AN 763: Intel® Arria® 10 SoC Device Design Guidelines

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ID 683192
Date 5/17/2022
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Document Table of Contents
Document Table of Contents x
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs 2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA 3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs 4. Board Design Guidelines for Arria 10 SoC FPGAs 5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs x
1.1. SoC FPGA Designer's Checklist 1.2. Overview of HPS Design Guidelines for SoC FPGA design 1.3. Overview of Board Design Guidelines for SoC FPGA Design 1.4. Overview of Embedded Software Design Guidelines for SoC FPGA Design 1.5. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA x
2.1. Overview of HPS Memory-Mapped Interfaces 2.2. Recommended System Topologies 2.3. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA Revision History
2.1. Overview of HPS Memory-Mapped Interfaces x
2.1.1. HPS-to-FPGA Bridge 2.1.2. Lightweight HPS-to-FPGA Bridge 2.1.3. FPGA-to-HPS Bridge 2.1.4. FPGA-to-SDRAM Ports 2.1.5. Interface Bandwidths
2.2. Recommended System Topologies x
2.2.1. HPS Accesses to FPGA Fabric 2.2.2. Maintaining Cache Coherency 2.2.3. MPU Sharing Data with FPGA 2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA
2.2.4. Examples of Cacheable and Non-Cacheable Data Accesses From the FPGA x
2.2.4.1. Example 1: FPGA Reading Data from HPS SDRAM Directly 2.2.4.2. Example 2: FPGA Writing Data into HPS SDRAM Directly 2.2.4.3. Example 3: FPGA Reading Cache Coherent Data from HPS 2.2.4.4. Example 4: FPGA Writing Cache Coherent Data to HPS
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs x
3.1. Start your SoC FPGA design here 3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory 3.3. HPS Clocking and Reset Design Considerations 3.4. HPS EMIF Design Considerations 3.5. DMA Considerations 3.6. Design Guidelines for HPS Portion of Intel® Arria® 10 SoC FPGAs Revision History
3.1. Start your SoC FPGA design here x
3.1.1. Recommended Starting Point for HPS-to-FPGA Interface Designs 3.1.2. Determining your SoC FPGA Topology
3.2. Design Considerations for Connecting Device I/O to HPS Peripherals and Memory x
3.2.1. HPS Pin Multiplexing Design Considerations 3.2.2. HPS I/O Settings: Constraints and Drive Strengths
3.3. HPS Clocking and Reset Design Considerations x
3.3.1. HPS Clock Planning 3.3.2. Early Pin Planning and I/O Assignment Analysis 3.3.3. Pin Features and Connections for HPS Clocks, Reset and PoR 3.3.4. Internal Clocks 3.3.5. HPS Reset During FPGA Reconfiguration and FPGA Configuration Failures 3.3.6. HPS Peripheral Reset Management
3.4. HPS EMIF Design Considerations x
3.4.1. Considerations for Connecting HPS to SDRAM 3.4.2. HPS SDRAM I/O Locations GUIDELINE: Use these automated default pin location assignments. GUIDELINE: Verify the HPS memory controller I/O locations in the Quartus project pinout file in the “output_files” sub-folder before finalizing board layout. GUIDELINE: When using the Early I/O Release boot flow, make sure all I/O associated with the HPS memory interface are located within the active HPS I/O banks indicated in the table below. GUIDELINE: When varying from the automated, default pin locations, refer to the “Restrictions on I/O Bank Usage for Arria 10 EMIF IP with HPS” section of Chapter 2 of the EMIF Handbook, vol 3. GUIDELINE: Unused pin locations within I/O lanes utilized by the Arria 10 EMIF for HPS IP are accessible by the FPGA fabric. 3.4.3. Integrating the Arria 10 HPS EMIF with the SoC FPGA Device 3.4.4. HPS Memory Debug
