AN 766: Intel® Stratix® 10 Devices, High Speed Signal Interface Layout Design Guideline

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ID 683132
Date 3/12/2019
Public
Document Table of Contents
Document Table of Contents x
Intel® Stratix® 10 Devices, High Speed Signal Interface Layout Design Guideline
Intel® Stratix® 10 Devices, High Speed Signal Interface Layout Design Guideline x
Intel® Stratix® 10 Devices and Transceiver Channels PCB Stackup Selection Guideline Recommendations for High Speed Signal PCB Routing FPGA Fan-out Region Design CFP2/CFP4 Connector Board Layout Design Guideline QSFP+/zSFP/QSFP28 Connector Board Layout Design Guideline SMA 2.4-mm Layout Design Guideline Tyco/Amphenol Interlaken Connector Design Guideline Electrical Specifications Document Revision History for AN 766: Intel® Stratix® 10 Devices, High Speed Signal Interface Layout Design Guideline
FPGA Fan-out Region Design x
Signal Break-out Recommendations FPGA Fan-out Region Routing Recommendations AC Coupling Capacitor Layout and Optimization Guidelines
Signal Break-out Recommendations x
Option 1: Via-In-Pad Topology Option 2: Dog-bone with GND Cutout at BGA Pad Topology Option 3: Micro-via Topology GND Cutout Under BGA Pads in Fan-out Configuration Comparison of Dog-bone with GND Cutout Under the BGA and Via-in-Pad Configurations Trace Shape Routing at the BGA Void Area (Tear Drop Configuration)
FPGA Fan-out Region Routing Recommendations x
Comparison of Conventional and Recommended Break-out Routing Topologies
Comparison of Conventional and Recommended Break-out Routing Topologies x
Conventional Jog-out Routings with Skew-matching Right After Break-out The Impact of Via Height and Via Anti-pad Over Insertion Loss
AC Coupling Capacitor Layout and Optimization Guidelines x
0201 AC Capacitor 0402 AC Capacitor PCB AC Capacitor Placement Layout Recommendation
0201 AC Capacitor x
Sweeping Anti-pad Radius Sweeping Void Width only on the First GND Plane Under the Capacitor
0402 AC Capacitor x
Sweeping Anti-pad Radius Sweeping Void Width Only on the First GND Plane under the Capacitor Adding a Trace Reference to the 0201 AC Capacitor Adding a Trace Reference to the 0402 AC Capacitor
PCB AC Capacitor Placement Layout Recommendation x
What to Avoid for AC Capacitor Configuration
CFP2/CFP4 Connector Board Layout Design Guideline x
CFP2 Host Connector, Module Assembly, and Pinout CFP4 Host Connector, Module Assembly, and Pinout Recommended PCB Design Guideline at the CFP2/CFP4 Connector CFP4 Design Example and Optimization Performance
CFP4 Design Example and Optimization Performance x
CFP4 Connector Layout: Signal Via, Trace Routing Impact, and Optimization Two Different Break-out Routings at the CFP4 Connector Area CFP4 Connector Routing Topologies Design Example Full CFP4 Channel Analysis Design Example (Excluding the Connector) CFP2 Connector Area Layout
QSFP+/zSFP/QSFP28 Connector Board Layout Design Guideline x
QSFP+ Module Assembly and Pinout Recommended PCB Design Guideline for QSFP+/zQSFP/QSFP28 Channels Recommended QSFP+ Signal Routing QSFP28 Example Design and Performance Optimization
SMA 2.4-mm Layout Design Guideline x
SMA 2.4 mm Molex® Connector Assembly PCB Design Guidelines for Channels Using the 2.4 mm Connector 2.4 mm Example Design Performance
PCB Design Guidelines for Channels Using the 2.4 mm Connector x
Recommended PCB layout Design for Version-A SMA 2.4 mm Connector Recommended PCB layout Design for Version-B SMA 2.4 mm Connector Performance Comparison between Option1 and Option2 layout Other 2.4 mm Connectors 2.4 mm Channel Specifications
Tyco/Amphenol Interlaken Connector Design Guideline x
Connector Signal and Pin Assignment
Connector Signal and Pin Assignment x
PCB Design Guidelines for Channels with 25 Gbps + Interlaken Interface Connector Recommendations Interlaken Channel Interface Performance Example
Electrical Specifications x
CEI 28 Very Short Reach (VSR) Specifications for CFP2/CFP4/QSFP+/QSFP28/zQSFP/SMA 2.4 mm Interlaken Interface Specification
Intel® Stratix® 10 Devices, High Speed Signal Interface Layout Design Guideline

Performance Comparison between Option1 and Option2 layout

A version-B SMA connector model in figure Version-B Molex 2.4 mm SMA connector has been implemented on both layout design recommendations Option1 and Option2 in figure Recommended layout for Molex Version-A 2.4 mm SMA connector and figure Version-B 2.4 mm Connector Launch respectively. Only the Connector model and a small portion of Host PCB has been included into this simulation and performance comparison. Both simulations are using similar stack up materials and the main PCB routing is on layer 7. There is slight difference of about 6 mil in signal via height (Signal via height in Option 1 layout is about 6 mil more than that in Option 2). From Insertion loss point of via, there is about 0.18 dB difference at 14 GHz as shown in figure Single ended Insertion loss comparison for Version-B SMA connector on both recommended Option1 and Option2 layout design. (Improved by 0.18 dB at 14 GHz) .

Figure 92. Single ended Insertion loss comparison for Version-B SMA connector on both recommended Option1 and Option2 layout design. (Improved by 0.18 dB at 14 GHz)

Option 1 = Recommended PCB layout Design for Version-A SMA 2.4 mm Connector.

Option 2 = Recommended PCB layout Design for Version-B SMA 2.4 mm Connector.

Insertion loss from the point of the via improves by approximately 0.18 dB at 14 GHz.

Figure 93. Single Ended Return loss (from connector port) comparison for Version-B SMA connector on both recommended Option1 and Option2 layout design. (Improved by 4.5 dB at 14 GHz)

Option 1 = Recommended PCB layout Design for Version-A SMA 2.4 mm Connector.

Option 2 = Recommended PCB layout Design for Version-B SMA 2.4 mm Connector.

Return loss from the point of the connector port improves by 4.5 dB at 14 GHz.

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