Intel® Stratix® 10 Device Design Guidelines

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ID 683738
Date 8/24/2022
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Document Table of Contents
Document Table of Contents x
Intel® Stratix® 10 Device Design Guidelines
Intel® Stratix® 10 Device Design Guidelines x
Design Flow System Specification Device Selection Early System and Board Planning Pin Connection Considerations for Board Design I/O and Clock Planning Security Considerations Design Entry Design Implementation, Analysis, Optimization, and Verification Document Revision History for Intel® Stratix® 10 Device Design Guidelines
System Specification x
Design Specifications IP Selection Platform Designer
Device Selection x
Device Variant PLLs and Clock Routing Logic, Memory, and Multiplier Density I/O Pin Count, LVDS Channels, and Package Offering Speed Grade Vertical Device Migration
Early System and Board Planning x
Power and Thermal Estimation Thermal Management and Design Temperature Sensing for Thermal Management Voltage Sensor Planning for Device Configuration Planning for On-Chip Debugging
Planning for Device Configuration x
Device Power Cycling and Reconfiguration Configuration Scheme Selection Configuration Features Intel® Quartus® Prime Configuration Settings
Configuration Scheme Selection x
Serial Configuration Devices Download Cables
Intel® Quartus® Prime Configuration Settings x
Optional Configuration Pins Dual Purpose Configuration Pins
Planning for On-Chip Debugging x
On-Chip Debugging Tools Planning Guidelines for Debugging Tools
Pin Connection Considerations for Board Design x
Device Power-Up Power Pin Connections and Power Supplies Configuration Pin Connections Board-Related Intel® Quartus® Prime Settings Signal Integrity Considerations Board-Level Simulation and Advanced I/O Timing Analysis
Power Pin Connections and Power Supplies x
Decoupling Capacitors PLL Board Design Guidelines Transceiver Board Design Guidelines
Configuration Pin Connections x
Configuration Pin Voltage Level Clock Trace Signal Integrity JTAG Pins MSEL Configuration Mode Pins Other Configuration Pins
JTAG Pins x
JTAG Pin Connections Download Cable Operating Voltage JTAG Signal Buffering
Board-Related Intel® Quartus® Prime Settings x
Unused Pins
Signal Integrity Considerations x
High-Speed Board Design Voltage Reference Pins Simultaneous Switching Noise I/O Termination
I/O and Clock Planning x
Making FPGA Pin Assignments Early Pin Planning and I/O Assignment Analysis I/O Features and Pin Connections Clock and PLL Selection PLL Feature Guidelines Clock Control Features I/O Simultaneous Switching Noise
I/O Features and Pin Connections x
I/O Signaling Type Selectable Standards and Flexible I/O Banks Memory Interfaces Dual-Purpose and Special Pin Connections Intel® Stratix® 10 I/O Features
PLL Feature Guidelines x
Clock Feedback Mode Clock Outputs
Design Entry x
Design Recommendations Using IP Cores Reconfiguration Recommended HDL Coding Styles
Design Implementation, Analysis, Optimization, and Verification x
Selecting a Synthesis Tool Device Resource Utilization Reports Intel® Quartus® Prime Messages Timing Constraints and Analysis Area and Timing Optimization Preserving Performance and Reducing Compilation Time Designing with Intel® Hyperflex™ Simulation Power Analysis Power Optimization
Timing Constraints and Analysis x
Recommended Timing Optimization and Analysis Assignments
Power Optimization x
Device and Design Power Optimization Techniques Intel® Quartus® Prime Power Optimization Techniques
Device and Design Power Optimization Techniques x
Device Speed Grade Clock Power Management Memory Power Reduction I/O Power Guidelines
Intel® Quartus® Prime Power Optimization Techniques x
Power Optimization Advisor
Intel® Stratix® 10 Device Design Guidelines

Selectable Standards and Flexible I/O Banks

Table 50.  Selectable Standards and Flexible I/O Banks Checklist
Number Done? Checklist Item
1   Select a suitable signaling type and I/O standard for each I/O pin. The I/O banks are located in I/O columns. Each I/O bank contains its own PLL, DPA, and SERDES circuitries.
2   Ensure that the appropriate I/O standard support is supported in the targeted I/O bank.
3   Place I/O pins that share voltage levels in the same I/O bank.
4   Verify that all output signals in each I/O bank are intended to drive out at the bank VCCIO voltage level.
5   Verify that all voltage-referenced signals in each I/O bank are intended to use the bank VREF voltage level.
6   Check the I/O bank support for LVDS and transceiver features.
7   If you are using the Intel® Stratix® 10 TX 400 (1ST040E) devices, be aware that banks 3A and 3D have restrictions. I/O pins in these banks do not support LVDS SERDES or EMIF. In addition, LVDS, mini-LVDS, and RSDS I/O standards are only supported by the dedicated clock pins in these banks.
8   If you are using the Intel® Stratix® 10 GX 400 (1SG040HF35) and SX 400 (1SX040HF35) devices, be aware that banks 3A, 3C, and 3D have restrictions. I/O pins in these banks do not support LVDS SERDES or EMIF. In addition, bank 3D is limited to a maximum of 30 pins with 1.8 V I/O standard support only. Bank 3C is limited to 3.0 V and 3.3 V I/O support only. Finally, LVDS, mini-LVDS, and RSDS I/O standards are only supported by the dedicated clock pins in banks 3A and 3D.

Intel® Stratix® 10 I/O pins are arranged in groups called modular I/O banks. Be sure to use the correct dedicated pin inputs for signals such as clocks and global control signals.

The board must supply each bank with one VCCIO voltage level for every VCCIO pin in a bank. Each I/O bank is powered by the VCCIO pins of that particular bank, and is independent of the VCCIO pins of other I/O banks. A single I/O bank supports output signals that are driving at the same voltage as the VCCIO. An I/O bank can simultaneously support any number of input signals with different I/O standards.

To accommodate voltage-referenced I/O standards, each I/O bank supports multiple VREF pins feeding a common VREF bus. Set the VREF pins to the correct voltage for the I/O standards in the bank. Each I/O bank can only have a single VCCIO voltage level and a single VREF voltage level at a given time. If the VREF pins are not used as voltage references, they cannot be used as generic I/O pins and should be tied to VCCIO of that same bank or GND.

An I/O bank including single-ended or differential standards can support voltage-referenced standards as long as all voltage-referenced standards use the same VREF setting. Voltage-referenced bi-directional and output signals must drive out at the I/O bank VCCIO voltage level.

Different I/O banks include different support for LVDS signaling, and the Intel® Stratix® 10 transceiver banks include additional support. There are two types of I/O banks, LVDS and 3 V.

The LVDS I/O bank supports differential and single-ended I/O standards up to 1.8 V. The LVDS I/O pins form pairs of true differential LVDS channels. Each pair supports a parallel input/output termination between the two pins. You can use each LVDS channel as transmitter or receiver.

The 3 V I/O bank supports only single-ended I/O standards up to 3 V. Each adjacent I/O pair also supports Differential SSTL and Differential HSTL I/O standards. The single-ended output of the 3 V I/O has the same set of features as the single-ended output of the DDR I/O IP, except the programmable pre-emphasis feature.

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