3.4.2. HPS SDRAM I/O Locations x
GUIDELINE: Use these automated default pin location assignments. GUIDELINE: Verify the HPS memory controller I/O locations in the Quartus project pinout file in the “output_files” sub-folder before finalizing board layout. GUIDELINE: When using the Early I/O Release boot flow, make sure all I/O associated with the HPS memory interface are located within the active HPS I/O banks indicated in the table below. GUIDELINE: When varying from the automated, default pin locations, refer to the “Restrictions on I/O Bank Usage for Arria 10 EMIF IP with HPS” section of Chapter 2 of the EMIF Handbook, vol 3. GUIDELINE: Unused pin locations within I/O lanes utilized by the Arria 10 EMIF for HPS IP are accessible by the FPGA fabric. 3.4.2.1. I/O Bank 2K, Lanes 0,1,2 (Addr/Cmd) 3.4.2.2. I/O Bank 2K, Lane 3 (ECC) 3.4.2.3. I/O Bank, 2J (Data) 3.4.2.4. I/O Bank, 2I (Data, 64-, 72-bit interfaces)
3.5. DMA Considerations x
3.5.1. Choosing a DMA Controller 3.5.2. Optimizing DMA Master Bandwidth through HPS Interconnect
4. Board Design Guidelines for Arria 10 SoC FPGAs x
4.1. Power On Board Bring Up and Boot ROM/Boot Loader Debugging 4.2. FPGA Reconfiguration 4.3. HPS Power Design Considerations 4.4. Boundary Scan for HPS 4.5. Design Guidelines for HPS Interfaces 4.6. Connection Guidelines for Unused HPS Block 4.7. Board Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
4.2. FPGA Reconfiguration x
4.2.1. Flash Update with HPS Reboot 4.2.2. Partial Reconfiguration of the SoC FPGA
4.3. HPS Power Design Considerations x
4.3.1. Early System and Board Planning 4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices 4.3.3. Pin Connection Considerations for Board Designs 4.3.4. Power Analysis 4.3.5. Power Optimization
4.3.1. Early System and Board Planning x
4.3.1.1. Early Power Estimation
4.3.1.1. Early Power Estimation x
4.3.1.1.1. Main Worksheet 4.3.1.1.2. IO Worksheet 4.3.1.1.3. IO-IP Worksheet 4.3.1.1.4. HPS Worksheet
4.3.2. Design Considerations for HPS and FPGA Power Supplies for SoC FPGA devices x
4.3.2.1. Consider Device Power Consumption and HPS Performance 4.3.2.2. Consider Desired HPS Boot Clock Frequency
4.3.3. Pin Connection Considerations for Board Designs x
4.3.3.1. Device Power-Up 4.3.3.2. Power Pin Connections and Power Supplies
4.3.5. Power Optimization x
4.3.5.1. Processor and Memory Clock Speeds 4.3.5.2. MPU Standby Modes and Dynamic Clock Gating 4.3.5.3. Managing Peripheral Power 4.3.5.4. Managing Power by Shutting Down Supplies
4.5. Design Guidelines for HPS Interfaces x
4.5.1. HPS EMAC PHY Interfaces 4.5.2. USB Interface Design Guidelines 4.5.3. QSPI Flash Interface Design Guidelines 4.5.4. SD/MMC and eMMC Card Interface Design Guidelines 4.5.5. Provide Flash Memory Reset for QSPI and SD/MMC/eMMC 4.5.6. NAND Flash Interface Design Guidelines 4.5.7. UART Interface Design Guidelines 4.5.8. I2C Interface Design Guidelines
4.5.1. HPS EMAC PHY Interfaces x
4.5.1.1. PHY Interfaces Connected Through Shared I/O 4.5.1.2. PHY Interfaces Connected Through FPGA I/O 4.5.1.3. MDIO 4.5.1.4. Common PHY Interface Design Considerations
4.5.1.1. PHY Interfaces Connected Through Shared I/O x
4.5.1.1.1. RMII 4.5.1.1.2. RGMII
