Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series

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ID 683301
Date 4/01/2024
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Document Table of Contents
Document Table of Contents x
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series x
Electrical Characteristics Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Agilex 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series
Electrical Characteristics x
Operating Conditions
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics I/O Standard Specifications
Recommended Operating Conditions x
Recommended Operating Conditions E-Tile Transceiver Power Supply Recommended Operating Conditions P-Tile Transceiver Power Supply Recommended Operating Conditions R-Tile Transceiver Power Supply Recommended Operating Conditions F-Tile Transceiver Power Supply Recommended Operating Conditions HPS Power Supply Recommended Operating Conditions
DC Characteristics x
Supply Current and Power Consumption I/O Pin Leakage Current Bus Hold Specifications OCT Calibration Accuracy Specifications OCT Without Calibration Resistance Tolerance Specifications Pin Capacitance Internal Weak Pull-Up Resistor Hysteresis Specifications for Schmitt Trigger Input
I/O Standard Specifications x
Single-Ended I/O Standards Specifications Single-Ended SSTL, HSTL, HSUL, and POD I/O Reference Voltage Specifications Single-Ended SSTL, HSTL, HSUL, and POD I/O Standards Signal Specifications Differential SSTL, HSTL, and HSUL I/O Standards Specifications Differential POD I/O Standards Specifications Differential I/O Standards Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications E-Tile Transceiver Performance Specifications P-Tile Transceiver Performance Specifications R-Tile Transceiver Performance Specifications F-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications I/O PLL Specifications DSP Block Specifications Memory Block Specifications Local Temperature Sensor Specifications Remote Temperature Diode Specifications Voltage Sensor Specifications
Periphery Performance Specifications x
LVDS SERDES Specifications DPA Lock Time Specifications LVDS SERDES Soft-CDR Sinusoidal Jitter Tolerance Specifications Memory Standards Supported DLL Range Specifications Memory Output Clock Jitter Specifications
E-Tile Transceiver Performance Specifications x
E-Tile Transceiver Performance E-Tile Transceiver Reference Clock Specifications E-Tile Transmitter Specifications E-Tile Receiver Specifications
P-Tile Transceiver Performance Specifications x
P-Tile Transceiver Performance P-Tile Transceiver Reference Clock Specifications P-Tile Transmitter Specifications P-Tile Receiver Specifications
R-Tile Transceiver Performance Specifications x
R-Tile Transceiver Performance R-Tile Transceiver Reference Clock Specifications R-Tile Transmitter Specifications R-Tile Receiver Specifications
F-Tile Transceiver Performance Specifications x
F-Tile Transceiver Performance F-Tile Transceiver Reference Clock Specifications F-Tile Transmitter Specifications F-Tile Receiver Specifications F-Tile Electrical Compliance
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® Streaming (Avalon®-ST) Configuration Timing Configuration Bit Stream Sizes
Agilex™ 7 FPGAs and SoCs Device Data Sheet: F-Series and I-Series

HPS Ethernet Media Access Controller (EMAC) Timing Characteristics

Table 83.  Reduced Gigabit Media Independent Interface (RGMII) TX Timing Requirements For specification status, see the Data Sheet Status table
Symbol Description Min Typ Max Unit
Tclk (1000Base-T) TX_CLK clock period — 8 — ns
Tclk (100Base-T) TX_CLK clock period — 40 — ns
Tclk (10Base-T) TX_CLK clock period — 400 — ns
Tdutycycle (1000Base-T) TX_CLK duty cycle 45 50 55 %
Tdutycycle (10/100Base-T) TX_CLK duty cycle 40 50 60 %
Td 106 107 TXD/TX_CTL to TX_CLK output skew –0.5 — 0.5 ns
Figure 11. RGMII TX Timing Diagram
Table 84.  RGMII RX Timing Requirements For specification status, see the Data Sheet Status table
Symbol Description Min Typ Max Unit
Tclk (1000Base-T) RX_CLK clock period — 8 — ns
Tclk (100Base-T) RX_CLK clock period — 40 — ns
Tclk (10Base-T) RX_CLK clock period — 400 — ns
Tdutycycle (1000Base-T) RX_CLK duty cycle 45 50 55 %
Tdutycycle (10/100Base-T) RX_CLK duty cycle 40 50 60 %
Tsu RX_D/RX_CTL to RX_CLK setup time 1 — — ns
Th 108 RX_CLK to RX_D/RX_CTL hold time 1 — — ns
Figure 12. RGMII RX Timing Diagram
Table 85.  Reduced Media Independent Interface (RMII) Clock Timing Requirements For specification status, see the Data Sheet Status table
Symbol Description Min Typ Max Unit
Tclk REF_CLK clock period, sourced by HPS TX_CLK — 20 — ns
REF_CLK clock period, sourced by external clock source — 20 — ns
Tdutycycle_int Clock duty cycle, REF_CLK sourced by TX_CLK 35 50 65 %
Tdutycycle_ext Clock duty cycle, REF_CLK sourced by external clock source 35 50 65 %
Table 86.  RMII TX Timing Requirements For specification status, see the Data Sheet Status table
Symbol Description Min Typ Max Unit
Td TX_CLK to TXD/TX_CTL output data delay 2 — 10 ns
Figure 13. RMII TX Timing Diagram
Table 87.  RMII RX Timing Requirements For specification status, see the Data Sheet Status table
Symbol Description Min Typ Max Unit
Tsu RX_D/RX_CTL setup time 2 — — ns
Th RX_D/RX_CTL hold time 1 — — ns
Figure 14. RMII RX Timing Diagram
Table 88.  Management Data Input/Output (MDIO) Timing Requirements For specification status, see the Data Sheet Status table
Symbol Description Min Typ Max Unit
Tclk MDC clock period 400 — — ns
Td MDC to MDIO output data delay 10 — 300 ns
Tsu Setup time for MDIO data 10 — — ns
Th Hold time for MDIO data 0 — — ns
Figure 15. MDIO Timing Diagram
Related Information
106 Rise and fall times depend on the I/O standard, drive strength, and loading. Intel® recommends simulating your configuration.
107 If you connect a PHY that does not implement clock-to-data skew, you can delay TX_CLK by 1.5—2.0 ns with the HPS I/O programmable delay, to meet the PHY's 1-ns data-to-clock skew requirement.
108 If you connect a PHY that does not implement clock-to-data skew, you can meet the HPS EMAC’s 1 ns setup time by delaying RX_CLK by 1.5-2 ns, using the HPS I/O programmable delay.
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