PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
ID
821801
Date
8/29/2025
Public
1. Overview
2. BGA Footprint and Land Pattern
3. General PCB Design Considerations
4. VPBGA PCB Routing Guidelines
5. MBGA PCB Routing Guidelines
6. EMIF PCB Routing Guidelines (VPBGA and MBGA)
7. MIPI Interface Layout Design Guidelines (VPBGA and MBGA)
8. True Differential I/O Interface PCB Routing Guidelines (VPBGA and MBGA)
9. Power Distribution Network Design Guidelines
10. Document Revision History for the PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
9.1. Agilex™ 5 Power Distribution Network Design Guidelines Overview
9.2. Power Delivery Overview
9.3. Board Power Delivery Network Recommendations
9.4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
9.5. PCB PDN Design Guideline for Unused GTS Transceiver
9.6. PCB Voltage Regulator Recommendation for PCB Power Rails
9.7. Board PDN Simulations
9.8. Agilex™ 5 Device Family PDN Design Summary
1. Overview
This document provides guidelines for creating superior PCB designs for Agilex™ 5 FPGAs and SoCs. The document covers PCB layouts, High Speed Serial Interface (HSSI), External Memory Interface (EMIF), Mobile Industry Processor Interface (MIPI), True Differential I/O Interfaces, and Power Distribution Network (PDN).
The guidelines include recommended footprint and land patterns, and HSSI, EMIF, MIPI, and True Differential I/O routing guidelines for the following Agilex™ 5 FPGAs and SoCs packages:
- B18A—474-pins VPBGA package
- B23A—839-pins VPBGA package
- B23B—795-pins VPBGA package
- B32A—1591-pins VPBGA package
- B32B—1610-pins VPBGA package
- M16A—896-pins MBGA package
Note: Information about B15A and B23D packages are under development and not yet available.
For more information about Agilex™ 5 FPGAs and SoCs device packages, refer to the respective Manufacturing Advantage Services (MAS) Guidelines.