4.5.1.2. PHY Interfaces Connected Through FPGA I/O x
4.5.1.2.1. GMII/MII 4.5.1.2.2. Adapting to RMII 4.5.1.2.3. Adapting to SGMII
4.5.1.4. Common PHY Interface Design Considerations x
4.5.1.4.1. Signal Integrity
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs x
5.1. Embedded Software for HPS Design Guidelines 5.2. Support and Documentation 5.3. Embedded Software Design Guidelines for Intel® Arria® 10 SoC FPGAs Revision History
5.1. Embedded Software for HPS Design Guidelines x
5.1.1. Purpose 5.1.2. Assembling the components of your Software Development Platform 5.1.3. Selecting an Operating System for your application 5.1.4. Assembling your Software Development Platform for Linux 5.1.5. Assembling your Software Development Platform for a Bare-Metal Application 5.1.6. Assembling your Software Development Platform for Partner OS or RTOS 5.1.7. Choosing Boot Loader Software 5.1.8. Selecting Software Tools for Development, Debug and Trace 5.1.9. Board Bring Up Considerations 5.1.10. Boot and Configuration Design Considerations 5.1.11. Flash Device Driver Design Considerations 5.1.12. HPS ECC Design Considerations 5.1.13. Security Design Considerations 5.1.14. Embedded Software Debugging and Trace
5.1.2. Assembling the components of your Software Development Platform x
5.1.2.1. Golden Hardware Reference Design (GHRD)
5.1.3. Selecting an Operating System for your application x
5.1.3.1. Using Linux or RTOS 5.1.3.2. Developing a Bare-Metal Application 5.1.3.3. Using the Bootloader as a Bare-Metal Framework 5.1.3.4. Using Symmetrical vs. Asymmetrical Multiprocessing (SMP vs. AMP) Modes
5.1.4. Assembling your Software Development Platform for Linux x
5.1.4.1. Golden System Reference Design (GSRD) for Linux 5.1.4.2. GSRD for Linux Build Flow 5.1.4.3. Source Code Management Considerations 5.1.4.4. Linux Device Tree Design Considerations
5.1.8. Selecting Software Tools for Development, Debug and Trace x
5.1.8.1. Selecting Software Build Tools 5.1.8.2. Selecting Software Debug Tools 5.1.8.3. Selecting Software Trace Tools
5.1.9. Board Bring Up Considerations x
5.1.9.1. Plan the SDRAM Initialization
5.1.10. Boot and Configuration Design Considerations x
5.1.10.1. Boot Design Considerations 5.1.10.2. Configuration
5.1.10.1. Boot Design Considerations x
5.1.10.1.1. Boot Source 5.1.10.1.2. Select Desired Flash Device 5.1.10.1.3. BSEL Options 5.1.10.1.4. Boot Clock 5.1.10.1.5. Determine Boot Fuses Usage 5.1.10.1.6. CSEL Options 5.1.10.1.7. Determine Flash Programming Method 5.1.10.1.8. Selecting NAND Flash Devices 5.1.10.1.9. Selecting QSPI Flash Devices 5.1.10.1.10. Reference Materials
5.1.10.2. Configuration x
5.1.10.2.1. Traditional Configuration 5.1.10.2.2. HPS-Initiated Configuration
5.1.12. HPS ECC Design Considerations x
5.1.12.1. General ECC Design Considerations 5.1.12.2. ECC for External SDRAM Interface 5.1.12.3. ECC for L2 Cache Data Memory 5.1.12.4. ECC for Flash Memory
5.2. Support and Documentation x
5.2.1. Support 5.2.2. Hardware Documentation 5.2.3. Software Documentation
5.2.3. Software Documentation x
5.2.3.1. Example of Prebuilt Bootloaders for the Intel® Arria® 10 SoC Development Kit
1. Overview of Design Guidelines for Intel® Arria® 10 SoC FPGAs
2. Guidelines for Interconnecting the Intel® Arria® 10 HPS and FPGA
3. Design Guidelines for HPS Portion of Arria 10 SoC FPGAs
4. Board Design Guidelines for Arria 10 SoC FPGAs
5. Embedded Software Design Guidelines for Arria 10 SoC FPGAs

