Intel® Agilex™ Device Family High-Speed Serial Interface Signal Integrity Design Guidelines

ID 683864
Date 9/26/2022
Public
Document Table of Contents

1.3.8. Reference Stackup

The following figure is a PCIe* add-in card reference stackup example. With 18 layers, the total board thickness is 62 mils. It has two 1 oz power layers at the center of the stackup referenced to the two ground layers on each side. The card uses the ground-signal-ground layer pattern for all signal configurations and a dense weave (1078, 1035) prepreg and core for dielectric prepreg and core.

Figure 3. 18-layer Add-in Card Reference Stackup

Did you find the information on this page useful?

Characters remaining:

Feedback Message