PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
ID
821801
Date
8/29/2025
Public
1. Overview
2. BGA Footprint and Land Pattern
3. General PCB Design Considerations
4. VPBGA PCB Routing Guidelines
5. MBGA PCB Routing Guidelines
6. EMIF PCB Routing Guidelines (VPBGA and MBGA)
7. MIPI Interface Layout Design Guidelines (VPBGA and MBGA)
8. True Differential I/O Interface PCB Routing Guidelines (VPBGA and MBGA)
9. Power Distribution Network Design Guidelines
10. Document Revision History for the PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
6.5.1. Single Rank ×8 Memory Down Topology
6.5.2. Single Rank ×16 Memory Down Topology
Single Rank ×16 Memory Down Topology
6.5.3. VREF_CA/RESET Signal Routing Guidelines for Memory Down Topologies
6.5.4. Skew Matching Guidelines for DDR4 Memory Down Configurations
6.5.5. Power Delivery Recommendation for DDR4 Discrete Configurations
9.1. Agilex™ 5 Power Distribution Network Design Guidelines Overview
9.2. Power Delivery Overview
9.3. Board Power Delivery Network Recommendations
9.4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
9.5. PCB PDN Design Guideline for Unused GTS Transceiver
9.6. PCB Voltage Regulator Recommendation for PCB Power Rails
9.7. Board PDN Simulations
9.8. Agilex™ 5 Device Family PDN Design Summary
6.5.2. Single Rank ×16 Memory Down Topology
Single Rank ×16 Memory Down Topology
A single channel with single rank and ×16 memory devices, this interface covers data bytes (DQ/DQS), address signals, command signals (BA, BG, RAS, CAS, WE, ACT, PAR), control signals (CKE, CS, ODT) and clocks (CLK).
Figure 67. Stripline Routing for DDR4 Single Rank ×16 Discrete TopologyThis figure illustrates the single rank ×16 memory down topology of stripline routing for BGA inner pins. You can adjust the design topology based on the actual PCB design (single rank ×16 or dual-rank ×16)
Figure 68. Microstrip Routing on the Outer Layer for DDR4 Single Rank ×16 Memory Down TopologyThis figure illustrate the design example of single rank ×16 memory down topology microstrip routing for BGA outer pins. You can adjust the design based on the actual PCB design (single rank or dual-rank).
Signal Group | Segment | Routing Layer | Maximum Length (mil) | Target Zse (Ω) | Trace Spacing S1 (mil): Within Group | Trace Spacing S2 (mil): CMD/CTRL/CLK to DQ/DQS | Trace Spacing S3 (mil), DQ Nibble to Nibble | Trace Spacing (mil), Within DIFF pair | Trace Spacing (mil), DQS pair to DQ | Trace Spacing (mil), CLK pair to CMD/CTRL/CKE | Rtt/Ctt | |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Segment | Total MB | |||||||||||
CLK | BO1 | US | 50 | To first DRAM: 4000 To last DRAM: 6800 |
3 | 3h | 4 | 3h | R1=36 Ω C1=10 nF |
|||
BO2 | SL | 1000 | 3 | 3h | 4 | 3h | ||||||
M | SL | 40 | 3h | 4 | 3h | |||||||
BI1 | US | 50 | 3h | 4 | 3h | |||||||
BI2 | SL | 700 | 50+ | 3h | 4 | 3h | ||||||
T1 | SL | 300 | 3h | 4 | 3h | |||||||
T2 | US | 50 | 3h | 4 | 3h | |||||||
CMD/CTRL/Alert | BO1 | US | 50 | To first DRAM: 4000 To last DRAM: 6800 |
3 | 3h | R1=36 Ω | |||||
BO2 | SL | 1000 | 3 | 3h | ||||||||
M | SL | 40 | 2h | 3h | ||||||||
BI1 | US | 50 | 2h | 3h | ||||||||
BI2 | SL | 700 | 50+ | 2h | 3h | |||||||
T1 | SL | 300 | 2h | 3h | ||||||||
T2 | US | 50 | 2h | 3h | ||||||||
DQ | BO1 | US | 50 | 5000 | 3 | 3h | ||||||
BO2 | SL | 1000 | 3 | 3h | ||||||||
M | SL | 45 | 2h | 3h | ||||||||
BI | US | 50 | 2h | 3h | ||||||||
DQS | BO1 | US | 50 | 5000 | 4 | 3 | ||||||
BO2 | SL | 1000 | 4 | 3 | ||||||||
M | SL | 45 | 4 | 3h | ||||||||
BI | US | 50 | 4 | 3h |
Signal Group | Segment | Routing Layer | Maximum Length (mil) | Target Zse (Ω) | Trace Spacing S1 (mil): Within Group | Trace Spacing S3 (mil): DQ Nibble to Nibble | Trace Spacing (mil), Within DIFF pair | Trace Spacing (mil), DQS pair to DQ | |
---|---|---|---|---|---|---|---|---|---|
Segment | Total MB | ||||||||
DQ | BO | US | 100 | 3000 | MBGA package: 3 VPBGA package: 4 |
||||
M | US | 45 | 3h | 3h | |||||
BI | US | 300 | 4 | ||||||
DQS | BO | US | 50 | 3000 | MBGA package: 3 VPBGA package: 4 |
MBGA package: 3 VPBGA package: 4 |
|||
M | US | 45 | 4 | 4h | |||||
BI | US | 300 | 4 | 4 |