External Memory Interfaces Arria® 10 FPGA IP User Guide

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ID 683106
Date 11/28/2024
Public
Document Table of Contents
Document Table of Contents x
1. Release Information 2. External Memory Interfaces Arria® 10 FPGA IP Introduction 3. Arria® 10 EMIF IP Product Architecture 4. Arria® 10 EMIF IP End-User Signals 5. Arria® 10 EMIF – Simulating Memory IP 6. Arria® 10 EMIF IP for DDR3 7. Arria® 10 EMIF IP for DDR4 8. Arria® 10 EMIF IP for QDR II/II+/II+ Xtreme 9. Arria® 10 EMIF IP for QDR-IV 10. Arria® 10 EMIF IP for RLDRAM 3 11. Arria® 10 EMIF IP for LPDDR3 12. Arria® 10 EMIF IP Timing Closure 13. Optimizing Controller Performance 14. Arria® 10 EMIF IP Debugging 15. External Memory Interfaces Arria® 10 FPGA IP User Guide Archives 16. Document Revision History for External Memory Interfaces Arria® 10 FPGA IP User Guide
2. External Memory Interfaces Arria® 10 FPGA IP Introduction x
2.1. Arria® 10 EMIF IP Design Flow 2.2. Arria® 10 EMIF IP Design Checklist
3. Arria® 10 EMIF IP Product Architecture x
3.1. EMIF Architecture: Introduction 3.2. Arria® 10 EMIF Sequencer 3.3. Arria® 10 EMIF Calibration 3.4. Periodic OCT Recalibration 3.5. Arria® 10 EMIF Controller 3.6. Hardware Resource Sharing Among Multiple EMIFs 3.7. Arria® 10 EMIF for Hard Processor Subsystem 3.8. Arria® 10 EMIF Ping Pong PHY 3.9. Arria® 10 EMIF and SmartVID
3.1. EMIF Architecture: Introduction x
3.1.1. I/O Subsystem 3.1.2. I/O Column 3.1.3. I/O AUX 3.1.4. I/O Bank 3.1.5. I/O Lane 3.1.6. Input DQS Clock Tree 3.1.7. PHY Clock Tree 3.1.8. PLL Reference Clock Networks 3.1.9. Clock Phase Alignment
3.1.4. I/O Bank x
3.1.4.1. Implementing a x8 Interface with Hard Memory Controller 3.1.4.2. Implementing a x72 Interface with Hard Memory Controller
3.2. Arria® 10 EMIF Sequencer x
3.2.1. DQS Tracking
3.3. Arria® 10 EMIF Calibration x
3.3.1. Calibration Stages 3.3.2. Calibration Stages Descriptions 3.3.3. Calibration Algorithms 3.3.4. Calibration Flowchart
3.4. Periodic OCT Recalibration x
3.4.1. Operation 3.4.2. Technical Restrictions 3.4.3. Efficiency Impact
3.5. Arria® 10 EMIF Controller x
3.5.1. Hard Memory Controller 3.5.2. Hard Memory Controller Rate Conversion Feature
3.5.1. Hard Memory Controller x
3.5.1.1. Hard Memory Controller Features 3.5.1.2. Hard Memory Controller Main Control Path 3.5.1.3. Data Buffer Controller
3.6. Hardware Resource Sharing Among Multiple EMIFs x
3.6.1. I/O Aux Sharing 3.6.2. I/O Bank Sharing 3.6.3. PLL Reference Clock Sharing 3.6.4. Core Clock Network Sharing
3.7. Arria® 10 EMIF for Hard Processor Subsystem x
3.7.1. Restrictions on I/O Bank Usage for Arria® 10 EMIF IP with HPS 3.7.2. Using the EMIF Debug Toolkit with Arria® 10 HPS Interfaces
3.8. Arria® 10 EMIF Ping Pong PHY x
3.8.1. Ping Pong PHY Feature Description 3.8.2. Ping Pong PHY Architecture 3.8.3. Ping Pong PHY Limitations 3.8.4. Ping Pong PHY Calibration 3.8.5. Using the Ping Pong PHY 3.8.6. Ping Pong PHY Simulation Example Design
4. Arria® 10 EMIF IP End-User Signals x
4.1. Interface and Signal Descriptions 4.2. AFI Signals 4.3. AFI 4.0 Timing Diagrams 4.4. Arria® 10 Memory Mapped Register (MMR) Tables
4.1. Interface and Signal Descriptions x
4.1.1. Intel Arria 10 EMIF IP Interfaces for DDR3 4.1.2. Intel Arria 10 EMIF IP Interfaces for DDR4 4.1.3. Intel Arria 10 EMIF IP Interfaces for LPDDR3 4.1.4. Intel Arria 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme 4.1.5. Intel Arria 10 EMIF IP Interfaces for QDR-IV 4.1.6. Intel Arria 10 EMIF IP Interfaces for RLDRAM 3
4.1.1. Intel Arria 10 EMIF IP Interfaces for DDR3 x
4.1.1.1. pll_ref_clk for DDR3 4.1.1.2. pll_locked for DDR3 4.1.1.3. pll_extra_clk_0 for DDR3 4.1.1.4. pll_extra_clk_1 for DDR3 4.1.1.5. pll_extra_clk_2 for DDR3 4.1.1.6. pll_extra_clk_3 for DDR3 4.1.1.7. oct for DDR3 4.1.1.8. mem for DDR3 4.1.1.9. status for DDR3 4.1.1.10. afi_reset_n for DDR3 4.1.1.11. afi_clk for DDR3 4.1.1.12. afi_half_clk for DDR3 4.1.1.13. afi for DDR3 4.1.1.14. emif_usr_reset_n for DDR3 4.1.1.15. emif_usr_clk for DDR3 4.1.1.16. emif_usr_reset_n_sec for DDR3 4.1.1.17. emif_usr_clk_sec for DDR3 4.1.1.18. cal_debug_reset_n for DDR3 4.1.1.19. cal_debug_clk for DDR3 4.1.1.20. cal_debug_out_reset_n for DDR3 4.1.1.21. cal_debug_out_clk for DDR3 4.1.1.22. clks_sharing_master_out for DDR3 4.1.1.23. clks_sharing_slave_in for DDR3 4.1.1.24. clks_sharing_slave_out for DDR3 4.1.1.25. ctrl_amm for DDR3 4.1.1.26. ctrl_auto_precharge for DDR3 4.1.1.27. ctrl_user_priority for DDR3 4.1.1.28. ctrl_ecc_user_interrupt for DDR3 4.1.1.29. ctrl_ecc_readdataerror for DDR3 4.1.1.30. ctrl_mmr_slave for DDR3 4.1.1.31. hps_emif for DDR3 4.1.1.32. cal_debug for DDR3 4.1.1.33. cal_debug_out for DDR3
4.1.2. Intel Arria 10 EMIF IP Interfaces for DDR4 x
