Intel® Stratix® 10 Core Pins Intel® Stratix® 10 High Bandwidth Memory (HBM) Pins H-Tile and L-Tile Pins Intel® Stratix® 10 E-Tile Pins Intel® Stratix® 10 P-Tile Pins Intel® Stratix® 10 Hard Processor System (HPS) Pins Power Supply Sharing Guidelines for Intel® Stratix® 10 Devices Document Revision History for the Intel® Stratix® 10 Device Family Pin Connection Guidelines
Clock and PLL Pins Dedicated Configuration/JTAG Pins Optional/Dual-Purpose Configuration Pins 3V Compatible I/O Pins 3.3V I/O Pins Differential I/O Pins External Memory Interface Pins Voltage Sensor Pins Temperature Sensor Pins Reference Pins No Connect and DNU Pins Power Supply Pins Secure Device Manager (SDM) Pins Secure Device Manager (SDM) Optional Signal Pins Notes to Intel® Stratix® 10 Core Pins
Example 1— Intel® Stratix® 10 GX Example 2— Intel® Stratix® 10 GX Example 3— Intel® Stratix® 10 GX (only for the HF35 Package) Example 4— Intel® Stratix® 10 GX (only for the HF35 Package) Example 5— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) Example 6— Intel® Stratix® 10 SX (–2L and –3X parts) Example 7— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) Example 8— Intel® Stratix® 10 SX (–2L and –3X parts) Example 9— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) (only for the HF35 Package) Example 10— Intel® Stratix® 10 SX (–2L and –3X parts) (only for the HF35 Package) Example 11— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) (only for the HF35 Package) Example 12— Intel® Stratix® 10 SX (–2L and –3X parts) (only for the HF35 Package) Example 13— Intel® Stratix® 10 MX (–1V, –2V, and –3V parts) Example 14— Intel® Stratix® 10 MX (–1V, –2V, and –3V parts) Example 15— Intel® Stratix® 10 MX (E-Tile) Example 16— Intel® Stratix® 10 TX (–1V, –2V, and –3V parts) Example 17— Intel® Stratix® 10 TX (–2L and –3X parts) Example 18— Intel® Stratix® 10 DX (–1V, –2V, and –3V parts) Example 19— Intel® Stratix® 10 GX 10M Example 20— Intel® Stratix® 10 GX 10M
Notes to Intel® Stratix® 10 HPS Pins
Note: Intel recommends that you create an Intel® Quartus® Prime design, enter your device I/O assignments, and compile the design. The Intel® Quartus® Prime software will check your pin connections according to I/O assignment and placement rules. The rules differ from one device to another based on device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Intel provides these guidelines only as recommendations. It is the responsibility of the designer to apply simulation results to the design to verify proper device functionality.
- These pin connection guidelines are based on the Intel® Stratix® 10 SX device variant.
- Select the capacitance values for the power supply after you consider the amount of power they need to supply over the frequency of operation of the particular circuit being decoupled. Calculate the target impedance for the power plane based on current draw and voltage drop requirements of the device/supply. Then, decouple the power plane using the appropriate number of capacitors. On-board capacitors do not decouple higher than 100 MHz due to “Equivalent Series Inductance” of the mounting of the packages. Consider proper board design techniques such as interplane capacitance with low inductance for higher frequency decoupling. Refer to the PDN tool.
- Use the Intel® Stratix® 10 Early Power Estimator (EPE) to determine the preliminary current requirements for VCC and other power supplies. Use the Intel® Quartus® Prime Power Analyzer for the most accurate current requirements for this and other power supplies.
- These supplies may share power planes across multiple Intel® Stratix® 10 devices.
- Power pins should not share breakout vias from the BGA. Each ball on the BGA must have its own dedicated breakout via.
- Low Noise Switching Regulator - a switching regulator circuit encapsulated in a thin surface mount package containing the switch controller, power FETs, inductor, and other support components. The switching frequency is usually between 800 kHz and 1 MHz and has fast transient response. The switching frequency range is not an Intel requirement.
- The number of modular I/O banks on Intel® Stratix® 10 devices depends on the device density. For the indexes available for a specific device, refer to the I/O Bank section in the Intel® Stratix® 10 General Purpose I/O User Guide.
- For AC-coupled links, the AC-coupling capacitor can be placed anywhere along the channel. PCI Express protocol requires that the AC-coupling capacitor is placed on the transmitter side of the interface that permits adapters to be plugged and unplugged.
- For item [#], refer to the device pin table for the pin-out mapping.
- The peripheral pins are programmable through pin multiplexors. Each pin may have multiple functions. HPS and SDM dedicated I/O pin multiplexing is programmable using the Quartus Prime software. The pin mux determines how the pins are used.
- These pins are inverted or active-low signals.
- Example 3 through Example 6 illustrate the power supply sharing guidelines for the Intel® Stratix® 10 SX devices.