Design Flow System Specification Device Selection Early System and Board Planning Pin Connection Considerations for Board Design I/O and Clock Planning Security Considerations Design Entry Design Implementation, Analysis, Optimization, and Verification Document Revision History for Intel® Stratix® 10 Device Design Guidelines
I/O Simultaneous Switching Noise
|Reduce the number of pins that switch the voltage level at exactly the same time whenever possible.
|Use differential I/O standards and lower-voltage standards for high-switching I/Os.
|Use lower drive strengths for high-switching I/Os. The default drive strength setting might be higher than your design requires.
|Reduce the number of simultaneously switching output pins within each bank. Spread output pins across multiple banks if possible.
|Spread switching I/Os evenly throughout the bank to reduce the number of aggressors in a given area to reduce SSN (when bank usage is substantially below 100%).
|Separate simultaneously switching pins from input pins that are susceptible to SSN.
|Place important clock and asynchronous control signals near ground signals and away from large switching buses.
|Avoid using I/O pins one or two pins away from PLL power supply pins for high-switching or high-drive strength pins.
|Use staggered output delays to shift the output signals through time, or use adjustable slew rate settings.
|Limit the number of unterminated SSO pins within the I/O bank where the PLL output clock resides to achieve the Intel® Stratix® 10 I/O PLL clock output jitter performance specification.
SSN is a concern when too many I/Os (in close proximity) change voltage levels at the same time. Plan the I/O and clock connections according to the recommendations.