4.1.2.1. pll_ref_clk for DDR4 4.1.2.2. pll_locked for DDR4 4.1.2.3. pll_extra_clk_0 for DDR4 4.1.2.4. pll_extra_clk_1 for DDR4 4.1.2.5. pll_extra_clk_2 for DDR4 4.1.2.6. pll_extra_clk_3 for DDR4 4.1.2.7. oct for DDR4 4.1.2.8. mem for DDR4 4.1.2.9. status for DDR4 4.1.2.10. afi_reset_n for DDR4 4.1.2.11. afi_clk for DDR4 4.1.2.12. afi_half_clk for DDR4 4.1.2.13. afi for DDR4 4.1.2.14. emif_usr_reset_n for DDR4 4.1.2.15. emif_usr_clk for DDR4 4.1.2.16. emif_usr_reset_n_sec for DDR4 4.1.2.17. emif_usr_clk_sec for DDR4 4.1.2.18. cal_debug_reset_n for DDR4 4.1.2.19. cal_debug_clk for DDR4 4.1.2.20. cal_debug_out_reset_n for DDR4 4.1.2.21. cal_debug_out_clk for DDR4 4.1.2.22. clks_sharing_master_out for DDR4 4.1.2.23. clks_sharing_slave_in for DDR4 4.1.2.24. clks_sharing_slave_out for DDR4 4.1.2.25. ctrl_amm for DDR4 4.1.2.26. ctrl_auto_precharge for DDR4 4.1.2.27. ctrl_user_priority for DDR4 4.1.2.28. ctrl_ecc_user_interrupt for DDR4 4.1.2.29. ctrl_ecc_readdataerror for DDR4 4.1.2.30. ctrl_mmr_slave for DDR4 4.1.2.31. hps_emif for DDR4 4.1.2.32. cal_debug for DDR4 4.1.2.33. cal_debug_out for DDR4
4.1.3. Intel Arria 10 EMIF IP Interfaces for LPDDR3 x
4.1.3.1. pll_ref_clk for LPDDR3 4.1.3.2. pll_locked for LPDDR3 4.1.3.3. pll_extra_clk_0 for LPDDR3 4.1.3.4. pll_extra_clk_1 for LPDDR3 4.1.3.5. pll_extra_clk_2 for LPDDR3 4.1.3.6. pll_extra_clk_3 for LPDDR3 4.1.3.7. oct for LPDDR3 4.1.3.8. mem for LPDDR3 4.1.3.9. status for LPDDR3 4.1.3.10. afi_reset_n for LPDDR3 4.1.3.11. afi_clk for LPDDR3 4.1.3.12. afi_half_clk for LPDDR3 4.1.3.13. afi for LPDDR3 4.1.3.14. emif_usr_reset_n for LPDDR3 4.1.3.15. emif_usr_clk for LPDDR3 4.1.3.16. cal_debug_reset_n for LPDDR3 4.1.3.17. cal_debug_clk for LPDDR3 4.1.3.18. cal_debug_out_reset_n for LPDDR3 4.1.3.19. cal_debug_out_clk for LPDDR3 4.1.3.20. clks_sharing_master_out for LPDDR3 4.1.3.21. clks_sharing_slave_in for LPDDR3 4.1.3.22. clks_sharing_slave_out for LPDDR3 4.1.3.23. ctrl_user_priority for LPDDR3 4.1.3.24. ctrl_mmr_slave for LPDDR3 4.1.3.25. cal_debug for LPDDR3 4.1.3.26. cal_debug_out for LPDDR3
4.1.4. Intel Arria 10 EMIF IP Interfaces for QDR II/II+/II+ Xtreme x
4.1.4.1. pll_ref_clk for QDR II/II+/II+ Xtreme 4.1.4.2. pll_locked for QDR II/II+/II+ Xtreme 4.1.4.3. pll_extra_clk_0 for QDR II/II+/II+ Xtreme 4.1.4.4. pll_extra_clk_1 for QDR II/II+/II+ Xtreme 4.1.4.5. pll_extra_clk_2 for QDR II/II+/II+ Xtreme 4.1.4.6. pll_extra_clk_3 for QDR II/II+/II+ Xtreme 4.1.4.7. oct for QDR II/II+/II+ Xtreme 4.1.4.8. mem for QDR II/II+/II+ Xtreme 4.1.4.9. status for QDR II/II+/II+ Xtreme 4.1.4.10. emif_usr_reset_n for QDR II/II+/II+ Xtreme 4.1.4.11. emif_usr_clk for QDR II/II+/II+ Xtreme 4.1.4.12. cal_debug_reset_n for QDR II/II+/II+ Xtreme 4.1.4.13. cal_debug_clk for QDR II/II+/II+ Xtreme 4.1.4.14. cal_debug_out_reset_n for QDR II/II+/II+ Xtreme 4.1.4.15. cal_debug_out_clk for QDR II/II+/II+ Xtreme 4.1.4.16. clks_sharing_master_out for QDR II/II+/II+ Xtreme 4.1.4.17. clks_sharing_slave_in for QDR II/II+/II+ Xtreme 4.1.4.18. clks_sharing_slave_out for QDR II/II+/II+ Xtreme 4.1.4.19. ctrl_amm for QDR II/II+/II+ Xtreme 4.1.4.20. cal_debug for QDR II/II+/II+ Xtreme 4.1.4.21. cal_debug_out for QDR II/II+/II+ Xtreme
4.1.5. Intel Arria 10 EMIF IP Interfaces for QDR-IV x
4.1.5.1. pll_ref_clk for QDR-IV 4.1.5.2. pll_locked for QDR-IV 4.1.5.3. pll_extra_clk_0 for QDR-IV 4.1.5.4. pll_extra_clk_1 for QDR-IV 4.1.5.5. pll_extra_clk_2 for QDR-IV 4.1.5.6. pll_extra_clk_3 for QDR-IV 4.1.5.7. oct for QDR-IV 4.1.5.8. mem for QDR-IV 4.1.5.9. status for QDR-IV 4.1.5.10. afi_reset_n for QDR-IV 4.1.5.11. afi_clk for QDR-IV 4.1.5.12. afi_half_clk for QDR-IV 4.1.5.13. afi for QDR-IV 4.1.5.14. emif_usr_reset_n for QDR-IV 4.1.5.15. emif_usr_clk for QDR-IV 4.1.5.16. cal_debug_reset_n for QDR-IV 4.1.5.17. cal_debug_clk for QDR-IV 4.1.5.18. cal_debug_out_reset_n for QDR-IV 4.1.5.19. cal_debug_out_clk for QDR-IV 4.1.5.20. clks_sharing_master_out for QDR-IV 4.1.5.21. clks_sharing_slave_in for QDR-IV 4.1.5.22. clks_sharing_slave_out for QDR-IV 4.1.5.23. ctrl_amm for QDR-IV 4.1.5.24. cal_debug for QDR-IV 4.1.5.25. cal_debug_out for QDR-IV
4.1.6. Intel Arria 10 EMIF IP Interfaces for RLDRAM 3 x
4.1.6.1. pll_ref_clk for RLDRAM 3 4.1.6.2. pll_locked for RLDRAM 3 4.1.6.3. pll_extra_clk_0 for RLDRAM 3 4.1.6.4. pll_extra_clk_1 for RLDRAM 3 4.1.6.5. pll_extra_clk_2 for RLDRAM 3 4.1.6.6. pll_extra_clk_3 for RLDRAM 3 4.1.6.7. oct for RLDRAM 3 4.1.6.8. mem for RLDRAM 3 4.1.6.9. status for RLDRAM 3 4.1.6.10. afi_reset_n for RLDRAM 3 4.1.6.11. afi_clk for RLDRAM 3 4.1.6.12. afi_half_clk for RLDRAM 3 4.1.6.13. afi for RLDRAM 3 4.1.6.14. cal_debug_reset_n for RLDRAM 3 4.1.6.15. cal_debug_clk for RLDRAM 3 4.1.6.16. cal_debug_out_reset_n for RLDRAM 3 4.1.6.17. cal_debug_out_clk for RLDRAM 3 4.1.6.18. clks_sharing_master_out for RLDRAM 3 4.1.6.19. clks_sharing_slave_in for RLDRAM 3 4.1.6.20. clks_sharing_slave_out for RLDRAM 3 4.1.6.21. cal_debug for RLDRAM 3 4.1.6.22. cal_debug_out for RLDRAM 3
4.2. AFI Signals x
