Intel® Agilex™ FPGAs and SoCs Device Overview

ID 683458
Date 9/26/2022
Public
Document Table of Contents
1. Overview of the Intel® Agilex™ FPGAs and SoCs 2. Intel® Agilex™ FPGAs and SoCs Family Plan 3. Second Generation Intel® Hyperflex™ Core Architecture 4. Adaptive Logic Module in Intel® Agilex™ FPGAs and SoCs 5. Internal Embedded Memory in Intel® Agilex™ FPGAs and SoCs 6. Variable-Precision DSP in Intel® Agilex™ FPGAs and SoCs 7. Core Clock Network in Intel® Agilex™ FPGAs and SoCs 8. General Purpose I/Os in Intel® Agilex™ FPGAs and SoCs 9. I/O PLLs in Intel® Agilex™ FPGAs and SoCs 10. External Memory Interface in Intel® Agilex™ FPGAs and SoCs 11. Hard Processor System in Intel® Agilex™ SoCs 12. FPGA Transceivers in Intel® Agilex™ FPGAs and SoCs 13. Heterogeneous 3D Stacked HBM2E DRAM Memory in Intel® Agilex™ M-Series FPGAs and SoCs 14. High-Performance Crypto Blocks in Intel® Agilex™ F-Series and I-Series FPGAs and SoCs 15. MIPI* Protocols Support in Intel® Agilex™ D-Series FPGAs and SoCs 16. Balls Anywhere Package Design of Intel® Agilex™ D-Series FPGAs and SoCs 17. Configuration via Protocol Using PCIe* for Intel® Agilex™ FPGAs and SoCs 18. Device Configuration and the SDM in Intel® Agilex™ FPGAs and SoCs 19. Partial and Dynamic Configuration of Intel® Agilex™ FPGAs and SoCs 20. Device Security for Intel® Agilex™ FPGAs and SoCs 21. SEU Error Detection and Correction in Intel® Agilex™ FPGAs and SoCs 22. Power Management for Intel® Agilex™ FPGAs and SoCs 23. Intel® Software and Tools for Intel® Agilex™ FPGAs and SoCs 24. Revision History for the Intel® Agilex™ FPGAs and SoCs Device Overview

1. Overview of the Intel® Agilex™ FPGAs and SoCs

The Intel® Agilex™ FPGA and Soc device family leverages the full breadth of Intel innovation and manufacturing capability. Built with advanced Intel® 10-nm SuperFin1 and Intel® 7 2 technologies, and second-generation Intel® Hyperflex™ FPGA architecture, Intel® Agilex™ devices deliver around two times better fabric performance per watt compared to competing 7 nm FPGAs.

Intel® Agilex™ devices also offer integrated Arm* -based processors, transceivers up to 116 Gbps, PCI Express* ( PCIe* ) 5.0, and Compute Express Link* ( CXL* ). These features make Intel® Agilex™ devices ideal for a wide range of applications in many markets including data center, networking, broadcast, defense, and industrial.

  • System-in-package (SiP) chiplet architecture—provides tailored and flexible solutions by integrating heterogeneous technologies in a SiP for highly-specific applications. Using advanced 3D packaging technology, such as the Embedded Multi-die Interconnect Bridge (EMIB), Intel combines the traditional FPGA die with purpose-built semiconductor chiplet in a single device package.
  • Monolithic die architecture—provides higher system integration and lower power with smaller form factor packages.

The Intel® Agilex™ FPGAs and SoCs deliver on average 50% higher fabric performance and up to 40% lower total power consumption compared to previous generation Intel® FPGAs by leveraging these key innovations and techniques:

  • Intel® 10-nm SuperFin and Intel® 7 technologies
  • Second generation Intel® Hyperflex™ core architecture
  • High level of system integration
  • SmartVID, power islands, power gating, and other power reduction techniques
Note: The information contained in this document is preliminary and subject to change.
1 Applicable to Intel® Agilex™ F-Series and I-Series devices.
2 Applicable to Intel® Agilex™ M-Series and D-Series devices.

Did you find the information on this page useful?

Characters remaining:

Feedback Message