AN 307: Intel® FPGA Design Flow for Xilinx* Users

Download PDF
ID 683562
Date 3/20/2018
Public

A newer version of this document is available. Customers should click here to go to the newest version.

Document Table of Contents
Document Table of Contents x
1. Introduction to Intel® FPGA Design Flow for Xilinx* Users 2. Technology Comparison 3. FPGA Tools Comparison 4. Xilinx* to Intel® FPGA Design Conversion 5. Conclusion 6. Document Revision History for Intel® FPGA Design Flow for Xilinx* Users
2. Technology Comparison x
2.1. Intel® FPGAs 2.2. Xilinx* FPGAs 2.3. Comparison Table 2.4. Intel® FPGA Device Features
3. FPGA Tools Comparison x
3.1. Hardware and Software Tools for FPGA Design 3.2. FPGA Design Flow Using Command Line Scripting 3.3. FPGA Design Flow Using Tools with GUIs 3.4. Additional Intel® Quartus® Prime Pro Edition Features
3.2. FPGA Design Flow Using Command Line Scripting x
3.2.1. Command-Line Executable Equivalents 3.2.2. Programming and Configuration File Support in the Intel® Quartus® Prime Pro Edition Software
3.2.1. Command-Line Executable Equivalents x
3.2.1.1. synth_design 3.2.1.2. place_design/route_design 3.2.1.3. report_timing 3.2.1.4. write_bitstream 3.2.1.5. write_sdf/write_verilog/write_vhdl 3.2.1.6. report_power 3.2.1.7. write_checkpoint 3.2.1.8. Run Complete Design Flow
3.3. FPGA Design Flow Using Tools with GUIs x
3.3.1. Project Creation 3.3.2. Design Entry 3.3.3. IP Status 3.3.4. Design Constraints 3.3.5. Synthesis 3.3.6. Design Implementation 3.3.7. Finalize Pinout 3.3.8. Viewing and Editing Design Placement 3.3.9. Static Timing Analysis 3.3.10. Generation of Device Programming Files 3.3.11. Power Analysis 3.3.12. Simulation 3.3.13. Hardware Verification 3.3.14. View Netlist 3.3.15. Design Optimization 3.3.16. Techniques to Improve Productivity 3.3.17. Cross-Probing in the Intel® Quartus® Prime Pro Edition Software
3.3.2. Design Entry x
3.3.2.1. HDL Editor 3.3.2.2. Schematic/Block Editor 3.3.2.3. State Machine Editor 3.3.2.4. IP Catalog and Parameter Editor 3.3.2.5. Platform Designer System Integration Tool 3.3.2.6. Platform Designer Component Editor
3.3.4. Design Constraints x
3.3.4.1. Assignment Editor 3.3.4.2. Create Timing Constraints with the Timing Analyzer GUI 3.3.4.3. Create Timing Constraints with the Timing Analyzer Text Editor
3.3.7. Finalize Pinout x
3.3.7.1. Pin Planner 3.3.7.2. Interface Planner
3.3.12. Simulation x
3.3.12.1. Simulation Models for Designs Containing LPMs or IP Cores
3.3.13. Hardware Verification x
3.3.13.1. System Console 3.3.13.2. Signal Tap Logic Analyzer 3.3.13.3. In-System Sources and Probes 3.3.13.4. Transceiver Toolkit 3.3.13.5. EMIF Debug Toolkit 3.3.13.6. Remote Debugging 3.3.13.7. Other Intel® FPGA Debugging Tools
3.3.14. View Netlist x
3.3.14.1. RTL Viewer 3.3.14.2. Technology Map Viewer
3.3.15. Design Optimization x
3.3.15.1. Hyper-Aware Design Flow 3.3.15.2. Physical Synthesis Optimization
3.3.16. Techniques to Improve Productivity x
3.3.16.1. Rapid Recompile 3.3.16.2. Block-Based Design Flow 3.3.16.3. Design Space Explorer II
3.4. Additional Intel® Quartus® Prime Pro Edition Features x
3.4.1. Scripting with Tcl in the Intel® Quartus® Prime Pro Edition Software
3.4.1. Scripting with Tcl in the Intel® Quartus® Prime Pro Edition Software x