4.2.1. AFI Clock and Reset Signals 4.2.2. AFI Address and Command Signals 4.2.3. AFI Write Data Signals 4.2.4. AFI Read Data Signals 4.2.5. AFI Calibration Status Signals 4.2.6. AFI Tracking Management Signals 4.2.7. AFI Shadow Register Management Signals
4.3. AFI 4.0 Timing Diagrams x
4.3.1. AFI Address and Command Timing Diagrams 4.3.2. AFI Write Sequence Timing Diagrams 4.3.3. AFI Read Sequence Timing Diagrams 4.3.4. AFI Calibration Status Timing Diagram
4.4. Arria® 10 Memory Mapped Register (MMR) Tables x
4.4.1. ctrlcfg0 4.4.2. ctrlcfg1 4.4.3. dramtiming0 4.4.4. sbcfg1 4.4.5. caltiming0 4.4.6. caltiming1 4.4.7. caltiming2 4.4.8. caltiming3 4.4.9. caltiming4 4.4.10. caltiming9 4.4.11. dramaddrw 4.4.12. sideband0 4.4.13. sideband1 4.4.14. sideband2 4.4.15. sideband3 4.4.16. sideband4 4.4.17. sideband5 4.4.18. sideband6 4.4.19. sideband7 4.4.20. sideband8 4.4.21. sideband9 4.4.22. sideband10 4.4.23. sideband11 4.4.24. sideband12 4.4.25. sideband13 4.4.26. dramsts 4.4.27. niosreserve0 4.4.28. niosreserve1 4.4.29. ecc3: ECC Error and Interrupt Configuration 4.4.30. ecc4: Status and Error Information 4.4.31. ecc5: Address of Most Recent SBE/DBE 4.4.32. ecc6: Address of Most Recent Correction Command Dropped
5. Arria® 10 EMIF – Simulating Memory IP x
5.1. Simulation Options 5.2. Simulation Walkthrough
5.2. Simulation Walkthrough x
5.2.1. Calibration Modes 5.2.2. Abstract PHY Simulation 5.2.3. Simulation Scripts 5.2.4. Functional Simulation with Verilog HDL 5.2.5. Functional Simulation with VHDL 5.2.6. Simulating the Design Example
6. Arria® 10 EMIF IP for DDR3 x
6.1. Parameter Descriptions 6.2. Board Skew Equations 6.3. Pin and Resource Planning 6.4. DDR3 Board Design Guidelines
6.1. Parameter Descriptions x
6.1.1. Intel Arria 10 EMIF IP DDR3 Parameters: General 6.1.2. Intel Arria 10 EMIF IP DDR3 Parameters: Memory 6.1.3. Intel Arria 10 EMIF IP DDR3 Parameters: Mem I/O 6.1.4. Intel Arria 10 EMIF IP DDR3 Parameters: FPGA I/O 6.1.5. Intel Arria 10 EMIF IP DDR3 Parameters: Mem Timing 6.1.6. Intel Arria 10 EMIF IP DDR3 Parameters: Board 6.1.7. Intel Arria 10 EMIF IP DDR3 Parameters: Controller 6.1.8. Intel Arria 10 EMIF IP DDR3 Parameters: Diagnostics 6.1.9. Intel Arria 10 EMIF IP DDR3 Parameters: Example Designs
6.2. Board Skew Equations x
6.2.1. Equations for DDR3 Board Skew Parameters
6.3. Pin and Resource Planning x
6.3.1. Interface Pins 6.3.2. FPGA Resources 6.3.3. Pin Guidelines for Arria® 10 EMIF IP
6.3.1. Interface Pins x
6.3.1.1. Estimating Pin Requirements 6.3.1.2. DIMM Options 6.3.1.3. Maximum Number of Interfaces
6.3.2. FPGA Resources x
6.3.2.1. OCT 6.3.2.2. PLL
6.3.3. Pin Guidelines for Arria® 10 EMIF IP x
6.3.3.1. General Guidelines 6.3.3.2. x4 DIMM Implementation 6.3.3.3. Command and Address Signals 6.3.3.4. Clock Signals 6.3.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 6.3.3.6. Resource Sharing Guidelines (Multiple Interfaces) 6.3.3.7. Ping-Pong PHY Implementation
6.4. DDR3 Board Design Guidelines x
6.4.1. Terminations and Slew Rates with Arria® 10 Devices 6.4.2. Channel Signal Integrity Measurement 6.4.3. Layout Approach 6.4.4. Design Layout Guidelines 6.4.5. Package Deskew
6.4.1. Terminations and Slew Rates with Arria® 10 Devices x
6.4.1.1. Dynamic On-Chip Termination (OCT) in Arria® 10 Devices 6.4.1.2. Choosing Terminations on Arria® 10 Devices 6.4.1.3. On-Chip Termination Recommendations for Arria® 10 Devices 6.4.1.4. Slew Rates
6.4.2. Channel Signal Integrity Measurement x
6.4.2.1. Importance of Accurate Channel Signal Integrity Information 6.4.2.2. Understanding Channel Signal Integrity Measurement 6.4.2.3. How to Enter Calculated Channel Signal Integrity Values 6.4.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
6.4.4. Design Layout Guidelines x
6.4.4.1. General Layout Guidelines 6.4.4.2. Layout Guidelines 6.4.4.3. Length Matching Rules 6.4.4.4. Spacing Guidelines 6.4.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 6.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals
6.4.5. Package Deskew x
6.4.5.1. DQ/DQS/DM Deskew 6.4.5.2. Address and Command Deskew 6.4.5.3. Package Deskew Recommendations for Arria® 10 Devices 6.4.5.4. Deskew Example 6.4.5.5. Package Migration
7. Arria® 10 EMIF IP for DDR4 x
7.1. Parameter Descriptions 7.2. Board Skew Equations 7.3. Pin and Resource Planning 7.4. DDR4 Board Design Guidelines
7.1. Parameter Descriptions x
7.1.1. Intel Arria 10 EMIF IP DDR4 Parameters: General 7.1.2. Intel Arria 10 EMIF IP DDR4 Parameters: Memory 7.1.3. Intel Arria 10 EMIF IP DDR4 Parameters: Mem I/O 7.1.4. Intel Arria 10 EMIF IP DDR4 Parameters: FPGA I/O 7.1.5. Intel Arria 10 EMIF IP DDR4 Parameters: Mem Timing 7.1.6. Intel Arria 10 EMIF IP DDR4 Parameters: Board 7.1.7. Intel Arria 10 EMIF IP DDR4 Parameters: Controller 7.1.8. Intel Arria 10 EMIF IP DDR4 Parameters: Diagnostics 7.1.9. Intel Arria 10 EMIF IP DDR4 Parameters: Example Designs
7.2. Board Skew Equations x
7.2.1. Equations for DDR4 Board Skew Parameters
