PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
ID
821801
Date
8/29/2025
Public
1. Overview
2. BGA Footprint and Land Pattern
3. General PCB Design Considerations
4. VPBGA PCB Routing Guidelines
5. MBGA PCB Routing Guidelines
6. EMIF PCB Routing Guidelines (VPBGA and MBGA)
7. MIPI Interface Layout Design Guidelines (VPBGA and MBGA)
8. True Differential I/O Interface PCB Routing Guidelines (VPBGA and MBGA)
9. Power Distribution Network Design Guidelines
10. Document Revision History for the PCB Design Guidelines (HSSI, EMIF, MIPI, True Differential, PDN) User Guide: Agilex™ 5 FPGAs and SoCs
9.1. Agilex™ 5 Power Distribution Network Design Guidelines Overview
9.2. Power Delivery Overview
9.3. Board Power Delivery Network Recommendations
9.4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
9.5. PCB PDN Design Guideline for Unused GTS Transceiver
9.6. PCB Voltage Regulator Recommendation for PCB Power Rails
9.7. Board PDN Simulations
9.8. Agilex™ 5 Device Family PDN Design Summary
3. General PCB Design Considerations
This section provides general PCB layout routing recommendations for Agilex™ 5 VPBGA and MBGA devices. The recommendations include details for different interfaces, as high-speed transceiver area and General-Purpose I/O (GPIO) including EMIF routing.
A type-III PCB board uses standard PTH vias and backdrill technology to balance cost and performance. Each component in a high-speed channel can impact the overall system performance. These components are the device packages, PCB traces, PCB vias, connectors, cables, and landing pads of integrated circuit pins, connector pins, and alternating current (AC) coupling capacitor pins.