AN 910: Intel Agilex® 7 Power Distribution Network Design Guidelines

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ID 683393
Date 12/04/2023
Public
Document Table of Contents
Document Table of Contents x
1. Intel Agilex® 7 Power Distribution Network Design Guidelines Overview 2. Power Delivery Overview 3. Board Power Delivery Network Recommendations 4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails 5. PCB PDN Design Guideline for Unused Tiles 6. PCB Voltage Regulator Recommendation for PCB Power Rails 7. Board Power Delivery Network Simulations 8. Intel Agilex® 7 Device Family PDN Design Summary 9. Document Revision History for AN 910: Intel Agilex® 7 Power Distribution Network Design Guidelines
1. Intel Agilex® 7 Power Distribution Network Design Guidelines Overview x
1.1. Device Guidelines Status for Intel Agilex® 7 Devices
2. Power Delivery Overview x
2.1. Power Architecture 2.2. Rail Merger Requirements 2.3. Power Rails Specification 2.4. Decoupling Capacitors Recommendation
2.1. Power Architecture x
2.1.1. Power Budget 2.1.2. Power Tree
2.1.2. Power Tree x
2.1.2.1. Recommended Power Tree for the Intel Agilex® 7 Devices with only P-Tile and E-Tile in the Device Packages 2.1.2.2. Recommended Power Tree for the Intel Agilex® 7 AGI or AGF (with only F-Tile, or both F-Tile and R-Tile) Device Packages 2.1.2.3. Recommended Power Tree for the Intel Agilex® 7 AGM (with only F-Tile, or both F-Tile and R-Tile) Device Packages
2.3. Power Rails Specification x
2.3.1. Power Nets 2.3.2. Power Rails Tolerance 2.3.3. Power Nets and Transient Specifications
2.3.1. Power Nets x
2.3.1.1. Intel Agilex® 7 Package Power Nets and Subsystems Details
2.4. Decoupling Capacitors Recommendation x
2.4.1. Intel Agilex® 7 FPGA Packages Board-Level Decoupling Capacitors Summary 2.4.2. Intel Agilex® 7 E-Tile Board-Level Decoupling Capacitors Summary 2.4.3. Intel Agilex® 7 P-Tile Board-Level Decoupling Capacitors Summary 2.4.4. Intel Agilex® 7 F-Tile Board-Level Decoupling Capacitors Summary 2.4.5. Intel Agilex® 7 R-Tile Board-Level Decoupling Capacitors Summary
3. Board Power Delivery Network Recommendations x
3.1. Board Decoupling Capacitors and Power Flooding Guides 3.2. FPGA Core Fabric VCC Voltage Regulator Selection 3.3. Remote Sense Connections 3.4. Load Line Requirements 3.5. VCC Core Board Current Slew Rate
4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails x
4.1. P-Tile Rail LC Filter Board Scheme and Connection 4.2. E-Tile Rail LC Filter Board Scheme and Connection 4.3. F-Tile Rail Board Connection and LC Filter Recommendation under Noisy Voltage Regulator 4.4. R-Tile Rail Board Connection and LC Filter Recommendation under Noisy Voltage Regulator
5. PCB PDN Design Guideline for Unused Tiles x
5.1. PDN Design Guideline for Unused E-Tile 5.2. PDN Design Guideline for Unused P-Tile 5.3. PDN Design Guideline for Unused R-Tile 5.4. PDN Design Guideline for Unused F-Tile
1. Intel Agilex® 7 Power Distribution Network Design Guidelines Overview
2. Power Delivery Overview
3. Board Power Delivery Network Recommendations
4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
5. PCB PDN Design Guideline for Unused Tiles
6. PCB Voltage Regulator Recommendation for PCB Power Rails
7. Board Power Delivery Network Simulations
8. Intel Agilex® 7 Device Family PDN Design Summary
9. Document Revision History for AN 910: Intel Agilex® 7 Power Distribution Network Design Guidelines

2.3.1. Power Nets

This section describes the Intel Agilex® 7 device family power nets and their subsystem details along with their board-level connection based on the recommended power trees described in the Power Tree.

For more detailed board-level connection specification, refer to the Intel Agilex® 7 Device Family Pin Connection Guidelines.


Section Content
Intel Agilex 7 Package Power Nets and Subsystems Details

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