Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

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ID 769310
Date 9/05/2025
Public
Document Table of Contents
Document Table of Contents x
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series x
Electrical Characteristics
Electrical Characteristics x
Operating Conditions Switching Characteristics Configuration Specifications I/O Timing Programmable IOE Delay Glossary Document Revision History for the Agilex 7 FPGAs and SoCs Device Data Sheet: M-Series
Operating Conditions x
Absolute Maximum Ratings Maximum Allowed Overshoot and Undershoot Voltage Recommended Operating Conditions DC Characteristics
Recommended Operating Conditions x
Recommended Operating Conditions R-Tile Transceiver Power Supply Recommended Operating Conditions F-Tile Transceiver Power Supply Recommended Operating Conditions HPS Power Supply Operating Conditions
DC Characteristics x
Supply Current and Power Consumption GPIO-B DC Characteristics HPS I/O DC Characteristics SDM I/O DC Characteristics I/O Standard Specifications
GPIO-B DC Characteristics x
GPIO-B I/O Pin Leakage Current GPIO-B OCT Calibration Accuracy Specifications GPIO-B OCT Without Calibration Resistance Tolerance Specifications GPIO-B Pin Capacitance GPIO-B Internal Weak Pull-Up Resistor
HPS I/O DC Characteristics x
HPS I/O Pin Leakage Current HPS I/O Pin Capacitance HPS I/O Internal Weak Pull-Up Resistor HPS I/O Hysteresis Specifications for Schmitt Trigger Input
SDM I/O DC Characteristics x
SDM I/O Pin Leakage Current SDM I/O Pin Capacitance SDM I/O Internal Weak Pull-Up Resistor SDM I/O Hysteresis Specifications for Schmitt Trigger Input
I/O Standard Specifications x
GPIO-B I/O Standard Specifications HPS I/O Standard Specifications SDM I/O Standard Specifications
Switching Characteristics x
Core Performance Specifications Periphery Performance Specifications R-Tile Transceiver Performance Specifications F-Tile Transceiver Performance Specifications HPS Performance Specifications
Core Performance Specifications x
Clock Tree Specifications I/O PLL Specifications DSP Block Specifications Memory Block Specifications Local Temperature Sensor Specifications Remote Temperature Diode Specifications Voltage Sensor Specifications
Periphery Performance Specifications x
LVDS SERDES Specifications DPA Lock Time Specifications LVDS SERDES Soft-CDR Sinusoidal Jitter Tolerance Specifications Memory Standards Supported Memory Output Clock Jitter Specifications Performance Specifications of the HBM2E Interface Performance Specifications of Network on Chip (NoC) NOC Reference Clock Requirements
R-Tile Transceiver Performance Specifications x
R-Tile Transceiver Performance R-Tile Transceiver Reference Clock Specifications R-Tile Transmitter Specifications R-Tile Receiver Specifications
F-Tile Transceiver Performance Specifications x
F-Tile Transceiver Performance F-Tile Transceiver Reference Clock Specifications F-Tile Transmitter Specifications F-Tile Receiver Specifications F-Tile Electrical Compliance
HPS Performance Specifications x
HPS Clock Performance HPS Internal Oscillator Frequency HPS PLL Specifications HPS Cold Reset HPS SPI Timing Characteristics HPS SD/MMC Timing Characteristics HPS USB UPLI Timing Characteristics HPS Ethernet Media Access Controller (EMAC) Timing Characteristics HPS I2C Timing Characteristics HPS NAND Timing Characteristics HPS Trace Timing Characteristics HPS GPIO Interface HPS JTAG Timing Characteristics HPS Programmable I/O Timing Characteristics
Configuration Specifications x
General Configuration Timing Specifications POR Specifications External Configuration Clock Source Requirements JTAG Configuration Timing AS Configuration Timing Avalon® Streaming Configuration Timing Configuration Bit Stream Sizes
Agilex™ 7 FPGAs and SoCs Device Data Sheet: M-Series

F-Tile Transceiver Reference Clock Specifications

Table 60.  F-Tile FHT Reference Clock Requirements For specification status, see the Data Sheet Status table
Parameter Description Condition Minimum Typical Maximum Unit
Frequency Reference clock frequency — 100 156.25 200 MHz
Frequency accuracy Frequency accuracy of the reference clock, including temperature variability, aging, and initial variation — — — ±100 ppm
Single sideband phase noise Measured SSB phase noise including spurs must be smaller than phase noise mask100 10 kHz — — –130 dB
100 kHz — — –138 dB
500 kHz — — –138 dB
3 MHz — — –140 dB
10 MHz — — –144 dB
20 MHz — — –146 dB
1 GHz — — –146 101 dB
Integrated RMS jitter Integrated over 10 kHz – 20 MHz, include spurious — — — 522 fs
Table 61.  F-Tile FHT Reference Clocks Input Specifications

LVDS is recommended with on-board 100 nF AC-coupling capacitor.

