1.3. PCB Materials and Stackup Design Guidelines
The PCB stackup is the substrate upon which all design components are assembled. A well-designed PCB stackup can maximize the electrical performance of signal transmissions, power delivery, manufacturability, and long-term reliability of the finished product.
You need to know the following to decide the required number of signal and power layers:
- Board thickness requirements
- Connector requirement. For example, gold finger.
- Mechanical limitations
- PCB manufacturing capability limitations
- Your critical devices and their placement requirements
- High-speed signal data rate and connection requirements
- External memory interface configuration requirements
- The power tree and power budget for each power rail
Did you find the information on this page useful?