7.3. Pin and Resource Planning x
7.3.1. Interface Pins 7.3.2. FPGA Resources 7.3.3. Pin Guidelines for Arria® 10 EMIF IP 7.3.4. Resource Sharing Guidelines (Multiple Interfaces)
7.3.1. Interface Pins x
7.3.1.1. Estimating Pin Requirements 7.3.1.2. DIMM Options 7.3.1.3. Maximum Number of Interfaces
7.3.2. FPGA Resources x
7.3.2.1. OCT 7.3.2.2. PLL
7.3.3. Pin Guidelines for Arria® 10 EMIF IP x
7.3.3.1. General Guidelines 7.3.3.2. x4 DIMM Implementation 7.3.3.3. Command and Address Signals 7.3.3.4. Clock Signals 7.3.3.5. Data, Data Strobes, DM/DBI, and Optional ECC Signals 7.3.3.6. alert_n Pin Termination Recommendation
7.4. DDR4 Board Design Guidelines x
7.4.1. Terminations and Slew Rates with Arria® 10 Devices 7.4.2. Channel Signal Integrity Measurement 7.4.3. Layout Approach 7.4.4. Design Layout Guidelines 7.4.5. Package Deskew
7.4.1. Terminations and Slew Rates with Arria® 10 Devices x
7.4.1.1. Dynamic On-Chip Termination (OCT) in Arria® 10 Devices 7.4.1.2. Dynamic On-Die Termination (ODT) in DDR4 7.4.1.3. Choosing Terminations on Arria® 10 Devices 7.4.1.4. On-Chip Termination Recommendations for Arria® 10 Devices 7.4.1.5. Slew Rates
7.4.2. Channel Signal Integrity Measurement x
7.4.2.1. Importance of Accurate Channel Signal Integrity Information 7.4.2.2. Understanding Channel Signal Integrity Measurement 7.4.2.3. How to Enter Calculated Channel Signal Integrity Values 7.4.2.4. Guidelines for Calculating DDR4 Channel Signal Integrity
7.4.4. Design Layout Guidelines x
7.4.4.1. General Layout Guidelines 7.4.4.2. Layout Guidelines 7.4.4.3. Length Matching Rules 7.4.4.4. Spacing Guidelines 7.4.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 7.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals 7.4.4.7. Additional Layout Guidelines for DDR4 Twin-die Devices
7.4.5. Package Deskew x
7.4.5.1. DQ/DQS/DM Deskew 7.4.5.2. Address and Command Deskew 7.4.5.3. Package Deskew Recommendations for Arria® 10 Devices 7.4.5.4. Deskew Example 7.4.5.5. Package Migration
8. Arria® 10 EMIF IP for QDR II/II+/II+ Xtreme x
8.1. Parameter Descriptions 8.2. Board Skew Equations 8.3. Pin and Resource Planning 8.4. QDR II/II+/II+ Xtreme Board Design Guidelines
8.1. Parameter Descriptions x
8.1.1. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: General 8.1.2. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Memory 8.1.3. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: FPGA I/O 8.1.4. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Mem Timing 8.1.5. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Board 8.1.6. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Controller 8.1.7. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Diagnostics 8.1.8. Intel Arria 10 EMIF IP QDR II/II+/II+ Xtreme Parameters: Example Designs
8.2. Board Skew Equations x
8.2.1. Equations for QDRII, QDRII+, and QDRII+ Xtreme Board Skew Parameters
8.3. Pin and Resource Planning x
8.3.1. Interface Pins
8.3.1. Interface Pins x
8.3.1.1. Estimating Pin Requirements 8.3.1.2. Maximum Number of Interfaces 8.3.1.3. FPGA Resources 8.3.1.4. OCT 8.3.1.5. PLL 8.3.1.6. Pin Guidelines for Arria® 10 EMIF IP
8.3.1.6. Pin Guidelines for Arria® 10 EMIF IP x
8.3.1.6.1. General Guidelines 8.3.1.6.2. QDR II, QDR II+ and QDR II+ Xtreme SRAM Command Signals 8.3.1.6.3. QDR II, QDR II+ and QDR II+ Xtreme SRAM Address Signals 8.3.1.6.4. QDR II, QDR II+, and QDR II+ Xtreme SRAM Clock Signals 8.3.1.6.5. QDR II, QDR II+ and QDR II+ Xtreme SRAM Data, BWS, and QVLD Signals 8.3.1.6.6. Resource Sharing Guidelines (Multiple Interfaces)
8.4. QDR II/II+/II+ Xtreme Board Design Guidelines x
8.4.1. QDR II SRAM Configurations 8.4.2. General Layout Guidelines 8.4.3. QDR II Layout Guidelines 8.4.4. QDR II SRAM Layout Approach 8.4.5. Package Deskew 8.4.6. Package Migration 8.4.7. Slew Rates
9. Arria® 10 EMIF IP for QDR-IV x
9.1. Parameter Descriptions 9.2. Board Skew Equations 9.3. Pin and Resource Planning 9.4. QDR-IV Board Design Guidelines
9.1. Parameter Descriptions x
9.1.1. Intel Arria 10 EMIF IP QDR-IV Parameters: General 9.1.2. Intel Arria 10 EMIF IP QDR-IV Parameters: Memory 9.1.3. Intel Arria 10 EMIF IP QDR-IV Parameters: FPGA I/O 9.1.4. Intel Arria 10 EMIF IP QDR-IV Parameters: Mem Timing 9.1.5. Intel Arria 10 EMIF IP QDR-IV Parameters: Board 9.1.6. Intel Arria 10 EMIF IP QDR-IV Parameters: Controller 9.1.7. Intel Arria 10 EMIF IP QDR-IV Parameters: Diagnostics 9.1.8. Intel Arria 10 EMIF IP QDR-IV Parameters: Example Designs
9.2. Board Skew Equations x
9.2.1. Equations for QDR-IV Board Skew Parameters
9.3. Pin and Resource Planning x
9.3.1. Interface Pins
9.3.1. Interface Pins x
9.3.1.1. Estimating Pin Requirements 9.3.1.2. Maximum Number of Interfaces 9.3.1.3. FPGA Resources 9.3.1.4. OCT 9.3.1.5. PLL 9.3.1.6. Pin Guidelines for Arria® 10 EMIF IP 9.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
9.3.1.6. Pin Guidelines for Arria® 10 EMIF IP x
