocks Address Clock Enable Support
2.10. Memory Blocks Asynchronous Clear
2.11. Memory Blocks Error Correction Code Support
2.12. Embedded Memory Blocks in Stratix V Devices Revision History
4.2.1. PLL Physical Counters in Stratix V Devices
4.2.2. PLL Locations in Stratix® V Devices
4.2.3. PLL Migration Guidelines
4.2.4. Fractional PLL Architecture
4.2.5. PLL Cascading
4.2.6. PLL External Clock I/O Pins
4.2.7. PLL Control Signals
4.2.8. Clock Feedback Modes
4.2.9. Clock Multiplication and Division
4.2.10. Programmable Phase Shift
4.2.11. Programmable Duty Cycle
4.2.12. Clock Switchover
4.2.13. PLL Reconfiguration and Dynamic Phase Shift
5.1. I/O Standards Support in Stratix V Devices
5.2. I/O Design Guidelines for Stratix V Devices
5.3. I/O Banks in Stratix® V Devices
5.4. I/O Banks Groups in Stratix V Devices
5.5. I/O Element Structure in Stratix V Devices
5.6. Programmable IOE Features in Stratix® V Devices
5.7. On-Chip I/O Termination in Stratix® V Devices
5.8. I/O Termination Schemes for Stratix® V Devices
5.9. I/O Features in Stratix V Devices Revision History
5.6.1. Programmable Current Strength
5.6.2. Programmable Output Slew Rate Control
5.6.3. Programmable IOE Delay
5.6.4. Programmable Output Buffer Delay
5.6.5. Programmable Pre-Emphasis
5.6.6. Programmable Differential Output Voltage
5.6.7. Open-Drain Output
5.6.8. Bus-Hold Circuitry
5.6.9. Pull-up Resistor
5.7.1. RS OCT without Calibration in Stratix® V Devices
5.7.2. RS OCT with Calibration in Stratix® V Devices
5.7.3. RT OCT with Calibration in Stratix® V Devices
5.7.4. Dynamic OCT in Stratix® V Devices
5.7.5. LVDS Input RD OCT in Stratix V Devices
5.7.6. OCT Calibration Block in Stratix V Devices
5.7.7. OCT Calibration in Power-Up Mode
5.7.8. OCT Calibration in User Mode
6.1. Dedicated High-Speed Circuitries in Stratix® V Devices
6.2. High-Speed I/O Design Guidelines for Stratix® V Devices
6.3. Differential Transmitter in Stratix V Devices
6.4. Differential Receiver in Stratix V Devices
6.5. Source-Synchronous Timing Budget
6.6. High-Speed Differential I/O Interfaces and DPA in Stratix® V Devices Revision History
7.3.1. UniPHY IP
7.3.2. External Memory Interface Datapath
7.3.3. DQS Phase-Shift Circuitry
7.3.4. Phase Offset Control
7.3.5. PHY Clock (PHYCLK) Networks
7.3.6. DQS Logic Block
7.3.7. Leveling Circuitry
7.3.8. Dynamic OCT Control
7.3.9. IOE Registers
7.3.10. Delay Chains
7.3.11. I/O and DQS Configuration Blocks
8.1. Enhanced Configuration and Configuration via Protocol
8.2. MSEL Pin Settings
8.3. Configuration Sequence
8.4. Configuration Timing Waveforms
8.5. Device Configuration Pins
8.6. Fast Passive Parallel Configuration
8.7. Active Serial Configuration
8.8. Using EPCS and EPCQ Devices
8.9. Passive Serial Configuration
8.10. JTAG Configuration
8.11. Configuration Data Compression
8.12. Remote System Upgrades
8.13. Design Security
8.14. Configuration, Design Security, and Remote System Upgrades in Stratix V Devices Revision History
10.1. BST Operation Control
10.2. I/O Voltage for JTAG Operation
10.3. Performing BST
10.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry
10.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing
10.6. IEEE Std. 1149.1 Boundary-Scan Register
10.7. IEEE Std. 1149.6 Boundary-Scan Register
10.8. JTAG Boundary-Scan Testing inStratix V Devices Revision History
8.3.6. User Mode
You can enable the optional INIT_DONE pin to monitor the initialization stage. After the INIT_DONE pin is pulled high, initialization completes and your design starts executing. The user I/O pins will then function as specified by your design.
During device initialization stage, the FPGA registers, core logic, and I/O are not released from reset at the same time. The increase in clock frequency, device size, and design complexity require a reset strategy that considers the differences in the release from reset. Intel® recommends that you use the following implementations to reset your design properly and until the device has fully entered user mode:
- Hold the entire design in reset for a period of time by following the CONF_DONE high to user mode (tCD2UM) or CONF_DONE high to user mode with CLKUSR option turned on (tCD2UMC) specifications as defined in the Stratix® V Device Datasheet before starting any operation after the device enters into user mode. For example, the tCD2UM range for Stratix® V device is between 175 us to 437 us.
- If you have an external device that reacts based on an Intel® FPGA output pin, perform the following steps to avoid false reaction:
- Ensure that the external device ignores the state of the FPGA output pin until the external INIT_DONE pin goes high. Refer to the tCD2UM or tCD2UMC specifications in the Stratix® V Device Datasheet for more information.
- Keep the input state to the external device constant by using the external logic until the external INIT_DONE pin goes high.