AN 307: Intel® FPGA Design Flow for Xilinx* Users

ID 683562
Date 3/20/2018
Public

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2.1. Intel® FPGAs

Intel® FPGAs are ideal for a wide variety of applications, from high-volume applications to state-of-the-art products. Each FPGA series include different features, such as embedded memory, digital signal processing (DSP) blocks, high-speed transceivers, or high-speed I/O pins, to cover a broad range of end products. Intel® has four classes of FPGAs to meet market needs from the industry’s highest density and performance to the most cost effective:

  • Stratix® FPGA and SoC family enables you to deliver high-performance, state-of-the-art products to market faster with lower risk and higher productivity
  • Arria® family delivers optimal performance and power efficiency in the midrange.
  • Cyclone® FPGA series is built to meet your low-power, cost-sensitive design needs, enabling you to get to market faster.

The latest Intel® Stratix® 10 FPGAs and SoCs are built on the Intel® ’s 14 nm Tri-Gate process, and introduces the heterogenous 3D system-in-package (SiP) technology. The SiP technology enables in-package integration of a range of components such as analog, memory, ASIC, CPU, etc. while keeping the FPGA fabric monolithic. In addition, Intel® Stratix® 10 FPGAs integrate transceiver die or tiles from different process nodes in the same package. This unique solution addresses these challenges: higher bandwidth, lower power, smaller form factor, and increased functionality and flexibility. For more information about SiP, refer to the Enabling Next-Generation Platforms Using Intel® ’s 3D System-in-Package Technology white paper.

Intel® SoCs bring high integration and advanced system, power, and security management capabilities to Intel® ’s product portfolio. Industry-standard Arm* tools, along with a broad ecosystem of operating systems and development tools, support Intel® SoCs.