9.3.1.6.1. General Guidelines 9.3.1.6.2. QDR IV SRAM Commands and Addresses, AP, and AINV Signals 9.3.1.6.3. QDR IV SRAM Clock Signals 9.3.1.6.4. QDR IV SRAM Data, DINV, and QVLD Signals
9.4. QDR-IV Board Design Guidelines x
9.4.1. QDR-IV Layout Approach 9.4.2. General Layout Guidelines 9.4.3. QDR-IV Layout Guidelines 9.4.4. Package Deskew 9.4.5. Package Migration 9.4.6. Slew Rates
10. Arria® 10 EMIF IP for RLDRAM 3 x
10.1. Parameter Descriptions 10.2. Board Skew Equations 10.3. Pin and Resource Planning 10.4. RLDRAM 3 Board Design Guidelines
10.1. Parameter Descriptions x
10.1.1. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: General 10.1.2. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Memory 10.1.3. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: FPGA I/O 10.1.4. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Mem Timing 10.1.5. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Board 10.1.6. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Controller 10.1.7. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Diagnostics 10.1.8. Intel Arria 10 EMIF IP RLDRAM 3 Parameters: Example Designs
10.2. Board Skew Equations x
10.2.1. Equations for RLDRAM 3 Board Skew Parameters
10.3. Pin and Resource Planning x
10.3.1. Interface Pins
10.3.1. Interface Pins x
10.3.1.1. Estimating Pin Requirements 10.3.1.2. Maximum Number of Interfaces 10.3.1.3. FPGA Resources 10.3.1.4. OCT 10.3.1.5. PLL 10.3.1.6. Pin Guidelines for Arria® 10 EMIF IP 10.3.1.7. Resource Sharing Guidelines (Multiple Interfaces)
10.3.1.6. Pin Guidelines for Arria® 10 EMIF IP x
10.3.1.6.1. General Guidelines 10.3.1.6.2. RLDRAM 3 Commands and Addresses 10.3.1.6.3. RLDRAM 3 Clock Signals 10.3.1.6.4. RLDRAM 3 Data, DM and QVLD Signals
10.4. RLDRAM 3 Board Design Guidelines x
10.4.1. RLDRAM 3 Configurations 10.4.2. General Layout Guidelines 10.4.3. RLDRAM 3 Layout Guidelines 10.4.4. Layout Approach 10.4.5. Package Deskew 10.4.6. Package Migration
11. Arria® 10 EMIF IP for LPDDR3 x
11.1. Parameter Descriptions 11.2. Board Skew Equations 11.3. Pin and Resource Planning 11.4. LPDDR3 Board Design Guidelines
11.1. Parameter Descriptions x
11.1.1. Intel Arria 10 EMIF IP LPDDR3 Parameters: General 11.1.2. Intel Arria 10 EMIF IP LPDDR3 Parameters: Memory 11.1.3. Intel Arria 10 EMIF IP LPDDR3 Parameters: Mem I/O 11.1.4. Intel Arria 10 EMIF IP LPDDR3 Parameters: FPGA I/O 11.1.5. Intel Arria 10 EMIF IP LPDDR3 Parameters: Mem Timing 11.1.6. Intel Arria 10 EMIF IP LPDDR3 Parameters: Board 11.1.7. Intel Arria 10 EMIF IP LPDDR3 Parameters: Controller 11.1.8. Intel Arria 10 EMIF IP LPDDR3 Parameters: Diagnostics 11.1.9. Intel Arria 10 EMIF IP LPDDR3 Parameters: Example Designs
11.2. Board Skew Equations x
11.2.1. Equations for LPDDR3 Board Skew Parameters
11.3. Pin and Resource Planning x
11.3.1. Interface Pins
11.3.1. Interface Pins x
11.3.1.1. Estimating Pin Requirements 11.3.1.2. Maximum Number of Interfaces 11.3.1.3. FPGA Resources 11.3.1.4. OCT 11.3.1.5. PLL 11.3.1.6. Pin Guidelines for Arria® 10 EMIF IP
11.3.1.6. Pin Guidelines for Arria® 10 EMIF IP x
11.3.1.6.1. General Guidelines 11.3.1.6.2. LPDDR3 Clock Signal 11.3.1.6.3. LPDDR3 Command and Address Signal 11.3.1.6.4. LPDDR3 Data, Data Strobe, and DM Signals 11.3.1.6.5. Resource Sharing Guidelines (Multiple Interfaces)
11.4. LPDDR3 Board Design Guidelines x
11.4.1. Terminations and Slew Rates with Arria® 10 Devices 11.4.2. Channel Signal Integrity Measurement 11.4.3. Layout Approach 11.4.4. Design Layout Guidelines 11.4.5. Package Deskew
11.4.1. Terminations and Slew Rates with Arria® 10 Devices x
11.4.1.1. Dynamic On-Chip Termination (OCT) in Arria® 10 Devices 11.4.1.2. Choosing Terminations on Arria® 10 Devices 11.4.1.3. On-Chip Termination Recommendations for Arria® 10 Devices
11.4.2. Channel Signal Integrity Measurement x
11.4.2.1. Importance of Accurate Channel Signal Integrity Information 11.4.2.2. Understanding Channel Signal Integrity Measurement 11.4.2.3. How to Enter Calculated Channel Signal Integrity Values 11.4.2.4. Guidelines for Calculating DDR3 Channel Signal Integrity
11.4.4. Design Layout Guidelines x
11.4.4.1. General Layout Guidelines 11.4.4.2. Layout Guidelines 11.4.4.3. Length Matching Rules 11.4.4.4. Spacing Guidelines 11.4.4.5. Layout Guidelines for DDR3 and DDR4 SDRAM Wide Interface (>72 bits) 11.4.4.6. Fly-By Network Design for Clock, Command, and Address Signals
11.4.5. Package Deskew x
11.4.5.1. DQ/DQS/DM Deskew 11.4.5.2. Address and Command Deskew 11.4.5.3. Package Deskew Recommendations for Arria® 10 Devices 11.4.5.4. Deskew Example 11.4.5.5. Package Migration
12. Arria® 10 EMIF IP Timing Closure x
12.1. Timing Closure 12.2. Timing Report DDR 12.3. Optimizing Timing 12.4. Early I/O Timing Estimation
12.1. Timing Closure x
12.1.1. Timing Analysis
12.1.1. Timing Analysis x
12.1.1.1. PHY or Core 12.1.1.2. I/O Timing
12.1.1.2. I/O Timing x
