18.104.22.168. R-Tiles Features and Capabilities 22.214.171.124. R-Tile Design Layout Examples 126.96.36.199. Landing Pad Cut-out Optimization of AC Coupling Capacitor 188.8.131.52. R-tile HSSI Breakout Routing in BGA Field Area and MCIO connector Pin Area 184.108.40.206. AC Coupling Capacitor Placement Around MCIO Connector 220.127.116.11. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
1.4.1. General PCB Design Guidelines
Each component in a high-speed channel can impact the overall system performance. From end-to-end, these components are the device packages, PCB traces, PCB vias, connectors, cables, and landing pads of integrated circuit pins, connector pins, and alternating current (AC) coupling capacitor pins.
Did you find the information on this page useful?