Intel® MAX® 10 High-Speed LVDS I/O User Guide

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ID 683760
Date 11/01/2021
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Document Table of Contents
Document Table of Contents x
1. Intel® MAX® 10 High-Speed LVDS I/O Overview 2. Intel® MAX® 10 High-Speed LVDS Architecture and Features 3. Intel® MAX® 10 LVDS Transmitter Design 4. Intel® MAX® 10 LVDS Receiver Design 5. Intel® MAX® 10 LVDS Transmitter and Receiver Design 6. Intel® MAX® 10 High-Speed LVDS Board Design Considerations 7. Soft LVDS IP Core References 8. Intel® MAX® 10 High-Speed LVDS I/O User Guide Archives 9. Document Revision History for Intel® MAX® 10 High-Speed LVDS I/O User Guide
1. Intel® MAX® 10 High-Speed LVDS I/O Overview x
1.1. Soft LVDS Implementation Overview
2. Intel® MAX® 10 High-Speed LVDS Architecture and Features x
2.1. Intel® MAX® 10 LVDS Channels Support 2.2. Intel® MAX® 10 LVDS SERDES I/O Standards Support 2.3. Intel® MAX® 10 High-Speed LVDS Circuitry 2.4. Intel® MAX® 10 High-Speed LVDS I/O Location 2.5. Differential I/O Pins in Low Speed Region
3. Intel® MAX® 10 LVDS Transmitter Design x
3.1. High-Speed I/O Transmitter Circuitry 3.2. LVDS Transmitter Programmable I/O Features 3.3. LVDS Transmitter I/O Termination Schemes 3.4. LVDS Transmitter FPGA Design Implementation 3.5. LVDS Transmitter Debug and Troubleshooting
3.2. LVDS Transmitter Programmable I/O Features x
3.2.1. Programmable Pre-Emphasis 3.2.2. Programmable Differential Output Voltage
3.3. LVDS Transmitter I/O Termination Schemes x
3.3.1. Emulated LVDS External Termination 3.3.2. Sub-LVDS Transmitter External Termination 3.3.3. SLVS Transmitter External Termination 3.3.4. Emulated RSDS, Emulated Mini-LVDS, and Emulated PPDS Transmitter External Termination
3.4. LVDS Transmitter FPGA Design Implementation x
3.4.1. Soft LVDS IP Core in Transmitter Mode 3.4.2. High-Speed I/O Timing Budget 3.4.3. Guidelines: LVDS Transmitter Channels Placement 3.4.4. Guidelines: LVDS Channels PLL Placement 3.4.5. Guidelines: LVDS Transmitter Logic Placement 3.4.6. Guidelines: Enable LVDS Pre-Emphasis for E144 Package
3.4.1. Soft LVDS IP Core in Transmitter Mode x
3.4.1.1. PLL Source Selection for Soft LVDS IP Core 3.4.1.2. Guidelines: LVDS TX Interface Using External PLL 3.4.1.3. Initializing the Soft LVDS IP Core
3.4.1.1. PLL Source Selection for Soft LVDS IP Core x
3.4.1.1.1. Instantiate Soft LVDS IP Core with Internal PLL 3.4.1.1.2. Instantiate Soft LVDS IP Core with External PLL
3.4.1.2. Guidelines: LVDS TX Interface Using External PLL x
3.4.1.2.1. ALTPLL Signal Interface with Soft LVDS Transmitter 3.4.1.2.2. Determining External PLL Clock Parameters for Soft LVDS Transmitter
3.4.2. High-Speed I/O Timing Budget x
3.4.2.1. Transmitter Channel-to-Channel Skew
3.5. LVDS Transmitter Debug and Troubleshooting x
3.5.1. Perform RTL Simulation Before Hardware Debug 3.5.2. Geometry-Based and Physics-Based I/O Rules
4. Intel® MAX® 10 LVDS Receiver Design x
4.1. High-Speed I/O Receiver Circuitry 4.2. LVDS Receiver I/O Termination Schemes 4.3. LVDS Receiver FPGA Design Implementation 4.4. LVDS Receiver Debug and Troubleshooting
4.1. High-Speed I/O Receiver Circuitry x
4.1.1. Soft Deserializer 4.1.2. Data Realignment Block (Bit Slip)
4.2. LVDS Receiver I/O Termination Schemes x
4.2.1. LVDS, Mini-LVDS, and RSDS Receiver External Termination 4.2.2. SLVS Receiver External Termination 4.2.3. Sub-LVDS Receiver External Termination 4.2.4. TMDS Receiver External Termination 4.2.5. HiSpi Receiver External Termination 4.2.6. LVPECL External Termination
4.3. LVDS Receiver FPGA Design Implementation x
4.3.1. Soft LVDS IP Core in Receiver Mode 4.3.2. High-Speed I/O Timing Budget 4.3.3. Guidelines: Floating LVDS Input Pins 4.3.4. Guidelines: LVDS Receiver Channels Placement 4.3.5. Guidelines: LVDS Channels PLL Placement 4.3.6. Guidelines: LVDS Receiver Logic Placement
