External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide
ID
772538
Date
6/26/2023
Public
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1. About the External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP
2. Intel Agilex® 7 M-Series FPGA EMIF IP – Introduction
3. Intel Agilex® 7 M-Series FPGA EMIF IP – Product Architecture
4. Intel Agilex® 7 M-Series FPGA EMIF IP – End-User Signals
5. Intel Agilex® 7 M-Series FPGA EMIF IP – Simulating Memory IP
6. Intel Agilex 7 M-Series FPGA EMIF IP – DDR4 Support
7. Intel Agilex® 7 M-Series FPGA EMIF IP – DDR5 Support
8. Intel Agilex 7 M-Series FPGA EMIF IP – LPDDR5 Support
9. Intel Agilex® 7 M-Series FPGA EMIF IP – Timing Closure
10. Intel Agilex® 7 M-Series FPGA EMIF IP – Controller Optimization
11. Intel Agilex® 7 M-Series FPGA EMIF IP – Debugging
12. Document Revision History for External Memory Interfaces Intel Agilex® 7 M-Series FPGA IP User Guide
3.1.1. Intel Agilex® 7 M-Series EMIF Architecture: I/O Subsystem
3.1.2. Intel Agilex® 7 M-Series EMIF Architecture: I/O SSM
3.1.3. Intel Agilex® 7 M-Series EMIF Architecture: I/O Bank
3.1.4. Intel Agilex® 7 M-Series EMIF Architecture: I/O Lane
3.1.5. Intel Agilex® 7 M-Series EMIF Architecture: Input DQS Clock Tree
3.1.6. Intel Agilex® 7 M-Series EMIF Architecture: PHY Clock Tree
3.1.7. Intel Agilex® 7 M-Series EMIF Architecture: PLL Reference Clock Networks
3.1.8. Intel Agilex® 7 M-Series EMIF Architecture: Clock Phase Alignment
3.1.9. User Clock in Different Core Access Modes
6.2.4.1. Address and Command Pin Placement for DDR4
6.2.4.2. DDR4 Data Width Mapping
6.2.4.3. General Guidelines - DDR4
6.2.4.4. x4 DIMM Implementation
6.2.4.5. Specific Pin Connection Requirements
6.2.4.6. Command and Address Signals
6.2.4.7. Clock Signals
6.2.4.8. Data, Data Strobes, DM/DBI, and Optional ECC Signals
6.3.5.1. Single Rank x 8 Discrete (Component) Topology
6.3.5.2. Single Rank x 16 Discrete (Component) Topology
6.3.5.3. ADDR/CMD Reference Voltage/RESET Signal Routing Guidelines for Single Rank x 8 and Single Rank x 16 Discrete (Component) Topologies
6.3.5.4. Skew Matching Guidelines for DDR4 Discrete Configurations
6.3.5.5. Power Delivery Recommendations for DDR4 Discrete Configurations
6.3.5.6. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
7.2.1. Intel Agilex® 7 M-Series FPGA EMIF IP Interface Pins
7.2.2. Intel Agilex® 7 M-Series FPGA EMIF IP Resources
7.2.3. Pin Guidelines for Intel Agilex® 7 M-Series FPGA EMIF IP
7.2.4. Pin Placements for Intel Agilex 7 M-Series FPGA DDR5 EMIF IP
7.2.5. Intel Agilex® 7 M-Series EMIF Pin Swapping Guidelines
6.2.4.7. Clock Signals
DDR4 SDRAM devices use CK and CK# signals to clock the address and command signals into the memory.
The memory uses these clock signals to generate the DQS signal during a read through the DLL inside the memory. The SDRAM data sheet specifies the following timings:
- tDQSCK is the skew between the CK or CK# signals and the SDRAM-generated DQS signal.
- tDSH is the DQS falling edge from CK rising edge hold time.
- tDSS is the DQS falling edge from CK rising edge setup time.
- tDQSS is the positive DQS latching edge to CK rising edge.
SDRAM devices have a write requirement (tDQSS) that states the positive edge of the DQS signal on writes must be within ± 25% (± 90°) of the positive edge of the SDRAM clock input. Therefore, you should generate the CK and CK# signals using the DDR registers in the IOE to match with the DQS signal and reduce any variations across process, voltage, and temperature. The positive edge of the SDRAM clock, CK, is aligned with the DQS write to satisfy tDQSS.