Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

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ID 769310
Date 9/05/2025
Public
Document Table of Contents
Document Table of Contents x
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series x
Electrical Characteristics
Electrical Characteristics x
Operating Conditions Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Agilex 7 FPGAs and SoCs Device Data Sheet: M-Series
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics
Recommended Operating Conditions x
Recommended Operating Conditions R-Tile Transceiver Power Supply Recommended Operating Conditions F-Tile Transceiver Power Supply Recommended Operating Conditions HPS Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption GPIO-B DC Characteristics HPS I/O DC Characteristics SDM I/O DC Characteristics I/O Standard Specifications
GPIO-B DC Characteristics x
GPIO-B I/O Pin Leakage Current GPIO-B OCT Calibration Accuracy Specifications GPIO-B OCT Without Calibration Resistance Tolerance Specifications GPIO-B Pin Capacitance GPIO-B Internal Weak Pull-Up Resistor
HPS I/O DC Characteristics x
HPS I/O Pin Leakage Current HPS I/O Pin Capacitance HPS I/O Internal Weak Pull-Up Resistor HPS I/O Hysteresis Specifications for Schmitt Trigger Input
SDM I/O DC Characteristics x
SDM I/O Pin Leakage Current SDM I/O Pin Capacitance SDM I/O Internal Weak Pull-Up Resistor SDM I/O Hysteresis Specifications for Schmitt Trigger Input
I/O Standard Specifications x
GPIO-B I/O Standard Specifications HPS I/O Standard Specifications SDM I/O Standard Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications R-Tile Transceiver Performance Specifications F-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications I/O PLL Specifications DSP Block Specifications Memory Block Specifications Local Temperature Sensor Specifications Remote Temperature Diode Specifications Voltage Sensor Specifications
Periphery Performance Specifications x
LVDS SERDES Specifications DPA Lock Time Specifications LVDS SERDES Soft-CDR Sinusoidal Jitter Tolerance Specifications Memory Standards Supported Memory Output Clock Jitter Specifications Performance Specifications of the HBM2E Interface Performance Specifications of Network on Chip (NoC) NOC Reference Clock Requirements
R-Tile Transceiver Performance Specifications x
R-Tile Transceiver Performance R-Tile Transceiver Reference Clock Specifications R-Tile Transmitter Specifications R-Tile Receiver Specifications
F-Tile Transceiver Performance Specifications x
F-Tile Transceiver Performance F-Tile Transceiver Reference Clock Specifications F-Tile Transmitter Specifications F-Tile Receiver Specifications F-Tile Electrical Compliance
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® Streaming Configuration Timing Configuration Bit Stream Sizes
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

Remote Temperature Diode Specifications

Note the following for the remote temperature diode specifications:
  • The temperature diode characteristics in this table target for three-currents temperature sensing chip implementation. The characteristics can also apply to two-currents temperature sensing chip implementation.
  • Absolute accuracy is dependent on third-party external diode ADC and integration specifics.
Table 41.  Remote Temperature Diode Specifications (Core Fabric TSD) For specification status, see the Data Sheet Status table
Description Minimum Typical Maximum Unit
Ibias, diode source current 30 — 170 μA
Vbias, voltage across diode 0.48 — 0.82 V
Series resistance — — <10 Ω
Diode ideality factor — 1.00672 — —
Table 42.  Remote Temperature Diode Specifications (R-Tile TSD) For specification status, see the Data Sheet Status table
Description Minimum Typical Maximum Unit
Ibias, diode source current 30 — 170 μA
Vbias, voltage across diode 0.48 — 0.82 V
Series resistance — — <10 Ω
Diode ideality factor — 1.00173 — —
Table 43.  Remote Temperature Diode Specifications (F-Tile TSD) For specification status, see the Data Sheet Status table
Description Minimum Typical Maximum Unit
Ibias, diode source current 30 — 170 μA
Vbias, voltage across diode 0.48 — 0.83 V
Series resistance — — <10 Ω
Diode ideality factor — 1.00674 — —
72 When using lower injection current (two-currents) implementation, the ideality factor is 1.022.
73 When using lower injection current (two-currents) implementation, the ideality factor is 1.010.
74 When using lower injection current (two-currents) implementation, the ideality factor is 1.018.
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