3.4.2. HPS SDRAM I/O Locations

GUIDELINE: Use these automated default pin location assignments.

The Arria 10 EMIF for HPS IP includes default pin location assignments for all of the external memory interface signals in constraint files created at IP generation time and read by Intel® Quartus® Prime during design compilation.

GUIDELINE: Verify the HPS memory controller I/O locations in the Quartus project pinout file in the “output_files” sub-folder before finalizing board layout.

By default, Intel® Quartus® Prime generates output reports, log files, and programming files in the “output_files” subfolder of the project folder. See the .pin text file after compilation for the pinout for your design, including the pin locations for the HPS EMIF.

GUIDELINE: When using the Early I/O Release boot flow, make sure all I/O associated with the HPS memory interface are located within the active HPS I/O banks indicated in the table below.

Ensure all I/O necessary for a functioning HPS memory interface are located within the active banks for your HPS memory width as shown in the table below when using the Early I/O Release boot flow.

Typically Intel® Quartus® Prime compilation flags an error for any HPS memory I/O that are not placed in the I/O bank and lane locations shown in the table below for a given HPS memory width.

An exception is the RZQ pin, which generally can be placed in any RZQ pin location in the I/O column. For successful HPS memory interface calibration with the Early I/O Release boot flow, the RZQ pin for the HPS memory interface must be placed in either I/O Bank 2K or 2J for memory widths up to and including 32/40-bits. For 64/72-bit wide HPS memory interfaces, RZQ must be in I/O Bank 2K, 2J or 2I.

In addition, when using the Early I/O release flow, the EMIF reference clock must be placed in bank 2K.

For more information about the I/O mapping of the HPS EMIF, refer to the following table. I/O lanes not utilized by the HPS EMIF Controller are available to the FPGA fabric as either General Purpose Inputs-only (GPI) or General Purpose I/O (GPIO).

Table 8.  HPS SDRAM I/O Locations
EMIF Width Bank 2K Lanes Bank 2J Lanes Bank 2I Lanes
3 2 1 0 3 2 1 0 3 2 1 0

16-bit

 GPI Address/Command GPIO Data [15:0] GPIO GPIO GPIO GPIO

16-bit + ECC

 ECC Address/Command GPIO Data [15:0] GPIO GPIO GPIO GPIO

32-bit

 GPI Address/Command Data [31:0] GPIO GPIO GPIO GPIO

32-bit + ECC

 ECC Address/Command Data [31:0] GPIO GPIO GPIO GPIO

64-bit

 GPI Address/Command Data [31:0] Data [63:32]

64-bit + ECC

 ECC Address/Command Data [31:0] Data [63:32]

GUIDELINE: When varying from the automated, default pin locations, refer to the “Restrictions on I/O Bank Usage for Arria 10 EMIF IP with HPS” section of Chapter 2 of the EMIF Handbook, vol 3.

While the interface is mostly fixed to the I/O banks and lanes as shown in the above table, there is some flexibility in shuffling non-ECC DQ/DQS data group lanes and DQ signals within the fixed pin locations. Validate any non-default pin locations with a Intel® Quartus® Prime compilation.

GUIDELINE: Unused pin locations within I/O lanes utilized by the Arria 10 EMIF for HPS IP are accessible by the FPGA fabric.

For more information, refer to the following I/O bank-specific sections.


Section Content
I/O Bank 2K, Lanes 0,1,2 (Addr/Cmd)
I/O Bank 2K, Lane 3 (ECC)
I/O Bank, 2J (Data)
I/O Bank, 2I (Data, 64-, 72-bit interfaces)

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