12.1.1.2.1. Read Capture 12.1.1.2.2. Write 12.1.1.2.3. Address and Command 12.1.1.2.4. DQS Gating / Postamble 12.1.1.2.5. Write Leveling
12.4. Early I/O Timing Estimation x
12.4.1. Performing Early I/O Timing Analysis
13. Optimizing Controller Performance x
13.1. Interface Standard 13.2. Bank Management Efficiency 13.3. Data Transfer 13.4. Improving Controller Efficiency
13.4. Improving Controller Efficiency x
13.4.1. Auto-Precharge Commands 13.4.2. Latency 13.4.3. Calibration 13.4.4. Bank Interleaving 13.4.5. Additive Latency and Bank Interleaving 13.4.6. User-Controlled Refresh 13.4.7. Frequency of Operation 13.4.8. Series of Reads or Writes 13.4.9. Data Reordering 13.4.10. Starvation Control 13.4.11. Command Reordering 13.4.12. Bandwidth 13.4.13. Enable Command Priority Control
13.4.2. Latency x
13.4.2.1. Additive Latency
13.4.6. User-Controlled Refresh x
13.4.6.1. Back-to-Back User-Controlled Refresh Usage
14. Arria® 10 EMIF IP Debugging x
14.1. Interface Configuration Performance Issues 14.2. Functional Issue Evaluation 14.3. Timing Issue Characteristics 14.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer 14.5. Hardware Debugging Guidelines 14.6. Categorizing Hardware Issues 14.7. Debugging Arria® 10 EMIF IP 14.8. Using the Traffic Generator with the Generated Design Example
14.1. Interface Configuration Performance Issues x
14.1.1. Interface Configuration Bottleneck and Efficiency Issues
14.2. Functional Issue Evaluation x
14.2.1. Intel® IP Memory Model 14.2.2. Vendor Memory Model 14.2.3. Transcript Window Messages 14.2.4. Modifying the Example Driver to Replicate the Failure
14.3. Timing Issue Characteristics x
14.3.1. Evaluating FPGA Timing Issues 14.3.2. Evaluating External Memory Interface Timing Issues
14.4. Verifying Memory IP Using the Signal Tap II Logic Analyzer x
14.4.1. Signals to Monitor with the Signal Tap II Logic Analyzer
14.5. Hardware Debugging Guidelines x
14.5.1. Create a Simplified Design that Demonstrates the Same Issue 14.5.2. Measure Power Distribution Network 14.5.3. Measure Signal Integrity and Setup and Hold Margin 14.5.4. Vary Voltage 14.5.5. Operate at a Lower Speed 14.5.6. Determine Whether the Issue Exists in Previous Versions of Software 14.5.7. Determine Whether the Issue Exists in the Current Version of Software 14.5.8. Try A Different PCB 14.5.9. Try Other Configurations 14.5.10. Debugging Checklist
14.6. Categorizing Hardware Issues x
14.6.1. Signal Integrity Issues 14.6.2. Hardware and Calibration Issues
14.6.1. Signal Integrity Issues x
14.6.1.1. Characteristics of Signal Integrity Issues 14.6.1.2. Evaluating SignaI Integrity Issues
14.6.1.2. Evaluating SignaI Integrity Issues x
14.6.1.2.1. Skew 14.6.1.2.2. Crosstalk 14.6.1.2.3. Power System 14.6.1.2.4. Clock Signals 14.6.1.2.5. Read Data Valid Window and Eye Diagram 14.6.1.2.6. Write Data Valid Window and Eye Diagram 14.6.1.2.7. OCT and ODT Usage
14.6.2. Hardware and Calibration Issues x
14.6.2.1. Postamble Timing Issues and Margin 14.6.2.2. Intermittent Issue Evaluation
14.7. Debugging Arria® 10 EMIF IP x
14.7.1. Debugging With the External Memory Interface Debug Toolkit 14.7.2. On-Chip Debug Port for Arria® 10 EMIF IP 14.7.3. Efficiency Monitor and Protocol Checker
14.7.1. Debugging With the External Memory Interface Debug Toolkit x
14.7.1.1. User Interface 14.7.1.2. Communication 14.7.1.3. Setup and Use 14.7.1.4. Configuring Your EMIF IP for Use with the Debug Toolkit 14.7.1.5. Reports 14.7.1.6. On-Die Termination Calibration 14.7.1.7. Eye Diagram 14.7.1.8. Driver Margining for Arria® 10 EMIF IP 14.7.1.9. Example Tcl Script for Running the EMIF Debug Toolkit 14.7.1.10. Using the EMIF Debug Toolkit with Arria® 10 HPS Interfaces
14.7.1.4. Configuring Your EMIF IP for Use with the Debug Toolkit x
14.7.1.4.1. Daisy-Chaining Additional EMIF IP Cores for Debugging 14.7.1.4.2. General Workflow 14.7.1.4.3. Linking the Project to a Device 14.7.1.4.4. Establishing Communication to Connections 14.7.1.4.5. Selecting an Active Interface
14.7.1.8. Driver Margining for Arria® 10 EMIF IP x
14.7.1.8.1. Determining Margin
14.7.2. On-Chip Debug Port for Arria® 10 EMIF IP x
14.7.2.1. EMIF On-Chip Debug Port 14.7.2.2. Access Protocol
14.7.3. Efficiency Monitor and Protocol Checker x
14.7.3.1. Including the Efficiency Monitor and Protocol Checker in Your Generated IP 14.7.3.2. Running the Efficiency Monitor with the External Memory Debug Toolkit 14.7.3.3. Communicating Directly to the Efficiency Monitor and Protocol Checker
1. Release Information
2. External Memory Interfaces Arria® 10 FPGA IP Introduction
3. Arria® 10 EMIF IP Product Architecture
4. Arria® 10 EMIF IP End-User Signals
5. Arria® 10 EMIF – Simulating Memory IP
6. Arria® 10 EMIF IP for DDR3
7. Arria® 10 EMIF IP for DDR4
8. Arria® 10 EMIF IP for QDR II/II+/II+ Xtreme
9. Arria® 10 EMIF IP for QDR-IV
10. Arria® 10 EMIF IP for RLDRAM 3
11. Arria® 10 EMIF IP for LPDDR3
