PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs

ID 821801
Date 8/29/2025
Public
Document Table of Contents

2. BGA Footprint and Land Pattern

When you build a BGA footprint, ensure that the ball pattern and outline match the device package. The BGA land pattern determines the number of PCB layers required for escape routing and solder joint reliability.

Table 2.  Recommended BGA FootprintsFor all rows in this table, the board pad types are metal-defined (MD), solder mask-defined (SMD), or spoked. The applicable pad function types are Critical to Function (CTF)/Non-Critical to Function (NCTF).
Package PCB Land Pad Size (µm) Solder Mask Opening Size (µm)
B18A 305 /330 /355 405 /430 /455
B23A 305 /330 /355 405 /430 /455
B23B 305 /330 /355 405 /430 /455
B32A 305 /330 /355 405 /430 /455
B32B 305 /330 /355 405 /430 /455
M16A 255 /280 /305 355 /380 /405

For details about pad diameter of Agilex™ 5 E-Series and D-Series FPGAs and SoCs devices, refer to Agilex™ 5 Device Allegro* PCB Footprint. For details about pad locations, refer to Agilex™ 5 Device Package Ball Coordinates.