PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
ID
821801
Date
8/29/2025
Public
1. Overview
2. BGA Footprint and Land Pattern
3. General PCB Design Considerations
4. VPBGA PCB Routing Guidelines
5. MBGA PCB Routing Guidelines
6. EMIF PCB Routing Guidelines (VPBGA and MBGA)
7. MIPI Interface Layout Design Guidelines (VPBGA and MBGA)
8. True Differential I/O Interface PCB Routing Guidelines (VPBGA and MBGA)
9. Power Distribution Network Design Guidelines
10. Document Revision History for the PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
9.1. Agilex™ 5 Power Distribution Network Design Guidelines Overview
9.2. Power Delivery Overview
9.3. Board Power Delivery Network Recommendations
9.4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
9.5. PCB PDN Design Guideline for Unused GTS Transceiver
9.6. PCB Voltage Regulator Recommendation for PCB Power Rails
9.7. Board PDN Simulations
9.8. Agilex™ 5 Device Family PDN Design Summary
4.4. HSSI Reference PCB Stack-up
The Agilex™ 5 E-Series Device Group B Modular development kit system-on-module (SoM) design and carrier board implement the Type-III PCB stack-up examples as shown in the following figure for reference. The SoM houses the FPGA device and the carrier board includes connectors such as small form factor pluggable (SFP) connector. A pair of AcceleRate HD High-Density (ADM/F) connectors connects the two boards. You can design your PCB stack-up according to your requirements.
Figure 22. 14L Board Stack-up of Modular Development Kit (SoM Design)PCB laminate material is TU863+. Total board thickness is 61.8 mil.
Figure 23. 12L Board Stack-up of Carrier BoardPCB laminate material is TU863+. Total board thickness is 62.99 mil.