For specification status, see the Data Sheet Status table
Parameter Description Condition Minimum Typical Maximum Unit
TREF-DUTY Duty cycle — 45 50 55 %
TREF-RISE/FALL Rising and falling edge rate 20% – 80% 40 — 300 ps
TREF-SINGLEEND-SKEW Skew between REFCLKP and REFCLKN — — — 5 ps
ZREF-SINGLEEND-DC Reference clock input impedance – terminated mode — 40 50 60 Ω
VREFIN-SE-PP Input reference clock single-ended peak-to-peak voltage — 200 — 510 mV
VREFIN-CM-AC Input reference clock common-mode voltage when AC-coupled on board  — Set on-chip (no user access) —
VREFIN-IL-DC Input reference clock input low voltage when DC-coupled on board — 0.1 — — V
VREFIN-IH-DC Input reference clock input high voltage when DC-coupled on board  — — — 0.9 V
Table 62.  F-Tile FGT Reference Clock Input Specifications For specification status, see the Data Sheet Status table
Parameter Description Condition Minimum Typical Maximum Unit
Supported I/O standards — Dedicated reference clock pin CML, HCSL
FREF Reference clock operating frequency — 100102 — 380 MHz
TREF-DUTY Duty cycle — 45 50 55 %
TREF-RISE/FALL Rising and falling edge rate 20% – 80% — — 0.15 × Tref_period ps
TREF-SINGLEEND-SKEW Skew between REFCLKP and REFCLKN — — — 50 ps
ZREF-DIFF-DC 103 Reference clock differential input impedance – terminated mode — 80 100 120 Ω
VREFIN-DIFF 104 Input reference clock differential peak-to-peak voltage — 0.6 1.2 1.7 V
VREFIN-IL-DC Input reference clock input low voltage when DC-coupled on board — 0 — — V
VREFIN-IH-DC Input reference clock input high voltage when DC-coupled on board    — — — 1 V
VREFIN-CM-AC Input reference clock common-mode voltage when AC-coupled on board — Set on-chip (no user access) V
VREFIN-CM-DC Input reference clock common-mode voltage when DC-coupled on board — 0.2 — 0.8 V
PNREF-SSB (156.25MHz) Reference clock measured single sideband phase noise mask including spurs must be smaller than phase noise mask 105 10 kHz — — –130 dBc/Hz
100 kHz — — –138 dBc/Hz
500 kHz — — –138 dBc/Hz
3 MHz — — –140 dBc/Hz
10 MHz — — –144 dBc/Hz
20 MHz — — –146 dBc/Hz
1 GHz — — –146 dBc/Hz
VREFIN-RJ-RMS RMS jitter integrated from 10 kHz – 20 MHz including spurs — — — 522 fs
VREFIN-PPM-ERROR Reference clock frequency error — –350 + SSC — +350 + SSC ppm
Figure 4. Simplified F-Tile FGT Reference Clock Input Buffer
Table 63.  F-Tile FGT Reference Clock Output Driver Specifications For specification status, see the Data Sheet Status table
Parameter Description Condition Minimum Typical Maximum Unit
FREF_OUT Reference clock operating frequency — 25 — 800 MHz
TREF-DUTY_OUT Duty cycle — 45 50 55 %
TREF-RISE_OUT/FALL_OUT Rising and falling edge rate 20% – 80% — — 0.15 × Tref_period ps
TREF-SINGLEEND-SKEW Skew between REFCLKP and REFCLKN — — — 50 ps
ZREF-DIFF-DC_OUT Reference clock differential output impedance – terminated mode — 80 100 120 Ω
VREFIN-DIFF-AC_OUT Output reference clock differential peak to peak voltage when AC-coupled on board — 0.9 1 1.1 V
VREFIN-CM-OUT 106 Output reference clock common-mode — 0.45 0.5 0.55 V
100 Add an offset of 20 × log10(Fclk/156.25 MHz) dB to mask values, where Fclk is reference clock frequency.
101 The phase noise mask requirement between 20 MHz and 1 GHz excludes any harmonics power of the fundamental clock.
102 This value is 100 MHz for down SSC (Spread Spectrum Clocking) clocking. This value can also be 25 MHz for HDMI rate of less than 1 Gbps.
103 These termination resistors are part of the reference clock input buffer on-chip, and are always present and no external termination or DC biasing is needed if AC-coupled on board. If DC-coupled on board, external biasing is not required unless a signaling standard other than differential 100 Ω termination is required.
104 LVDS is recommended with on-board AC-coupling and subject to 0.6 V ≤ VREFIN-DIFF ≤ 1.7 V.
105 Add an offset of 20 × log10(Fclk/156.25 MHz) dB to mask values, where Fclk is reference clock frequency.
106 If your far-end differential termination is comprised of two 50 Ω terminations to GND, the common-mode voltage is nominally 250 mV. If your far-end differential termination is comprised of a single 100 Ω differential termination between the P and N signals, the common-mode voltage is nominally 500 mV.
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