12. Arria® 10 EMIF IP Timing Closure
13. Optimizing Controller Performance
14. Arria® 10 EMIF IP Debugging
15. External Memory Interfaces Arria® 10 FPGA IP User Guide Archives
16. Document Revision History for External Memory Interfaces Arria® 10 FPGA IP User Guide

16. Document Revision History for External Memory Interfaces Arria® 10 FPGA IP User Guide

Document Version Quartus® Prime Version IP Version Changes
2024.11.28 24.1 19.2.3 In the End-User Signals chapter, modified the description of the amm_ready port in the ctrl_amm for DDR3, ctrl_amm for DDR4, ctrl_amm for QDR II/II+/II+ Xtreme, and ctrl_amm for QDR-IV topics.
2024.04.01 24.1 19.2.3
  • In each of the protocol-specific chapters, removed references to the Use Soft NIOS Processor for On-Chip Debug parameter.
  • In the Debug chapter, in the Driver Margining for Arria 10 EMIF IP topic, removed a sentence at the end of the topic.
  • In the Debug chapter, removed a sentence from the EMIF On-Chip Debug Port topic.
2023.12.19 21.1 19.2.0
  • In the Product Architecture chapter:
    • Added a sentence to the first bullet point in the PLL Reference Clock Networks topic.
    • Added a note about ALERT# placement, to the Using the Ping Pong PHY topic.
  • In the DDR4 chapter, removed reference to a Use clamshell layout parameter from the DDR4 Parameters: General topic.
  • Added additional information to global_reset_n references in the General Guidelines and Resource Sharing Guidelines (Multiple References) topics in each protocol-specific chapter throughout the document.
2023.05.10 21.1 19.2.0 In each protocol-specific Parameter Descriptions section, modified the description of the PLL reference clock jitter parameter.
2023.04.18 21.1 19.2.0 In the DDR4 chapter, removed preload references from the Group: Diagnostics / Simulation Options table in the Arria® 10 EMIF IP DDR4 Parameters: Diagnostics topic.
2022.09.28 21.1 19.2.0 In the Parameter Description sections of the DDR3, DDR4, QDR II, RLDRAM 3, and LPDDR3 chapters, removed the Groups: Diagnostics / Traffic Generator table, because the parameters described therein are not supported by the Arria® 10 EMIF IP.
2022.03.11 21.1 19.2.0
  • In the Product Architecture chapter, added content to the Restrictions on I/O Bank Usage for Arria® 10 EMIF IP with HPS topic.
  • In the DDR4 chapter:
    • In the Layout Guidelines topic, modified the second bullet point in the Clock Routing description in the Layout Guidelines table.
    • In the Length Matching Rules topic, modified the propagation delay value in the SDRAM Component Address and Command Routing Guidelines figure,
2021.12.06 21.1 19.2.0 In the DDR4 chapter:
  • Added alert_n Pin Termination Recommendation topic to the Pin Guidelines section.
  • Modified the Dynamic On-Chip Termination (OCT) in Arria® 10 Devices topic.
  • Modified the alert_n pin termination guidance in the Length Matching Rules topic in the Board Design Guidelines section.
2021.03.29 21.1 19.2.0
  • In the Simulating Memory IP chapter, removed references to the NCSim* simulator.
  • In the Arria® 10 EMIF IP DDR4 chapter, added content to the Enable ALERT#/PAR pins description, in the Arria® 10 EMIF IP DDR4 Parameters: Memory topic.
  • Added Package Migration topic to the Board Design Guidelines section of each protocol-specific chapter.
2020.12.18 19.3 19.1.0 In the Memory Mapped Register (MMR) Tables section of the End-User Signals chapter, added information about ECC errors to the ecc6: Address of Most Recent Correction Command Dropped topic.
2020.04.10 19.3 19.1.0 In the Controller Parameters section of the DDR3 and DDR4 chapters, removed a sentence from the description of the Enable Error Detection and Correction Logic with ECC parameter.
2020.03.12 19.3 19.1.0 Modified the Restrictions on I/O Bank Usage for Arria® 10 EMIF IP with HPS topic in the Product Architecture topic.
2020.01.28 19.3 19.1.0 Added the x4 DIMM Implementation topic to the Pin and Resource Planning sections of the Arria® 10 EMIF IP for DDR3 and Arria® 10 EMIF IP for DDR4 chapters.
2019.09.30 19.3 19.1.0
  • Added the Release Information topic.
  • In the Arria® 10 EMIF IP for DDR3 chapter, changed the text of the third bullet in step 10, in the General Guidelines topic.
  • In the Arria® 10 EMIF IP for DDR4 chapter:
    • Added Additional Layout Guidelines for DDR4 Twin-die Devices topic to the DDR4 Board Design Guidelines section.
    • Changed the text of the third bullet in step 10, in the General Guidelines topic.
  • In the Bank Interleaving topic of theController Optimization chapter, made a correction to the material within parentheses in the description of the second supported interleaving option.
  • In the Arria® 10 EMIF IP Debugging chapter:
    • Restructured the Debugging Stratix® 10 EMIF IP section.
    • Added the Using the Traffic Generator with the Generated Design Example topic.
