Visible to Intel only — GUID: ddo1583213414032
Ixiasoft
Recommended Operating Conditions
E-Tile Transceiver Power Supply Recommended Operating Conditions
P-Tile Transceiver Power Supply Recommended Operating Conditions
R-Tile Transceiver Power Supply Recommended Operating Conditions
F-Tile Transceiver Power Supply Recommended Operating Conditions
HPS Power Supply Recommended Operating Conditions
Single-Ended I/O Standards Specifications
Single-Ended SSTL, HSTL, HSUL, and POD I/O Reference Voltage Specifications
Single-Ended SSTL, HSTL, HSUL, and POD I/O Standards Signal Specifications
Differential SSTL, HSTL, and HSUL I/O Standards Specifications
Differential POD I/O Standards Specifications
Differential I/O Standards Specifications
HPS Clock Performance
HPS Internal Oscillator Frequency
HPS PLL Specifications
HPS Cold Reset
HPS SPI Timing Characteristics
HPS SD/MMC Timing Characteristics
HPS USB UPLI Timing Characteristics
HPS Ethernet Media Access Controller (EMAC) Timing Characteristics
HPS I2C Timing Characteristics
HPS NAND Timing Characteristics
HPS Trace Timing Characteristics
HPS GPIO Interface
HPS JTAG Timing Characteristics
HPS Programmable I/O Timing Characteristics
Visible to Intel only — GUID: ddo1583213414032
Ixiasoft
I/O PLL Specifications
Symbol | Parameter | Condition | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
fIN | Input clock frequency | –1V | 10 | — | 1,10031 | MHz |
–2V | 10 | — | 90031 | MHz | ||
–3V, –3E | 10 | — | 75031 | MHz | ||
–4F, –4X | 10 | — | 65031 | MHz | ||
fINPFD | Input clock frequency to the PFD | — | 10 | — | 325 | MHz |
fVCO | I/O PLL VCO operating range | –1V | 600 | — | 1,600 | MHz |
–2V | 600 | — | 1,434 | MHz | ||
–3V, –3E | 600 | — | 1,250 | MHz | ||
–4F, –4X | 600 | — | 1,067 | MHz | ||
fCLBW | I/O PLL closed-loop bandwidth | I/O bank I/O PLL | 0.5 | — | 10 | MHz |
Fabric-feeding I/O PLL | 1 | — | 10 | MHz | ||
tEINDUTY | Input clock or external feedback clock input duty cycle | — | 40 | — | 60 | % |
fOUT | Output frequency for internal clock (C counter) | –1V | — | — | 1,100 | MHz |
–2V | — | — | 900 | MHz | ||
–3V, –3E | — | — | 750 | MHz | ||
–4F, –4X | — | — | 650 | MHz | ||
fOUT_EXT | Output frequency for external clock output | –1V | — | — | 800 | MHz |
–2V | — | — | 717 | MHz | ||
–3V, –3E | — | — | 625 | MHz | ||
–4F, –4X | — | — | 500 | MHz | ||
tOUTDUTY | Duty cycle for dedicated external clock output (when set to 50%) | fOUT_EXT < 300 MHz | 45 | 50 | 55 | % |
fOUT_EXT ≥ 300 MHz | 40/45 32 | 50 | 55 32/60 | % | ||
tFCOMP 33 | External feedback clock compensation time | — | — | — | 5 | ns |
fDYCONFIGCLK | Dynamic configuration clock for mgmt_clk | — | — | — | 100 | MHz |
tLOCK | Time required to lock from end-of-device configuration or deassertion of areset | — | — | — | 1 | ms |
tDLOCK | Time required to lock dynamically (after switchover or reconfiguring any non-post-scale counters/delays) | — | — | — | 1 | ms |
tPLL_PSERR | Accuracy of PLL phase shift | — | — | — | ±50 | ps |
tARESET | Minimum pulse width on the areset signal | — | 10 | — | — | ns |
tINCCJ | Input clock cycle-to-cyle jitter | fREF < 100 MHz 34 | — | — | 750 | ps (p-p) |
fREF ≥ 100 MHz 34 | — | — | 0.15 | UI (p-p) | ||
tREFPJ | Reference phase jitter (rms)35 | Carrier frequency: 100 MHz with integrated bandwidth of 10 kHz to 50 MHz | — | — | 1.42 | ps |
tREFPN | Reference phase noise36 35 | 10 Hz | — | — | –90 | dBc/Hz |
100 Hz | — | — | –100 | dBc/Hz | ||
1 kHz | — | — | –110 | dBc/Hz | ||
10 kHz | — | — | –120 | dBc/Hz | ||
100 kHz | — | — | –130 | dBc/Hz | ||
1 MHz | — | — | –138 | dBc/Hz | ||
10 MHz | — | — | –142 | dBc/Hz | ||
100 MHz | — | — | –144 | dBc/Hz | ||
tOUTPJ_DC 33 37 | Period jitter for dedicated clock output | fOUT < 100 MHz 34 | — | — | 17.5 | mUI (p-p) |
fOUT ≥ 100 MHz 34 | — | — | 175 | ps (p-p) | ||
tOUTCCJ_DC 33 37 | Cycle-to-cycle jitter for dedicated clock output | fOUT < 100 MHz 34 | — | — | 17.5 | mUI (p-p) |
fOUT ≥ 100 MHz 34 | — | — | 175 | ps (p-p) | ||
tOUTPJ_IO 38 37 | Period jitter for clock output on the regular I/O | fOUT < 100 MHz 34 | — | — | 60 | mUI (p-p) |
fOUT ≥ 100 MHz 34 | — | — | 600 | ps (p-p) | ||
tOUTCCJ_IO 38 37 | Cycle-to-cycle jitter for clock output on the regular I/O | fOUT < 100 MHz 34 | — | — | 60 | mUI (p-p) |
fOUT ≥ 100 MHz 34 | — | — | 600 | ps (p-p) | ||
tCASC_OUTPJ_DC 33 | Period jitter for dedicated clock output in cascaded PLLs | fOUT < 100 MHz 34 | — | — | 17.5 | mUI (p-p) |
fOUT ≥ 100 MHz 34 | — | — | 175 | ps (p-p) |
31 This specification is limited by the I/O maximum frequency. The maximum achievable I/O frequency is different for each I/O standard and is dependent on design and system specific factors. Ensure proper timing closure in your design and perform HSPICE/IBIS simulations based on your specific design and system setup to determine the maximum achievable frequency in your system.
32 To achieve 5% duty cycle for fOUT_EXT ≥ 300 MHz, you only can use tx_outclk port from the LVDS SERDES Intel® FPGA IP. Refer to the related information for the detail design guidelines.
33 Not applicable for fabric-feeding I/O PLL.
34 fREF is fIN/N, specification applies when N = 1.
35 Requirement for Advanced Interface Bus (AIB), High Bandwidth Memory (HBM) Interface, Mobile Industry Processor Interface (MIPI), DDR4 protocol, and LVDS applications only.
36 The phase noise numbers in the table above are the maximum acceptable phase noise values measured at a carrier frequency of 100 MHz. To calculate the phase noise requirement at any other frequency, use the formula: REFCLK phase noise at f (MHz) = REFCLK phase noise at 100 MHz + (20 × log10 (f/100)).
37 This jitter specification does not include the effect of spread-spectrum clock. The magnitude of jitter deterioration is largely depend on the spread-spectrum clock profile used. Refer to the related information for the recommended spread-spectrum clock profile.
38 External memory interface clock output jitter specifications use a different measurement method, which are available in the Memory Output Clock Jitter Specifications table.