AN 307: Intel® FPGA Design Flow for AMD* Xilinx* Users

ID 683562
Date 9/08/2023

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2.1. Intel® FPGA and SoC Devices

Intel® FPGA devices are ideal for a wide variety of applications, from prototyping state-of-the-art new products all the way through to high-volume production. Intel has several FPGA families that cover high-end, mid-range, and low-cost markets. Each family includes different features such as embedded memory, digital signal processing (DSP) blocks, high-speed transceivers, and general purpose I/O pins. These features help cover a broad range of application requirements.

Intel® SoC devices bring high-integration and advanced system, power, and security management capabilities to the Intel® product portfolio. These devices are supported by industry-standard Arm* tools, along with a broad ecosystem of operating systems and development tools.

Intel FPGA and SoC devices are available in the following device families:

  • Intel Agilex® 7 FPGA and SoC devices deliver on average 50% higher core performance, or up to 40% lower power over previous generation high-end, high-performance FPGAs. Fabricated using the Intel 10 nm SuperFin technology, these FPGAs and SoCs accelerate your delivery of the most advanced bandwidth-intensive applications.
  • Intel® Stratix® 10 FPGA and SoC devices feature several groundbreaking innovations, including the Intel® Hyperflex™ core architecture. This device family enables you to meet the demand for ever-increasing transceiver and processing performance in your most advanced applications, while meeting your power budget.
  • Intel® Arria® 10 FPGA and SoC devices are ideal for your high-performance, power-sensitive midrange applications in diverse markets. The power efficiency of these devices is achieved through a comprehensive set of power-saving technologies.
  • Intel® Cyclone® 10 GX FPGA devices are built to meet your low-power, cost-sensitive, design needs in a broad range of markets such as industrial, broadcast and telecommunications.
Table 1.  Intel FPGA Family Technologies and Architectures
Intel® FPGA Family Technology Architecture
Intel Agilex® 7 F-Series and I-Series 10 nm SuperFin Fabric + Tiles
Intel® Stratix® 10 14 nm FinFet Fabric + Tiles
Intel® Arria® 10 20 nm Planar Monolithic
Intel® Cyclone® 10 GX 20 nm Planar Monolithic

The latest Intel Agilex® 7 and Intel® Stratix® 10 FPGA and SoC devices are built using heterogeneous 3D system-in-package (SiP) technology. This technology enables in-package integration of a range of component tiles such as transceivers, memory, and analog, while maintaining a monolithic FPGA fabric. Various tile die from different process nodes can be integrated in the same package, the tiles being connected to the FPGA fabric die using the Intel® Embedded Multi-die Interconnect Bridge (EMIB) packaging technology.

For more information about the Intel® SiP technology, refer to the Enabling Next-Generation Platforms Using Intel® ’s 3D System-in-Package Technology white paper.

To understand the advantages of a monolithic FPGA fabric compared to alternative silicon interposer-based schemes used in competitive FPGA and SoC devices, refer to the Achieving the Highest Levels of Integration in Programmable Logic white paper.