Intel® Agilex™ Device Family High-Speed Serial Interface Signal Integrity Design Guidelines

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ID 683864
Date 9/26/2022
Public
Document Table of Contents
Document Table of Contents
1. Signal Integrity (SI) in High-Speed PCB Designs
1. Signal Integrity (SI) in High-Speed PCB Designs
1.1. Supported Protocols 1.2. Channel Insertion Loss (IL) Budget Calculation 1.3. PCB Materials and Stackup Design Guidelines 1.4. PCB Design Guidelines 1.5. Document Revision History for the Intel® Agilex™ Device Family High-Speed Serial Interface Signal Integrity Design Guidelines
1.3. PCB Materials and Stackup Design Guidelines
1.3.1. Mitigating Insertion Loss with Dielectric Material 1.3.2. Power Layers 1.3.3. Reference Planes 1.3.4. Layer Assignment 1.3.5. Impedance 1.3.6. Via Drill Size 1.3.7. Fiber Weave 1.3.8. Reference Stackup
1.4. PCB Design Guidelines
1.4.1. General PCB Design Guidelines 1.4.2. E-Tile PCB Design Guidelines 1.4.3. F-Tile PCB Design Guidelines 1.4.4. P-Tile PCB Design Guidelines 1.4.5. R-Tile PCB Guidelines
1.4.1. General PCB Design Guidelines
1.4.1.1. PCB Traces 1.4.1.2. PCB Vias 1.4.1.3. Connector Breakout 1.4.1.4. AC Coupling Capacitor 1.4.1.5. Others
1.4.3. F-Tile PCB Design Guidelines
1.4.3.1. F-Tile Features and Capabilities 1.4.3.2. Optimizing the Passive Channel 1.4.3.3. COM Simulations 1.4.3.4. Simulating the Active Channel
1.4.5. R-Tile PCB Guidelines
1.4.5.1. R-Tiles Features and Capabilities 1.4.5.2. R-Tile Design Layout Examples 1.4.5.3. Landing Pad Cut-out Optimization of AC Coupling Capacitor 1.4.5.4. R-tile HSSI Breakout Routing in BGA Field Area and MCIO connector Pin Area 1.4.5.5. AC Coupling Capacitor Placement Around MCIO Connector 1.4.5.6. PCIe Gen5 Add-in Card Edge Finger Breakout Design Guidelines
1. Signal Integrity (SI) in High-Speed PCB Designs

1.4.1.3. Connector Breakout

For high-speed routing, use the correct breakout orientation to avoid long stubs caused by the connector pin and PCB pad.

Figure 13. Connector Pin and PCB Pad ConnectionThis is a surface-mount, ground-signal-signal-ground connector pin interconnection with the PCB. The different layers in the stackup are indicated with different colors.

Optimize and tune the connector break-in and breakout to reach the target trace impedance and increase continuity. To accurately capture the interaction between the connector pin and PCB pad, co-simulate the connector-to-PCB interaction with connector structures integrated with the PCB by a 3D EM simulation tool.

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