6.1.4. Temperature Sensing for Thermal Management
|1||Set up the temperature sensing diode (TSD) in your design to measure the device junction temperature for thermal management.|
|2||Include offset values form Intel® FPGA Power and Thermal Calculator calculation to TSD reading.|
Intel Agilex® 7 devices offers local and remote temperature sensing capabilities.
You can measure the junction temperature, TJ, with the following methods:
- Using local Temperature Sensor by instantiating the Mailbox Client Intel FPGA IP core.
- Using external thermal diode designed to interface with third-party sensor chip. Ensure the third-party sensor chip matches the external TSD specifications as documented in the Intel Agilex® 7 Device Data Sheet.
Monitoring the actual junction temperature is crucial for thermal management. Intel Agilex® 7 devices include TSD on each die with embedded analog-to-digital converter (ADC) circuitry. You can access the digital temperature readout through the Mailbox Client Intel FPGA IP core.
The Intel Agilex® 7 TSD can self-monitor the device junction temperature and can be used with external circuitry for activities such as controlling air flow to the FPGA. This requires including the TSD circuitry by instantiating a Mailbox Client Intel FPGA IP core.
For more information about temperature sensor details, refer to Intel Agilex® 7 Device Data Sheet.
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