AN 307: Intel® FPGA Design Flow for Xilinx* Users

ID 683562
Date 3/20/2018

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2.2. Xilinx* FPGAs

Xilinx* UltraScale+* family of FPGAs, 3D ICs and MPSoCs are built on TSMC’s 16nm process and use a homogeneous integration technology which breaks the FPGA fabric into multiple dice. This approach uses Stacked1 Silicon Interconnect (SSI) to connect the die tiles. For more information refer to the Xilinx* website.

1 Horizontal stacking of the die on an interposer