Stratix® V Device Handbook: Volume 1: Device Interfaces and Integration
ID
683665
Date
10/18/2023
Public
1. Logic Array Blocks and Adaptive Logic Modules in Stratix V Devices
2. Embedded Memory Blocks in Stratix V Devices
3. Variable Precision DSP Blocks in Stratix V Devices
4. Clock Networks and PLLs in Stratix V Devices
5. I/O Features in Stratix V Devices
6. High-Speed Differential I/O Interfaces and DPA in Stratix® V Devices
7. External Memory Interfaces in Stratix V Devices
8. Configuration, Design Security, and Remote System Upgrades in Stratix V Devices
9. SEU Mitigation for Stratix V Devices
10. JTAG Boundary-Scan Testing in Stratix V Devices
11. Power Management in Stratix V Devices
2.1. Types of Embedded Memory
2.2. Embedded Memory Design Guidelines for Stratix V Devices
2.3. Embedded Memory Features
2.4. Embedded Memory Modes
2.5. Embedded Memory Clocking Modes
2.6. Parity Bit in Memory Blocks
2.7. Byte Enable in Embedded Memory Blocks
2.8. Memory Blocks Packed Mode Support
2.9. Memory Blocks Address Clock Enable Support
2.10. Memory Blocks Asynchronous Clear
2.11. Memory Blocks Error Correction Code Support
2.12. Embedded Memory Blocks in Stratix V Devices Revision History
4.2.1. PLL Physical Counters in Stratix V Devices
4.2.2. PLL Locations in Stratix® V Devices
4.2.3. PLL Migration Guidelines
4.2.4. Fractional PLL Architecture
4.2.5. PLL Cascading
PLL-to-PLL Cascading
Counter-Output-to-Counter-Output Cascading
4.2.6. PLL External Clock I/O Pins
4.2.7. PLL Control Signals
4.2.8. Clock Feedback Modes
4.2.9. Clock Multiplication and Division
4.2.10. Programmable Phase Shift
4.2.11. Programmable Duty Cycle
4.2.12. Clock Switchover
4.2.13. PLL Reconfiguration and Dynamic Phase Shift
5.1. I/O Standards Support in Stratix V Devices
5.2. I/O Design Guidelines for Stratix V Devices
5.3. I/O Banks in Stratix® V Devices
5.4. I/O Banks Groups in Stratix V Devices
5.5. I/O Element Structure in Stratix V Devices
5.6. Programmable IOE Features in Stratix® V Devices
5.7. On-Chip I/O Termination in Stratix® V Devices
5.8. I/O Termination Schemes for Stratix® V Devices
5.9. I/O Features in Stratix V Devices Revision History
5.6.1. Programmable Current Strength
5.6.2. Programmable Output Slew Rate Control
5.6.3. Programmable IOE Delay
5.6.4. Programmable Output Buffer Delay
5.6.5. Programmable Pre-Emphasis
5.6.6. Programmable Differential Output Voltage
5.6.7. Open-Drain Output
5.6.8. Bus-Hold Circuitry
5.6.9. Pull-up Resistor
5.7.1. RS OCT without Calibration in Stratix® V Devices
5.7.2. RS OCT with Calibration in Stratix® V Devices
5.7.3. RT OCT with Calibration in Stratix® V Devices
5.7.4. Dynamic OCT in Stratix® V Devices
5.7.5. LVDS Input RD OCT in Stratix V Devices
5.7.6. OCT Calibration Block in Stratix V Devices
5.7.7. OCT Calibration in Power-Up Mode
5.7.8. OCT Calibration in User Mode
6.1. Dedicated High-Speed Circuitries in Stratix® V Devices
6.2. High-Speed I/O Design Guidelines for Stratix® V Devices
6.3. Differential Transmitter in Stratix V Devices
6.4. Differential Receiver in Stratix V Devices
6.5. Source-Synchronous Timing Budget
6.6. High-Speed Differential I/O Interfaces and DPA in Stratix® V Devices Revision History
7.3.1. UniPHY IP
7.3.2. External Memory Interface Datapath
7.3.3. DQS Phase-Shift Circuitry
7.3.4. Phase Offset Control
7.3.5. PHY Clock (PHYCLK) Networks
7.3.6. DQS Logic Block
7.3.7. Leveling Circuitry
7.3.8. Dynamic OCT Control
7.3.9. IOE Registers
7.3.10. Delay Chains
7.3.11. I/O and DQS Configuration Blocks
8.1. Enhanced Configuration and Configuration via Protocol
8.2. MSEL Pin Settings
8.3. Configuration Sequence
8.4. Configuration Timing Waveforms
8.5. Device Configuration Pins
8.6. Fast Passive Parallel Configuration
8.7. Active Serial Configuration
8.8. Using EPCS and EPCQ Devices
8.9. Passive Serial Configuration
8.10. JTAG Configuration
8.11. Configuration Data Compression
8.12. Remote System Upgrades
8.13. Design Security
8.14. Configuration, Design Security, and Remote System Upgrades in Stratix V Devices Revision History
10.1. BST Operation Control
10.2. I/O Voltage for JTAG Operation
10.3. Performing BST
10.4. Enabling and Disabling IEEE Std. 1149.1 BST Circuitry
10.5. Guidelines for IEEE Std. 1149.1 Boundary-Scan Testing
10.6. IEEE Std. 1149.1 Boundary-Scan Register
10.7. IEEE Std. 1149.6 Boundary-Scan Register
10.8. JTAG Boundary-Scan Testing inStratix V Devices Revision History
4.2.5. PLL Cascading
Stratix® V devices support two types of PLL cascading.
PLL-to-PLL Cascading
This cascading mode synthesizes a more precise output frequency than a single PLL in integer mode. Cascading two PLLs in integer mode expands the effective range of the pre-scale counter, N and the multiply counter, M.
Stratix® V devices use two types of input clock sources.
- The adjpllin input clock source is used for inter-cascading between fracturable fractional PLLs.
- The cclk input clock source is used for intra-cascading within fracturable fractional PLLs.
Altera recommends using a low bandwidth setting for the source (upstream) PLL and a high bandwidth setting for destination (downstream) PLL.
Counter-Output-to-Counter-Output Cascading
This cascading mode synthesizes a lower frequency output than a single post-scale counter, C. Cascading two C counters expands the effective range of C counters.