2019.04.30 19.1  
  • Modified the PHY Address & Command values for the Quarter:Write and Quarter:Read rows in the Latency in Full-Rate Memory Clock Cycles table in the Latency topic in the Controller Optimization chapter.
  • Added the External Memory Interfaces Arria® 10 FPGA IP User Guide Archives chapter.
2019.04.01 19.1  
  • Added Slew Rates topic to the Board Design Guidelines section in each of the DDR3, DDR4, QDR II/II+/II+ Xtreme, QDR-IV, and LPDDR3 protocol-specific chapters.
  • Revised the Optimizing Timing topic in the Stratix® 10 EMIF IP Timing Closure chapter.
2018.10.30 18.1   Changed the recommended input side termination for Data and Data Strobe signals to 120 ohms in the On-Chip Termination Recommendations for Arria® 10 Devices topic in the Arria® 10 EMIF IP for DDR3 chapter.
2018.09.24 18.1  
  • Removed local_reset_req and local_reset_status from all protocols in the Interface and Signal Descriptions section of the Arria® 10 EMIF IP End-User Signals chapter.
  • Removed hps_emif from the QDR II, QDR-IV, RLDRAM 3, and LPDDR3 sections in the Interface and Signal Descriptions section of the Arria® 10 EMIF IP End-User Signals chapter.
  • Removed mem_reset_n from the description of the mem interface for QDR II and LPDDR3 in the Interface and Signal Descriptions section of the Arria® 10 EMIF IP End-User Signals chapter.
  • Removed mem_ck and mem_ck_n from the description of the mem interface for QDR II in the Interface and Signal Descriptions section of the Arria® 10 EMIF IP End-User Signals chapter.
  • Removed a note from the I/O SSM Sharing topic, in the Product Architecture chapter.
  • Added notes to the Bank Management Efficiency and Data Transfer topics in the Optimizing Controller Performance chapter.
  • Modified the names of the interleaving options in the Bank Interleaving topic in the Optimizing Controller Performance chapter.
  • Added Efficiency Monitor and Protocol Checker section to the IP Debugging chapter.
2018.08.08 18.0  
  • In the Command and Address Signals topic in the DDR3 and DDR4 chapters, changed SSTL-12 I/O standard reference to 1.2V I/O standard.
  • Modified the descriptions of the Clock rate of user logic, Memory format, DQ width, and Enable In-System-Sources-and-Probes parameters in the DDR3, DDR4, QDR II/II+/Xtreme, QDR-IV, and RLDRAM 3 chapters, as appropriate.
  • Removed the Traffic Generator 2.0 section from the Arria® 10 EMIF IP Debugging chapter.
2018.05.07 18.0  
  • Changed document title from Arria® 10 External Memory Interfaces IP User Guide to External Memory Interfaces Arria® 10 FPGA IP User Guide.
  • In the Product Architecture chapter:
    • Revised the maximum speed rating for the Hard PHY in the EMIF Architecture: Introduction topic.
    • Added information to the first paragraph of the Input DQS Clock Tree topic.
    • Added information to the DQS Tracking topic.
  • In the Simulating Memory IP chapter:
    • Minor modifications to the Simulating Memory IP topic.
    • Removed note from Full calibration bullet point in the Simulation Options topic.
    • Minor modifications to the Simulation Walkthrough topic.
    • Changed directory path information in the Simulation Scripts, Functional Simulation with Verilog HDL, Functional Simulation with VHDL, and Simulating the Example Design topics.
  • In the DDR3 chapter:
    • Modified paragraph in the FPGA Resources topic.
    • Clarified the explanation of adjacent I/O banks in the Pin Guidelines for Arria® 10 EMIF IP topic.
    • Added note about I/O bank availability to the beginning of the General Guidelines topic.
    • Added explanation of adjacent I/O banks to the I/O Banks Selection section in the General Guidelines topic.
    • Modified equations in Guidelines for Calculating DDR3 Channel Signal Integrity topic.
  • In the DDR4 chapter:
    • Modified paragraph in the FPGA Resources topic.
    • Clarified the explanation of adjacent I/O banks in the Pin Guidelines for Arria® 10 EMIF IP topic.
    • Added note about I/O bank availability to the beginning of the General Guidelines topic.
    • Added explanation of adjacent I/O banks to the I/O Banks Selection section in the General Guidelines topic.
    • Modified equations in Guidelines for Calculating DDR4 Channel Signal Integrity topic.
  • In the QDR II/II+/II+ Xtreme chapter:
    • Modified paragraph in the FPGA Resources topic.
    • Clarified the explanation of adjacent I/O banks in the Pin Guidelines for Arria® 10 EMIF IP topic.
    • Added note about I/O bank availability to the beginning of the General Guidelines topic.
  • In the QDR-IV chapter:
    • Modified paragraph in the FPGA Resources topic.
    • Clarified the explanation of adjacent I/O banks in the Pin Guidelines for Arria® 10 EMIF IP topic.
    • Added note about I/O bank availability to the beginning of the General Guidelines topic.
  • In the RLDRAM 3 chapter:
    • Modified paragraph in the FPGA Resources topic.
    • Clarified the explanation of adjacent I/O banks in the Pin Guidelines for Arria® 10 EMIF IP topic.
    • Added note about I/O bank availability to the beginning of the General Guidelines topic.
  • In the LPDDR3 chapter:
    • Modified paragraph in the FPGA Resources topic.
    • Minor rewording of the second paragraph in the OCT topic.
    • Clarified the explanation of adjacent I/O banks in the Pin Guidelines for Arria® 10 EMIF IP topic.
    • Added note about I/O bank availability to the beginning of the General Guidelines topic.
    • Modified equations in Guidelines for Calculating LPDDR3 Channel Signal Integrity topic.
  • In the Timing Closure chapter:
    • Updated figures in the Read Capture Timing Analysis, Write Timing Analysis, Address and Command Timing Analysis, DQS Gating Timing Analysis, Write Leveling Timing Analysis, and Timing Report DDR topics.
  • In the Optimizing Controller Performance chapter:
    • Revised the calculations in the Refresh bullet point in the Interface Standard topic.
    • Revised the Frequency of Operation topic.
    • Revised the Bandwidth equation in the Bandwidth topic.
    • Revised the bulleted list of tools and methods in the Improving Controller Efficiency topic.
    • Removed the Command Queue Look Ahead Depth topic.
    • Updated figure in Additive Latency topic.
    • Updated both figures and associated text in Additive Latency and Bank Interleaving topic.
    • Added sentence to the introductory paragraph of the Command Reordering topic.
    • Added Enable Command Priority Control topic.
Date Version Changes
November 2017 2017.11.06 Initial release. Consolidates relevant content from the External Memory Interface Handbook.
Level Two Title