126.96.36.199. R-Tiles Features and Capabilities 188.8.131.52. R-Tile Design Layout Examples 184.108.40.206. Landing Pad Cut-out Optimization of AC Coupling Capacitor 220.127.116.11. R-tile HSSI Breakout Routing in BGA Field Area and MCIO connector Pin Area 18.104.22.168. AC Coupling Capacitor Placement Around MCIO Connector 22.214.171.124. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
1.4.1. General PCB Design Guidelines
Each component in a high-speed channel can impact the overall system performance. From end-to-end, these components are the device packages, PCB traces, PCB vias, connectors, cables, and landing pads of integrated circuit pins, connector pins, and alternating current (AC) coupling capacitor pins.
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