5.5. Thermal Limitations and Protection Guidelines
With 25C ambient temperature and 50C printed circuit board (PCB) temperature, you must ensure that your FPGA designs do not consume more than 200 W with the liquid cooling solution.
MAX1619 chip is connected to the Intel® Stratix® 10 GX FPGA internal temperature diode to continuously monitor FPGA die temperature. In the meantime, a dedicated FPGA TSD real-time monitor solution under ~\ip\onchip_sensors\ is added to each transceiver example design to monitor the temperatures of both FPGA core and each transceiver tile. Based on the data from both MAX1619 and FPGA, MAX® V will run fan at its maximum speed whenever any temperature is over 60C or immediately power off the board whenever any temperature is over 100C. Remember to unplug the power supply when the board is powered off after the temperature crosses 100C. Plug the power supply back again to ensure that the board can be normally turned on/off again.
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