Intel® Stratix® 10 Device Family Pin Connection Guidelines

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ID 683028
Date 12/29/2023
Public
Document Table of Contents
Document Table of Contents x
Intel® Stratix® 10 Device Family Pin Connection Guidelines
Intel® Stratix® 10 Device Family Pin Connection Guidelines x
Intel® Stratix® 10 Core Pins Intel® Stratix® 10 High Bandwidth Memory (HBM) Pins H-Tile and L-Tile Pins Intel® Stratix® 10 E-Tile Pins Intel® Stratix® 10 P-Tile Pins Intel® Stratix® 10 Hard Processor System (HPS) Pins Power Supply Sharing Guidelines for Intel® Stratix® 10 Devices Document Revision History for the Intel® Stratix® 10 Device Family Pin Connection Guidelines
Intel® Stratix® 10 Core Pins x
Clock and PLL Pins Dedicated Configuration/JTAG Pins Optional/Dual-Purpose Configuration Pins 3V Compatible I/O Pins 3.3V I/O Pins Differential I/O Pins External Memory Interface Pins Voltage Sensor Pins Temperature Sensor Pins Reference Pins No Connect and DNU Pins Power Supply Pins Secure Device Manager (SDM) Pins Secure Device Manager (SDM) Optional Signal Pins Notes to Intel® Stratix® 10 Core Pins
Intel® Stratix® 10 High Bandwidth Memory (HBM) Pins x
UIB and eSRAM Pins Intel® Stratix® 10 HBM Power Supply Pins Notes to Intel® Stratix® 10 HBM Pins
H-Tile and L-Tile Pins x
H-Tile and L-Tile Pins
Intel® Stratix® 10 E-Tile Pins x
Intel® Stratix® 10 E-Tile Pins Notes to Intel® Stratix® 10 E-Tile Pins
Intel® Stratix® 10 P-Tile Pins x
Intel® Stratix® 10 P-Tile Power Supply Pins Intel® Stratix® 10 P-Tile Transceiver Pins
Intel® Stratix® 10 Hard Processor System (HPS) Pins x
HPS Supply Pins HPS Oscillator Clock Input Pin HPS JTAG Pins HPS GPIO Pins HPS SDMMC Pins HPS NAND Pins HPS USB Pins HPS EMAC Pins HPS I2C_EMAC and MDIO Pins HPS I2C Pins HPS SPI Pins HPS UART Pins HPS Trace Pins Notes to Intel® Stratix® 10 HPS Pins
Power Supply Sharing Guidelines for Intel® Stratix® 10 Devices x
Example 1— Intel® Stratix® 10 GX Example 2— Intel® Stratix® 10 GX Example 3— Intel® Stratix® 10 GX (only for the HF35 Package) Example 4— Intel® Stratix® 10 GX (only for the HF35 Package) Example 5— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) Example 6— Intel® Stratix® 10 SX (–2L and –3X parts) Example 7— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) Example 8— Intel® Stratix® 10 SX (–2L and –3X parts) Example 9— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) (only for the HF35 Package) Example 10— Intel® Stratix® 10 SX (–2L and –3X parts) (only for the HF35 Package) Example 11— Intel® Stratix® 10 SX (–1V, –2V, and –3V parts) (only for the HF35 Package) Example 12— Intel® Stratix® 10 SX (–2L and –3X parts) (only for the HF35 Package) Example 13— Intel® Stratix® 10 MX (–1V, –2V, and –3V parts) Example 14— Intel® Stratix® 10 MX (–1V, –2V, and –3V parts) Example 15— Intel® Stratix® 10 MX (E-Tile) Example 16— Intel® Stratix® 10 TX (–1V, –2V, and –3V parts) Example 17— Intel® Stratix® 10 TX (–2L and –3X parts) Example 18— Intel® Stratix® 10 DX (–1V, –2V, and –3V parts) Example 19— Intel® Stratix® 10 GX 10M Example 20— Intel® Stratix® 10 GX 10M
Intel® Stratix® 10 Device Family Pin Connection Guidelines

Differential I/O Pins

Note: Intel recommends that you create an Intel® Quartus® Prime design, enter your device I/O assignments, and compile the design. The Intel® Quartus® Prime software will check your pin connections according to I/O assignment and placement rules. The rules differ from one device to another based on device density, package, I/O assignments, voltage assignments, and other factors that are not fully described in this document or the device handbook.
Table 6.  Differential I/O Pins
Note: The I/O pins are tri-stated with a weak pull-up during power up.
Pin Name ( Intel® Stratix® 10 Devices) Pin Name ( Intel® Stratix® 10 GX 10M Device) Pin Functions Pin Description Connection Guidelines

LVDS[2][A,B,C,D,E, F,G,H,I,J,K,L,M,N]_[1:24][p,n]

LVDS[3][A,B,C,D,E,F,G,H,I,J,K,L,M,N]_[1:24][p,n]

LVDS[2][A,B,C,F,G,H,I,J,K,L,M,N]U[1,2]_[1:24][p,n] LVDS[3][A,B,C,D,E,F,G,H,I,J,K,L]U[1,2]_[1:24][p,n] I/O, RX/TX channel These are true LVDS receiver and transmitter channels on column I/O banks. Each I/O pair can be configured as a LVDS receiver or a LVDS transmitter. Pins with a "p" suffix carry the positive signal for the differential channel. Pins with an "n" suffix carry the negative signal for the differential channel. If these pins are not used for differential signaling, these pins are available as user I/O pins. Connect unused pins as defined in the Intel® Quartus® Prime software.

DIFF_3[A,D]_[1:24][p,n]

— I/O

These I/O banks are only available in the HF35 package of the GX 400 (1SG040), SX 400 (1ST040), and TX 400 (1SX040) devices. These pins support 1.2V, 1.25V, 1.35V, 1.5V, and 1.8V I/O standard. The LVDS, RSDS, and mini-LVDS I/O standards are only supported in the dedicated clock pin. The LVDS SERDES and EMIF functions are not supported in these I/O banks.

Bank 3D of the GX 400 (1SG040) and SX 400 (1SX040) devices in the HF35 package has a maximum of 30 I/O pins only.

Connect unused pins as defined in the Intel® Quartus® Prime software.
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