AN 910: Intel Agilex® 7 Power Distribution Network Design Guidelines

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ID 683393
Date 12/04/2023
Public
Document Table of Contents
Document Table of Contents x
1. Intel Agilex® 7 Power Distribution Network Design Guidelines Overview 2. Power Delivery Overview 3. Board Power Delivery Network Recommendations 4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails 5. PCB PDN Design Guideline for Unused Tiles 6. PCB Voltage Regulator Recommendation for PCB Power Rails 7. Board Power Delivery Network Simulations 8. Intel Agilex® 7 Device Family PDN Design Summary 9. Document Revision History for AN 910: Intel Agilex® 7 Power Distribution Network Design Guidelines
1. Intel Agilex® 7 Power Distribution Network Design Guidelines Overview x
1.1. Device Guidelines Status for Intel Agilex® 7 Devices
2. Power Delivery Overview x
2.1. Power Architecture 2.2. Rail Merger Requirements 2.3. Power Rails Specification 2.4. Decoupling Capacitors Recommendation
2.1. Power Architecture x
2.1.1. Power Budget 2.1.2. Power Tree
2.1.2. Power Tree x
2.1.2.1. Recommended Power Tree for the Intel Agilex® 7 Devices with only P-Tile and E-Tile in the Device Packages 2.1.2.2. Recommended Power Tree for the Intel Agilex® 7 AGI or AGF (with only F-Tile, or both F-Tile and R-Tile) Device Packages 2.1.2.3. Recommended Power Tree for the Intel Agilex® 7 AGM (with only F-Tile, or both F-Tile and R-Tile) Device Packages
2.3. Power Rails Specification x
2.3.1. Power Nets 2.3.2. Power Rails Tolerance 2.3.3. Power Nets and Transient Specifications
2.3.1. Power Nets x
2.3.1.1. Intel Agilex® 7 Package Power Nets and Subsystems Details
2.4. Decoupling Capacitors Recommendation x
2.4.1. Intel Agilex® 7 FPGA Packages Board-Level Decoupling Capacitors Summary 2.4.2. Intel Agilex® 7 E-Tile Board-Level Decoupling Capacitors Summary 2.4.3. Intel Agilex® 7 P-Tile Board-Level Decoupling Capacitors Summary 2.4.4. Intel Agilex® 7 F-Tile Board-Level Decoupling Capacitors Summary 2.4.5. Intel Agilex® 7 R-Tile Board-Level Decoupling Capacitors Summary
3. Board Power Delivery Network Recommendations x
3.1. Board Decoupling Capacitors and Power Flooding Guides 3.2. FPGA Core Fabric VCC Voltage Regulator Selection 3.3. Remote Sense Connections 3.4. Load Line Requirements 3.5. VCC Core Board Current Slew Rate
4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails x
4.1. P-Tile Rail LC Filter Board Scheme and Connection 4.2. E-Tile Rail LC Filter Board Scheme and Connection 4.3. F-Tile Rail Board Connection and LC Filter Recommendation under Noisy Voltage Regulator 4.4. R-Tile Rail Board Connection and LC Filter Recommendation under Noisy Voltage Regulator
5. PCB PDN Design Guideline for Unused Tiles x
5.1. PDN Design Guideline for Unused E-Tile 5.2. PDN Design Guideline for Unused P-Tile 5.3. PDN Design Guideline for Unused R-Tile 5.4. PDN Design Guideline for Unused F-Tile
1. Intel Agilex® 7 Power Distribution Network Design Guidelines Overview
2. Power Delivery Overview
3. Board Power Delivery Network Recommendations
4. Board LC Recommended Filters for Noise Reduction in Combined Power Delivery Rails
5. PCB PDN Design Guideline for Unused Tiles
6. PCB Voltage Regulator Recommendation for PCB Power Rails
7. Board Power Delivery Network Simulations
8. Intel Agilex® 7 Device Family PDN Design Summary
9. Document Revision History for AN 910: Intel Agilex® 7 Power Distribution Network Design Guidelines

1.1. Device Guidelines Status for Intel Agilex® 7 Devices

Table 1.  Device Guidelines Status for Intel Agilex® 7 Devices (F-Series)
Device Tile Package Guidelines Status
AGF 012/014 E-Tile & P-Tile R24A Final
AGF 012/014 E-Tile & P-Tile R24B Final
AGF 019/022/023/027 E-Tile & P-Tile R25A Final
AGF 006/008 F-Tile R16A Advance
AGF 006/008/012/014/019/022/023/027 F-Tile R24C Advance
AGF 019/022/023/027 F-Tile R31C Advance
Table 2.  Device Guidelines Status for Intel Agilex® 7 Devices (I-Series)
Device Tile Package Guidelines Status
AGI 019/023 R-Tile & F-Tile R18A Preliminary
AGI 022/027 R-Tile & F-Tile R29A Preliminary
AGI 022/027 R-Tile & F-Tile R31A Advance
AGI 019/022/023/027 F-Tile R31B Preliminary
AGI 035/040 F-Tile R39A Preliminary
AGI 041 F-Tile & R-Tile R29D Advance
AGI 041 F-Tile R31B Advance
Table 3.  Device Guidelines Status for Intel Agilex® 7 Devices (M-Series)
Device Tile Package Status
AGM 032/039 R-Tile & F-Tile R47A Advance
AGM 032/039 F-Tile R31B Advance

Guidelines status descriptions:

  • Advance—for pre-production development and subject to change. Intel recommends the guidelines based on simulation.
  • Preliminary—for pre-production development and subject to change. Intel recommends the guidelines based on simulation, early validation, and early characterization data.
  • Final—for use in production design. Intel recommends the guidelines based on validation and characterization of production silicon.
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