PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs

ID 821801
Date 8/29/2025
Public
Document Table of Contents

4.4. HSSI Reference PCB Stack-up

The Agilex™ 5 E-Series Device Group B Modular development kit system-on-module (SoM) design and carrier board implement the Type-III PCB stack-up examples as shown in the following figure for reference. The SoM houses the FPGA device and the carrier board includes connectors such as small form factor pluggable (SFP) connector. A pair of AcceleRate HD High-Density (ADM/F) connectors connects the two boards. You can design your PCB stack-up according to your requirements.

Figure 22. 14L Board Stack-up of Modular Development Kit (SoM Design)PCB laminate material is TU863+. Total board thickness is 61.8 mil.
Figure 23. 12L Board Stack-up of Carrier BoardPCB laminate material is TU863+. Total board thickness is 62.99 mil.