220.127.116.11. R-Tiles Features and Capabilities 18.104.22.168. R-Tile Design Layout Examples 22.214.171.124. Landing Pad Cut-out Optimization of AC Coupling Capacitor 126.96.36.199. R-tile HSSI Breakout Routing in BGA Field Area and MCIO connector Pin Area 188.8.131.52. AC Coupling Capacitor Placement Around MCIO Connector 184.108.40.206. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
1.3.3. Reference Planes
- Make sure all high-speed signals reference to solid planes over the length of their routing (ground reference is preferred) and do not cross split planes.
- Use a layer topology of ground-signal-ground for high-speed signal routing to provide good isolation and reference.
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