Intel® Agilex™ Device Family High-Speed Serial Interface Signal Integrity Design Guidelines

ID 683864
Date 9/26/2022
Public
Document Table of Contents

1.3. PCB Materials and Stackup Design Guidelines

The PCB stackup is the substrate upon which all design components are assembled. A well-designed PCB stackup can maximize the electrical performance of signal transmissions, power delivery, manufacturability, and long-term reliability of the finished product.

You need to know the following to decide the required number of signal and power layers:

  • Board thickness requirements
  • Connector requirement. For example, gold finger.
  • Mechanical limitations
  • PCB manufacturing capability limitations
  • Your critical devices and their placement requirements
  • High-speed signal data rate and connection requirements
  • External memory interface configuration requirements
  • The power tree and power budget for each power rail

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