4.3.1. Soft LVDS IP Core in Receiver Mode x
4.3.1.1. PLL Source Selection for Soft LVDS IP Core 4.3.1.2. Guidelines: LVDS RX Interface Using External PLL 4.3.1.3. Initializing the Soft LVDS IP Core
4.3.1.1. PLL Source Selection for Soft LVDS IP Core x
4.3.1.1.1. Instantiate Soft LVDS IP Core with Internal PLL 4.3.1.1.2. Instantiate Soft LVDS IP Core with External PLL
4.3.1.2. Guidelines: LVDS RX Interface Using External PLL x
4.3.1.2.1. ALTPLL Signal Interface with Soft LVDS Receiver 4.3.1.2.2. Determining External PLL Clock Parameters for Soft LVDS Receiver
4.3.2. High-Speed I/O Timing Budget x
4.3.2.1. Receiver Input Skew Margin 4.3.2.2. Guidelines: LVDS Receiver Timing Constraints
4.3.2.1. Receiver Input Skew Margin x
4.3.2.1.1. RSKM Equation 4.3.2.1.2. Example: RSKM Calculation
4.4. LVDS Receiver Debug and Troubleshooting x
4.4.1. Perform RTL Simulation Before Hardware Debug 4.4.2. Geometry-Based and Physics-Based I/O Rules
5. Intel® MAX® 10 LVDS Transmitter and Receiver Design x
5.1. Transmitter–Receiver Interfacing 5.2. LVDS Transmitter and Receiver FPGA Design Implementation 5.3. LVDS Transmitter and Receiver Debug and Troubleshooting
5.2. LVDS Transmitter and Receiver FPGA Design Implementation x
5.2.1. LVDS Transmitter and Receiver PLL Sharing Implementation 5.2.2. Initializing the Soft LVDS IP Core
5.3. LVDS Transmitter and Receiver Debug and Troubleshooting x
5.3.1. Perform RTL Simulation Before Hardware Debug 5.3.2. Geometry-Based and Physics-Based I/O Rules
6. Intel® MAX® 10 High-Speed LVDS Board Design Considerations x
6.1. Guidelines: Improve Signal Quality 6.2. Guidelines: Control Channel-to-Channel Skew 6.3. Guidelines: Determine Board Design Constraints 6.4. Guidelines: Perform Board Level Simulations
7. Soft LVDS IP Core References x
7.1. Soft LVDS Parameter Settings 7.2. Soft LVDS Interface Signals
1. Intel® MAX® 10 High-Speed LVDS I/O Overview
2. Intel® MAX® 10 High-Speed LVDS Architecture and Features
3. Intel® MAX® 10 LVDS Transmitter Design
4. Intel® MAX® 10 LVDS Receiver Design
5. Intel® MAX® 10 LVDS Transmitter and Receiver Design
6. Intel® MAX® 10 High-Speed LVDS Board Design Considerations
7. Soft LVDS IP Core References
8. Intel® MAX® 10 High-Speed LVDS I/O User Guide Archives
9. Document Revision History for Intel® MAX® 10 High-Speed LVDS I/O User Guide

6.1. Guidelines: Improve Signal Quality

To improve signal quality, follow these board design guidelines:

  • Base your board designs on controlled differential impedance. Calculate and compare all parameters such as trace width, trace thickness, and the distance between two differential traces.
  • Maintain equal distance between traces in differential I/O standard pairs as much as possible. Routing the pair of traces close to each other maximizes the common-mode rejection ratio (CMRR).
  • Keep the traces as short as possible to limit signal integrity issues. Longer traces have more inductance and capacitance.
  • Place termination resistors as close to receiver input pins as possible.
  • Use surface mount components.
  • Avoid 90° corners on board traces.
  • Use high-performance connectors.
  • Design backplane and card traces so that trace impedance matches the impedance of the connector and termination.
  • Keep an equal number of vias for both signal traces.
  • Create equal trace lengths to avoid skew between signals. Unequal trace lengths result in misplaced crossing points and decrease system margins as the transmitter-channel-to-channel skew (TCCS) value increases.
  • Limit vias because they cause discontinuities.
  • Keep toggling single-ended I/O signals away from differential signals to avoid possible noise coupling.
  • Do not route single-ended I/O clock signals to layers adjacent to differential signals.
  • Analyze system-level signals.
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