3.4.1.1. Running Scripts from the DOS or UNIX Prompt 3.4.1.2. Running Scripts in Batch Mode from a Shell 3.4.1.3. Running Tcl Commands Directly from the Command Line 3.4.1.4. Running Tcl Commands Interactively from the Shell 3.4.1.5. The Intel® Quartus® Prime Tcl Console Window
4. Xilinx* to Intel® FPGA Design Conversion x
4.1. Replacing Xilinx* Primitives 4.2. Converting IP Cores 4.3. Setting Equivalent Xilinx* Design Constraints 4.4. Setting Up the Simulation Environment
4.1. Replacing Xilinx* Primitives x
4.1.1. Converting I/O Buffers 4.1.2. Changing Default I/O Standard for Pins
4.1.1. Converting I/O Buffers x
4.1.1.1. Example of Converting I/O Buffer
4.2. Converting IP Cores x
4.2.1. Converting Memory Blocks 4.2.2. Converting Mixed-Mode Clock Manager (MMCM) to Phase-Locked Loop (PLL) 4.2.3. Converting Multipliers
4.2.1. Converting Memory Blocks x
4.2.1.1. Embedded Memory Blocks 4.2.1.2. Differences Between Xilinx* Memory and Intel® FPGA Memory 4.2.1.3. Determining Memory Block and Mapping Ports 4.2.1.4. Memory Port Mapping 4.2.1.5. Example: Converting Simple Dual-Port RAM
4.2.1.2. Differences Between Xilinx* Memory and Intel® FPGA Memory x
4.2.1.2.1. Memory Mode 4.2.1.2.2. Clocking Mode 4.2.1.2.3. Write and Read Operation Triggering 4.2.1.2.4. Read-During-Write Operation at the Same Address 4.2.1.2.5. Error Correction Code (ECC) 4.2.1.2.6. Byte Enable 4.2.1.2.7. Address Clock Enable 4.2.1.2.8. Parity Bit Support 4.2.1.2.9. Memory Initialization 4.2.1.2.10. Output Synchronous Set/Reset
4.2.2. Converting Mixed-Mode Clock Manager (MMCM) to Phase-Locked Loop (PLL) x
4.2.2.1. Feature Comparison 4.2.2.2. Port Mapping Reference 4.2.2.3. Example: Converting Xilinx* MMCM into an Intel® PLL
4.2.3. Converting Multipliers x
4.2.3.1. Feature Comparison 4.2.3.2. Port Mapping 4.2.3.3. Example: Converting to the LPM_MULT IP Core 4.2.3.4. Example: Converting to the Intel® FPGA Multiply Adder IP core
4.3. Setting Equivalent Xilinx* Design Constraints x
4.3.1. Device Constraints 4.3.2. Placement Constraints 4.3.3. Timing Constraints 4.3.4. Retimer Constraints
4.3.1. Device Constraints x
4.3.1.1. DRIVE 4.3.1.2. SLEW 4.3.1.3. IOB 4.3.1.4. IOSTANDARD 4.3.1.5. KEEP
4.3.2. Placement Constraints x
4.3.2.1. PBLOCK 4.3.2.2. PACKAGE_PIN 4.3.2.3. LOC & BEL 4.3.2.4. PROHIBIT
4.3.2.1. PBLOCK x
4.3.2.1.1. Differences Between PBLOCK and Logic Lock Regions
4.3.3. Timing Constraints x
4.3.3.1. set_clock_groups
4.4. Setting Up the Simulation Environment x
4.4.1. Simulation Levels 4.4.2. HDL Support for EDA Simulators 4.4.3. Value Change Dump (VCD) Support 4.4.4. Simulating Intel FPGA IP Cores
1. Introduction to Intel® FPGA Design Flow for Xilinx* Users
2. Technology Comparison
3. FPGA Tools Comparison
4. Xilinx* to Intel® FPGA Design Conversion
5. Conclusion
6. Document Revision History for Intel® FPGA Design Flow for Xilinx* Users

2.2. Xilinx* FPGAs

Xilinx* UltraScale+* family of FPGAs, 3D ICs and MPSoCs are built on TSMC’s 16nm process and use a homogeneous integration technology which breaks the FPGA fabric into multiple dice. This approach uses Stacked1 Silicon Interconnect (SSI) to connect the die tiles. For more information refer to the Xilinx* website.

Related Information
1 Horizontal stacking of the die on an interposer
Level Two Title